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Ashihara, JP

Eiji Ashihara, Tokyo JP

Patent application numberDescriptionPublished
20110051441MOTORCYCLE TAIL LIGHT DEVICE - A motorcycle tail light device can have a plurality of front engagement members, provided in a front part of a tail light support stay, that enable movement of a support position of a tail light device 03-03-2011
20110051443MOTORCYCLE HEAD LIGHT DEVICE - A head light device, according to one embodiment, has a head light, a position light provided around the head light, a reflector to reflect bulb light of the head light, and an extension covering the perimeter of the reflector. The extension covers a position in front of the position light, and the extension is provided with openings, and reflection members to guide the light of the position light to the outside.03-03-2011

Eiji Ashihara, Saitama JP

Patent application numberDescriptionPublished
20080232122TAIL LAMP STRUCTURE - To provide a tail lamp structure wherein a height in an upward and downward direction can be reduced to achieve miniaturization thereof. A tail lamp structure is equipped at a rear portion of a motorcycle. A board on which a stop lamp LED and a tail lamp LED are mounted in a spaced relationship from each other forwardly and backwardly is disposed in the forward and backward direction of the vehicle. The stop lamp LED and said tail lamp LED are isolated from each other by a reflector.09-25-2008
20080239738MOTORCYCLE FRONT LIGHTING APPARATUS STRUCTURE - A motorcycle front lighting apparatus structure includes a headlight and a position light provided adjacent to the headlight. In this structure, the position light is disposed in a condition protruding downwardly from a lower edge of the headlight. This structure allows the position light to be made larger, and makes any needed repair easy and cost effective.10-02-2008

Hiroshi Ashihara, Ome JP

Patent application numberDescriptionPublished
20090115063SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE AND A METHOD OF MANUFACTURING THE SAME - In manufacturing a semiconductor integrated circuit device, an interconnect trench and a contact hole are formed in an interlayer insulating film formed over a first-level interconnect on a semiconductor substrate, a barrier film is formed inside of the trench and contact hole so that its film thickness increases from the center of the bottom of the hole toward the sidewalls all around the bottom of the contact hole, a copper film is formed over the barrier film, and a second-level interconnect and a connector portion (plug) are formed by polishing by CMP. In this way, the geometrically shortest pathway of an electrical current flowing from the second-level interconnect toward the first-level interconnect through a connector portion (plug) does not coincide with a thin barrier film portion which has the lowest electrical resistance, so that the current pathway can be dispersed and a concentration of electrons does not occur readily.05-07-2009

Hiroshi Ashihara, Hachioji JP

Patent application numberDescriptionPublished
20080203531SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF - In this invention, the film thicknesses of an upper barrier film of a lower electrode of a capacitive element and an upper barrier film of a metallic interconnect layer formed in the same layer as this is made thicker than the film thicknesses of upper barrier films of other metallic interconnect layers. Moreover, in this invention, the film thickness of the upper barrier film of the lower electrode of the capacitive element is controlled to be 110 nm or more, more preferably, 160 nm or more. A decrease in the dielectric voltage of the capacitive dielectric film due to cracks in the upper barrier film does not occur and the deposition temperature of the capacitive dielectric film can be made higher, so that a semiconductor device having a MIM capacitor with high performance and high capacitance can be achieved, where the dielectric voltage of the capacitive dielectric film is improved.08-28-2008
20100181647SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF - In this invention, the film thicknesses of an upper barrier film of a lower electrode of a capacitive element and an upper barrier film of a metallic interconnect layer formed in the same layer as this is made thicker than the film thicknesses of upper barrier films of other metallic interconnect layers. Moreover, in this invention, the film thickness of the upper barrier film of the lower electrode of the capacitive element is controlled to be 110 nm or more, more preferably, 160 nm or more. A decrease in the dielectric voltage of the capacitive dielectric film due to cracks in the upper barrier film does not occur and the deposition temperature of the capacitive dielectric film can be made higher, so that a semiconductor device having a MIM capacitor with high performance and high capacitance can be achieved, where the dielectric voltage of the capacitive dielectric film is improved.07-22-2010

Hiroshi Ashihara, Kumamoto-Shi JP

Patent application numberDescriptionPublished
20090111122METHOD FOR NON-INVASIVE EXAMINATION OF NON-ALCOHOLIC STEATOHEPATITIS BY QUANTIFICATION OF CYTOCHROME-c, AND TEST KIT - It is found that blood cytochrome c levels quantified for non-alcoholic steatohepatitis patients are higher than those for healthy persons, and that the quantified blood cytochrome c values correlated with fat deposition rates in hepatocytes. It is possible to test non-alcoholic steatohepatitis by quantifying cytochrome c in serum. A test method and a test kit for the test are provided.04-30-2009

Katsuhiro Ashihara, Aichi JP

Patent application numberDescriptionPublished
20110002563SLIDING BEARING - A sliding bearing 01-06-2011

Makoto Ashihara, Kanagawa-Ken JP

Patent application numberDescriptionPublished
20100208161Backlight device and liquid crystal display - A backlight device includes a housing, a light source, a diffuse plate and a fixing member. The housing has an open surface. The light source is arranged in the housing. The diffuser plate is arranged on the open surface of the housing and allows light emitted from the light source to pass therethrough while diffusing the light. The fixing member prevents the diffuser plate from bending in a direction in which light passes through the diffuser plate. A part of the fixing member has transmittance adjusted to substantially equalize luminance distribution of light passed through the diffuser plate.08-19-2010

Shingo Ashihara, Mito JP

Patent application numberDescriptionPublished
20090318623METHOD OF DECOMPOSING ORGANIC COMPOUND - A method of decomposing an organic compound includes decomposing an organic compound by alkyl carbonate at 250° C. or more. The organic compound includes a cross-linked polymer. The cross-linked polymer includes a polymer cross-linked by organic peroxide cross-linking, radiation cross-linking, or silane cross-linking The alkyl carbonate includes dimethyl carbonate or diethyl carbonate.12-24-2009

Takeshi Ashihara, Oita JP

Patent application numberDescriptionPublished
20090111358Polishing apparatus and polishing method - The present invention provides a apparatus for polishing an object material such as a film on a substrate. This apparatus includes a polishing table for holding a polishing pad having a polishing surface, a motor configured to drive the polishing table, a holding mechanism configured to hold a substrate having an object material to be polished and to press the substrate against the polishing surface, a dresser configured to dress the polishing surface, and a monitoring unit configured to monitor a removal amount of the object material. The monitoring unit is operable to calculate the removal amount of the object material using a model equation containing a variable representing an integrated value of a torque current of the motor when polishing the object material and a variable representing a cumulative operating time of the dresser.04-30-2009

Teruaki Ashihara, Mie JP

Patent application numberDescriptionPublished
20090018251POLYPROPYLENE TYPE AQUEOUS DISPERSION, POLYPROPYLENE TYPE COMPOSITE AQUEOUS EMULSION COMPOSITION AND ITS USE - A polypropylene type aqueous dispersion comprising the following components (a) to (c):01-15-2009

Yoshiki Ashihara, Kizugawa-Shi JP

Patent application numberDescriptionPublished
20110221056ELECTRODE STRUCTURE AND MICRODEVICE PACKAGE PROVIDED THEREWITH - An electrode structure has a Cu electrode that provided in a surface of a substrate, a diffusion preventing film that is made of a material in which a diffusion coefficient of Sn is equal to or lower than 3×1009-15-2011