| Patent application number | Description | Published |
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| 20080226049 | LOCATION BASED MIXER PRIORITIES IN CONFERENCES - In one embodiment, a method includes identifying a plurality of locations associated with a conference system that has a conference server and a mixer, and prioritizing the locations by assigning a first priority to at least a first location and assigning a second priority to a second location. The second priority is lower than the first priority. The method also includes processing received media streams such that media streams received from endpoints associated with the first location are processed as having a higher priority than media streams received from endpoints associated with the second location. | 09-18-2008 |
| 20080235337 | Adaptive buddy lists - In one embodiment, a method can include: (i) monitoring for a buddy relevant event; (ii) deriving a buddy list portion from the buddy relevant event; (iii) determining presence information for each member in the buddy list portion; and (iv) updating an adaptive buddy list using the buddy list portion and the presence information. | 09-25-2008 |
| 20080279159 | METHODS AND APPARATUS FOR EFFICIENT MPEG TRANSMISSION OVER 802.11 - In one embodiment, a method includes characterizing a first packet of a video stream as being associated with a first frame type, wherein the video stream is arranged to be transmitted on a wireless local area network. The method also includes processing at least the first packet of the video stream as being associated with the first frame type if the first packet of the video stream is characterized as being of the first frame type. | 11-13-2008 |
| 20090100468 | FACILITATING REAL-TIME TRIGGERS IN ASSOCIATION WITH MEDIA STREAMS - In one embodiment, a Media Analysis and Delivery System obtains a set of media delivery rules, wherein the set of media delivery rules includes one or more triggers, each of the triggers identifying a topic of interest. The Media Analysis and Delivery System examines a media stream for at least one of the one or more triggers in accordance with the set of media delivery rules. The Media Analysis and Delivery System provides at least a portion of the media stream in response to at least one of the triggers in accordance with at least one of the set of media delivery rules. | 04-16-2009 |
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| 20100068837 | Structures and Methods for Wafer Packages, and Probes - This document describes the fabrication and use of multilayer ceramic substrates, having one or more levels of internal thick film metal conductor patterns, wherein any or all of the metal vias intersecting one or both of the major surface planes of the substrates, extend out of the surface to be used for making flexible, temporary or permanent interconnections, to terminals of an electronic component. Such structures are useful for wafer probing, and for packaging, of semiconductor devices. In some embodiments, such structures are shown to be useful for simultaneously testing multiple devices on a semiconductor wafer, or for assembling multiple substrates on to a wafer, to accomplish both testing and packaging of the dies on the wafer. In yet another embodiment of the invention, single or multilevel ceramic interconnect structures with thick film metal conductors, are fabricated right on the product wafer to facilitate economical testing and packaging of the dies on the wafer. | 03-18-2010 |
| 20100090339 | Structures and Methods for Wafer Packages, and Probes - This document describes the fabrication and use of multilayer ceramic substrates, having one or more levels of internal thick film metal conductor patterns, wherein any or all of the metal vias intersecting one or both of the major surface planes of the substrates, extend out of the surface to be used for making flexible, temporary or permanent interconnections, to terminals of an electronic component. Such structures are useful for wafer probing, and for packaging, of semiconductor devices. In some embodiments, such structures are shown to be useful for simultaneously testing multiple devices on a semiconductor wafer, or for assembling multiple substrates on to a wafer, to accomplish both testing and packaging of the dies on the wafer. In yet another embodiment of the invention, single or multilevel ceramic interconnect structures with thick film metal conductors, are fabricated right on the product wafer to facilitate economical testing and packaging of the dies on the wafer. | 04-15-2010 |
