Inventors list |
Assignees list |
Classification tree browser |
Top 100 Inventors |
Top 100 Assignees |
Ashish Shah
Ashish Shah, Milpitas, CA US
| Patent application number | Description | Published |
|---|---|---|
| 20090002528 | HIGH DYNAMIC RANGE SENSOR WITH BLOOMING DRAIN - An image sensor has at least two photodiodes in each unit pixel. A high dynamic range is achieved by selecting different exposure times for the photodiodes. Additionally, blooming is reduced. The readout timing cycle is chosen so that the short exposure time photodiodes act as drains for excess charge overflowing from the long exposure time photodiodes. To improve draining of excess charge, the arrangement of photodiodes may be further selected so that long exposure time photodiodes are neighbored along vertical and horizontal directions by short exposure time photodiodes. A micro-lens array may also be provided in which light is preferentially coupled to the long exposure time photodiodes to improve sensitivity. | 01-01-2009 |
| 20090200452 | IMAGE SENSOR WITH BURIED SELF ALIGNED FOCUSING ELEMENT - An image sensor includes an optical sensor region, a stack of dielectric and metal layers, and a buried focusing layer. The optical sensor is disposed within a semiconductor substrate. The stack of dielectric and metal layers are disposed on the semiconductor substrate above the optical sensor region. The metal layers include optical pass-throughs aligned to expose an optical path through the stack form a top dielectric layer through to the optical sensor region. The buried focusing layer is disposed over a conforming metal layer of the metal layers within the stack. The buried focusing layer includes a curved surface conformed by the optical pass-through of the conforming metal layer to focus light onto the optical sensor region. | 08-13-2009 |
| 20090200622 | SELF-ALIGNED FILTER FOR AN IMAGE SENSOR - An image sensor includes at least one photosensitive element disposed in a semiconductor substrate. Metal conductors may be disposed on the semiconductor substrate. A filter may be disposed between at least two individual metal conductors and a micro-lens may be disposed on the filter. There may be insulator material disposed between the metal conductors and the semiconductor substrate and/or between individual metal conductors. The insulator material may be removed so that the filter may be disposed on the semiconductor substrate. | 08-13-2009 |
| 20100038523 | IMAGE SENSOR WITH BURIED SELF ALIGNED FOCUSING ELEMENT - An image sensor includes an optical sensor region, a stack of dielectric and metal layers, and an embedded layer. The optical sensor is disposed within a semiconductor substrate. The stack of dielectric and metal layers are disposed on the front side of the semiconductor substrate above the optical sensor region. The embedded focusing layer is disposed on the backside of the semiconductor substrate in a Backside Illuminated (BSI) image sensor, supported by a support grid, or a support grid composed of the semiconductor substrate. | 02-18-2010 |
| 20100271524 | MULTILAYER IMAGE SENSOR PIXEL STRUCTURE FOR REDUCING CROSSTALK - An image sensor pixel includes a substrate, a first epitaxial layer, a collector layer, a second epitaxial layer and a light collection region. The substrate is doped to have a first conductivity type. The first epitaxial layer is disposed over the substrate and doped to have the first conductivity type as well. The collector layer is selectively disposed over at least a portion of the first epitaxial layer and doped to have a second conductivity type. The second epitaxial layer is disposed over the collector layer and doped to have the first conductivity type. The light collection region collects photo-generated charge carriers and is disposed within the second epitaxial layer. The light collection region is also doped to have the second conductivity type. | 10-28-2010 |
| 20110085067 | MULTILAYER IMAGE SENSOR PIXEL STRUCTURE FOR REDUCING CROSSTALK - An image sensor pixel includes a substrate, a first epitaxial layer, a collector layer, a second epitaxial layer and a light collection region. The substrate is doped to have a first conductivity type. The first epitaxial layer is disposed over the substrate and doped to have the first conductivity type as well. The collector layer is selectively disposed over at least a portion of the first epitaxial layer and doped to have a second conductivity type. The second epitaxial layer is disposed over the collector layer and doped to have the first conductivity type. The light collection region collects photo-generated charge carriers and is disposed within the second epitaxial layer. The light collection region is also doped to have the second conductivity type. | 04-14-2011 |
Ashish Shah, East Amherst, NY US
| Patent application number | Description | Published |
|---|---|---|
| 20090081552 | ELECTROCHEMICAL CELL WITH TIGHTLY HELD ELECTRODE ASSEMBLY - An electrochemical cell comprising a conductive casing housing an electrode assembly provided with a stack holder surrounding the electrode assembly is described. The stack holder is of an elastic material that serves to maintain the anode and cathode in a face-to-face alignment throughout discharge. This is particularly important in later stages of cell life. As the cell discharges, anode active material is physically moved from the anode to intercalate with the cathode active material. As this mass transfer occurs, the cathode becomes physically larger and the anode smaller. This can lead to misalignment. However, the stack holder prevents such misalignment by maintaining a constrictive force on the electrode assembly throughout discharge. | 03-26-2009 |
| 20090117457 | Electrochemical Cells And Method Of Manufacturing Same - An electrochemical cell comprising a casing, an anode comprising anode active material, a cathode, and an electrolyte solution activating the cathode and the anode is described. In one embodiment, the cathode is comprised of a first current collector, first and second sheets of a first cathode active material in contact with the first current collector, a second current collector, third and forth sheets of the first cathode active material in contact with the second current collector, and a first sheet of a second cathode active material in non-adherent and congruent contact with the second and third sheets of the first cathode active material. | 05-07-2009 |
