| Patent application number | Description | Published |
|---|
| 20080308877 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE - A semiconductor device includes a semiconductor substrate; a first gate insulation film formed on the semiconductor substrate; a second gate insulation film formed on the semiconductor substrate; a first gate electrode formed on the first gate insulation film and fully silicided; and a second gate electrode formed on the second gate insulation film and fully silicided, a gate length or a gate width of the second gate electrode being larger than that of the first gate electrode, and a thickness of the second gate electrode being smaller than that of the first gate electrode. | 12-18-2008 |
| 20090008727 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - It is made possible to reduce the interface resistance at the interface between the nickel silicide film and the silicon. A semiconductor manufacturing method includes: forming an impurity region on a silicon substrate, with impurities being introduced into the impurity region; depositing a Ni layer so as to cover the impurity region; changing the surface of the impurity region into a NiSi | 01-08-2009 |
| 20090083202 | SEMICONDUCTOR STORAGE DEVICE - A semiconductor storage device includes a storage part including a plurality of nonvolatile semiconductor memory cells each having a conductive path, a charge storage layer and a control gate electrode. The device further includes a plurality of first input terminals each connected to one end of the conductive path of each nonvolatile semiconductor memory cell, a plurality of second input terminals each connected to the control gate of each nonvolatile semiconductor memory cell, and an output end connected to the other ends of the conductive paths of the plurality of nonvolatile semiconductor memory cells, respectively. | 03-26-2009 |
| 20090186474 | Nonvolatile semiconductor storage device and manufacturing method therefor - A nonvolatile semiconductor storage device includes a semiconductor substrate; a plurality of isolation regions formed in the semiconductor substrate; an element-forming region formed between adjacent isolation regions; a first gate insulating film provided on the element-forming region; a floating gate electrode which is provided on the first gate insulating film and in which a width of a lower hem facing the element-forming region is narrower than a width of the element-forming region in a section taken in a direction perpendicular to a direction in which the isolation regions extend; a second gate insulating film provided on the floating gate electrode; and a control gate electrode provided on the second gate insulating film. | 07-23-2009 |
| 20090250742 | NEURON DEVICE - A neuron device includes: a semiconductor layer; source and drain regions formed in the semiconductor layer at a distance from each other; a protection film formed on an upper face of the semiconductor layer; a channel region formed in the semiconductor layer between the source region and the drain region; a pair of gate insulating films formed on two side faces of the channel region; a floating gate electrode including: a first portion covered on the gate insulating films and the protection film; a second portion connected to the first portion; and a third portion provided on the substrate so as to connect to the end portion of the second portion on the opposite side from the first portion; an interelectrode insulating film provided on the first to third portions; and a plurality of control gate electrodes provided on the third portion. | 10-08-2009 |
| 20100062575 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE - A semiconductor device includes a semiconductor substrate; a first gate insulation film formed on the semiconductor substrate; a second gate insulation film formed on the semiconductor substrate; a first gate electrode formed on the first gate insulation film and fully silicided; and a second gate electrode formed on the second gate insulation film and fully silicided, a gate length or a gate width of the second gate electrode being larger than that of the first gate electrode, and a thickness of the second gate electrode being smaller than that of the first gate electrode. | 03-11-2010 |
| 20100224916 | SEMICONDUCTOR DEVICE - It is made possible to optimize the effective work function of the metal for a junction and suppress the resistance as far as possible at the interface between a semiconductor or a dielectric material and a metal. A semiconductor device includes: a semiconductor film; a Ti oxide film formed on the semiconductor film, and including at least one element selected from the group consisting of V, Cr, Mn, Fe, Co, Ni, Nb, Mo, Tc, Ru, Rh, Pd, Ta, W, Re, Os, Ir, and Pt; and a metal film formed on the Ti oxide film. | 09-09-2010 |
| 20100270607 | NONVOLATILE SEMICONDUCTOR MEMORY DEVICE AND METHOD FOR MANUFACTURING THE SAME - It is made possible to provide a memory device that can be made very small in size and have a high capacity while being able to effectively suppress short-channel effects. A nonvolatile semiconductor memory device includes: a first insulating film formed on a semiconductor substrate; a semiconductor layer formed above the semiconductor substrate so that the first insulating film is interposed between the semiconductor layer and the semiconductor substrate; a NAND cell having a plurality of memory cell transistors connected in series, each of the memory cell transistors having a gate insulating film formed on the semiconductor layer, a floating gate formed on the gate insulating film, a second insulating film formed on the floating gate, and a control gate formed on the second insulating film; a source region having an impurity diffusion layer formed in one side of the NAND cell; and a drain region having a metal electrode formed in the other side of the NAND cell. | 10-28-2010 |
