Patent application number | Description | Published |
20140002762 | LIQUID CRYSTAL DRIVE METHOD AND LIQUID CRYSTAL DISPLAY DEVICE | 01-02-2014 |
20140016075 | LIQUID CRYSTAL DISPLAY PANEL AND LIQUID CRYSTAL DISPLAY APPARATUS - The present invention provides a liquid crystal display panel and a liquid crystal display apparatus that features sufficiently fast response and are excellent in transmittance performance. The liquid crystal display panel includes a first substrate, a second substrate, and a liquid crystal layer sandwiched between the first substrate and the second substrate. Each of the first substrate and the second substrate includes electrodes. The electrodes of the second substrate include a pair of comb substrates and a planar electrode. The liquid crystal display panel is configured to align liquid crystal molecules in the liquid crystal layer in a direction horizontal to a substrate main surface in response to an electric field generated between the pair of comb electrodes or an electric field generated between the first substrate and the second substrate. | 01-16-2014 |
20150056544 | METHOD FOR MANUFACTURING LIQUID CRYSTAL DISPLAY DEVICE, AND LIQUID CRYSTAL DISPLAY DEVICE - Provided is a method for manufacturing a liquid crystal display device that includes a photoalignment film. The photoalignment film is formed from a liquid crystal alignment agent, and aligns liquid crystal molecules horizontally to the main face of the at least one of the substrates. The liquid crystal alignment agent contains a solvent and at least two kinds of polyamic acids or their derivatives obtained by reacting diamine and tetracarboxylic dianhydride. At least two of the diamines and at least one of the tetracarboxylic dianhydrides are compounds represented by predetermined formulas. The method includes the steps of: (1) forming the film of the liquid crystal alignment agent; (2) pre-baking the film; (3) irradiating the pre-baked film with light; and (4) post-baking the irradiated film, the step (4) including an operation of post-baking the film multiple times at temperatures ranging from low to high temperatures. | 02-26-2015 |
20150234237 | LIQUID CRYSTAL DISPLAY DEVICE AND METHOD FOR MANUFACTURING SAME - The present invention provides a liquid crystal display device that sufficiently reduces image sticking, by forming a polymer layer with stable alignment control appropriately. In a method for manufacturing the liquid crystal display device of the present invention, base film forming conditions are different between the step of forming a base film on a substrate including an active element and the step of forming a base film on a substrate different from the substrate including an active element. | 08-20-2015 |
Patent application number | Description | Published |
20090286093 | LEAD-FREE SOLDER - According to one embodiment of the invention, there is provided a lead-free solder including an alloy rolled into a shape of sheet. The alloy includes: tin; from 10 wt % to less than 25 wt % of silver; and from 3 wt % to 5 wt % of copper. The alloy is free from lead. | 11-19-2009 |
20120018048 | CREAM SOLDER AND METHOD OF SOLDERING ELECTRONIC PART - A cream solder obtained by kneading an Sn—Ag—Cu alloy together with a flux, wherein the Sn—Ag—Cu alloy includes a mixture of a first powdery alloy and a second powdery alloy, the first powdery alloy is represented by an Sn—Ag phase diagram having a solid-liquid coexistence region and has a given silver amount which is larger than that in the eutectic composition (3.5 wt. % silver), and the second powdery alloy has a silver amount which is that in the eutectic composition (3.5 wt. % silver) or which is close to that in the eutectic composition and is smaller than that in the first powdery alloy. This cream solder has excellent strength and thermal stability, and satisfactory bonding properties. It is based on an inexpensive Sn—Ag—Cu solder alloy. It is suitable for use as a high-temperature-side lead-free solder material conformable to temperature gradation bonding. Also provided is a method of soldering. | 01-26-2012 |
20120111924 | LEAD-FREE SOLDER - According to one embodiment of the invention, there is provided a lead-free solder including an alloy rolled into a shape of sheet. The alloy includes: tin; from 10 wt % to less than 25 wt % of silver; and from 3 wt % to 5 wt % of copper. The alloy is free from lead. | 05-10-2012 |
20150208516 | METHOD OF SOLDERING ELECTRONIC PART - A cream solder obtained by kneading an Sn—Ag—Cu alloy together with a flux, wherein the Sn—Ag—Cu alloy includes a mixture of a first powdery alloy and a second powdery alloy, the first powdery alloy is represented by an Sn—Ag phase diagram having a solid-liquid coexistence region and has a given silver amount which is larger than that in the eutectic composition (3.5 wt. % silver), and the second powdery alloy has a silver amount which is that in the eutectic composition (3.5 wt. % silver) or which is close to that in the eutectic composition and is smaller than that in the first powdery alloy. This cream solder has excellent strength and thermal stability, and satisfactory bonding properties. It is based on an inexpensive Sn—Ag—Cu solder alloy. It is suitable for use as a high-temperature-side lead-free solder material conformable to temperature gradation bonding. Also provided is a method of soldering. | 07-23-2015 |