| 20100148128 | Pad printing of cathode active materials for incorporation into electrochemical cells - Deposition of an electrode active material printing suspension onto a conductive substrate by various pad-printing techniques is described. After heat-treating to evaporate the solvent and decompose a printing binder, an electrode active coating suitable for incorporation into an electrochemical cell is provided. | 06-17-2010 |
| 20110229762 | Method Of Using Cyclic Pressure To Increase The Pressed Density Of Electrodes For Use In Electrochemical Cells - The traditional method of building a CF | 09-22-2011 |
Ashish Shah, Edison, NJ US
| Patent application number | Description | Published |
|---|---|---|
| 20090163582 | Stable Pesticide Concentrates and End-Use Emulsions - Pesticide concentrates are provided containing an emulsifier that is an EPA list 4 inert and is a polyglycerol fatty acid ester, a sorbitan fatty acid ester or a combination thereof, a pesticide and a solvent that is either a EPA list 3 inert of acetyl ester, EPA list 4 inert of a methyl fatty ester, an acetyltributyl citrate, white mineral oil or a combination thereof. The pesticide can be a water-insoluble synthetic pyrethroid, natural pyrethrum, channel blocking insecticide, acetylcholinesterase inhibitor, oxadiazine, organophosphate, neonicotinoid insecticide, thiamethoxam, imidacloprid, acetamiprid, thiacloprid, clothianidin, nitenpyran, insect growth regulator, juvenile hormone mimic, fermentation insecticide, plant oil insecticide acaracide, miticide, fungicide, herbicide and combinations thereof. The pesticide concentrate is diluted with a hydrocarbon solvent, a white mineral oil or a combination thereof and mixed with water. A corrosion inhibitor is added to form a stable water-in-oil emulsion in conjunction with a propellant to make a ready-to-use aerosol for home, garden and public health pest control. | 06-25-2009 |
Ashish Shah, Santa Clara, CA US
| Patent application number | Description | Published |
|---|---|---|
| 20090014127 | SYSTEMS FOR PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION AND BEVEL EDGE ETCHING - Embodiments described herein relate to a substrate processing system that integrates substrate edge processing capabilities. Illustrated examples of the processing system include, without limitations, a factory interface, a loadlock chamber, a transfer chamber, and one or more twin process chambers having two or more processing regions that are isolatable from each other and share a common gas supply and a common exhaust pump. The processing regions in each twin process chamber include separate gas distribution assemblies and RF power sources to provide plasma at selective regions on a substrate surface in each processing region. Each twin process chamber is thereby configured to allow multiple, isolated processes to be performed concurrently on at least two substrates in the processing regions. | 01-15-2009 |
| 20090017635 | APPARATUS AND METHOD FOR PROCESSING A SUBSTRATE EDGE REGION - The present invention comprises an apparatus and method for etching at a substrate edge region. In one embodiment, the apparatus comprises a chamber having a process volume, a substrate support arranged inside the process volume and having a substrate support surface, a plasma generator coupled to the chamber and configured to supply an etching agent in a plasma phase to a peripheral region of the substrate support surface, and a gas delivery assembly coupled to a gas source for generating a radial gas flow over the substrate support surface from an approximately central region of the substrate support surface toward the peripheral region of the substrate support surface. | 01-15-2009 |
| 20120003398 | APPARATUS AND METHOD FOR EXPOSING A SUBSTRATE TO UV RADIATION USING A REFLECTOR HAVING BOTH ELLIPTICAL AND PARABOLIC REFLECTIVE SECTIONS - Embodiments of the invention relate generally to an ultraviolet (UV) cure chamber for curing a dielectric material disposed on a substrate and to methods of curing dielectric materials using UV radiation. A substrate processing tool according to one embodiment comprises a body defining a substrate processing region; a substrate support adapted to support a substrate within the substrate processing region; an ultraviolet radiation lamp spaced apart from the substrate support, the lamp configured to transmit ultraviolet radiation to a substrate positioned on the substrate support; and a motor operatively coupled to rotate at least one of the ultraviolet radiation lamp or substrate support at least 180 degrees relative to each other. The substrate processing tool may further comprise one or more reflectors adapted to generate a flood pattern of ultraviolet radiation over the substrate that has complementary high and low intensity areas which combine to generate a substantially uniform irradiance pattern if rotated. Other embodiments are also disclosed. | 01-05-2012 |
Ashish Shah, Sammamish, WA US
| Patent application number | Description | Published |
|---|---|---|
| 20120102481 | Coordinated Upgrades In Distributed Systems - A distributed application may be updated by using information provided by the application to determine grouping, sequencing, and whether or not to advance an update sequence. The application may provide input to an update sequence, and may cause the update sequence to repair one or more replicas prior to updating. The update mechanism may be used to change the distributed application topology as well as make changes to the application executable code, application configuration, quest operating system, virtual machine, and host systems, among others. In some cases, the distributed application may use a quorum to determine which version is current, and the quorum may change during the update process. | 04-26-2012 |