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Asao
Asao Ajiri, Kanagawa JP
| Patent application number | Description | Published |
|---|---|---|
| 20090090346 | HEAT GENERATING SHEET AND HEAT GENERATING SHEET BAG - The present invention relates to a heat generating sheet which includes a plurality of flat heat generating elements disposed in a plane, and two packaging sheet materials between which the flat heat generating elements are interposed, wherein the two packaging sheet materials each have a boomerang shape and a perforation line from which each packaging sheet material is divided into halves, and the two packaging sheet materials and the flat heat generating elements interposed therebetween are thermocompression-bonded together; and a heat generating sheet bag which includes the heat generating sheet, and an air-impermeable flat bag in which the heat generating sheet is enclosed in a hermetically sealed condition, and more specifically, relates to a heat generating sheet accommodating heat generating elements capable of generating heat by contact with oxygen in air; and a heat generating sheet bag enclosing the heat generating sheet in a hermetically sealed condition. There are provided a heat generating sheet and a heat generating sheet bag which are applied to flexions such as elbows, knees and neck in a well-fit manner and can be easily used without a strange feel. | 04-09-2009 |
Asao Nishimura, Kokubunji JP
| Patent application number | Description | Published |
|---|---|---|
| 20090230448 | SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE AND MANUFACTURE THEREOF - In a semiconductor integrated circuit device, testing pads ( | 09-17-2009 |
| 20100214753 | Pb-free solder-connected structure and electronic device - Provided are a bonded structure by a lead-free solder and an electronic article comprising the bonded structure. The bonded structure has a stable bonding interface with respect to a change in process of time, an enough strength and resistance to occurrence of whiskers while keeping good wettability of the solder. In the bonded structure, a lead-free Sn—Ag—Bi alloy solder is applied to an electrode through an Sn—Bi alloy layer. The Sn—Bi alloy, preferably, comprises 1 to 20 wt % Bi in order to obtain good wettability of the solder. In order to obtain desirable bonding characteristics having higher reliability in the invention, a copper layer is provided under the Sn—Bi alloy layer thereby obtaining an enough bonding strength. | 08-26-2010 |
| 20100301334 | SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE AND MANUFACTURE THEREOF - In a semiconductor integrated circuit device, testing pads ( | 12-02-2010 |
| 20110140185 | SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE AND MANUFACTURE THEREOF - In a semiconductor integrated circuit device, testing pads ( | 06-16-2011 |
Asao Uenodai, Saitama JP
| Patent application number | Description | Published |
|---|---|---|
| 20090115246 | Traction Control Device for Vehicle - An electric motor is coupled to driving wheels | 05-07-2009 |