| Patent application number | Description | Published |
|---|
| 20080220622 | Substrate processing pallet with cooling - A substrate processing pallet can cool a substrate. A substrate processing pallet can include a base member; an interface pad attachable to the base member, the interface pad having substantially the same coefficient of thermal expansion as the base member and adapted to facilitate cooling of the substrate; and a surface of the base member having features for aligning a substrate on the interface pad. A substrate processing pallet can also include a base member; an interface pad attachable to the base member; an electrostatic chuck for gripping the substrate during processing; an energy storage system for storing energy to sustain the electrostatic chuck at sufficient charge to sustain grip the substrate during processing; and a conduit for transporting gas to a backside of the substrate to facilitate cooling of the substrate. | 09-11-2008 |
| 20100212694 | WETTING A WORKPIECE SURFACE IN A FLUID-PROCESSING SYSTEM - A method and apparatus for wetting the surface of a workpiece is disclosed. The apparatus includes a chamber with a vacuum port and a fluid port and a workpiece holder including a body, a ring, and a port. The body includes a surface and defines a cavity extending from the surface. The ring is adapted to retain the workpiece on the surface of body over the cavity. The ring forms a fluid seal relative to the workpiece and to the workpiece holder. The port is defined in the body and in communication with the cavity. The port affects pressure in the cavity to minimize a pressure differential between the front and back surfaces of the workpiece. The fluid port is in communication with the chamber. The fluid port delivers a fluid (e.g., a substantially degassed fluid) to wet the front surface of the workpiece during operation of the chamber at a reduced pressure relative to atmosphere. | 08-26-2010 |
| 20100295225 | METHOD AND APPARATUS FOR FLUID PROCESSING A WORKPIECE - A method of fluid sealing a workpiece is provided. The method includes placing a workpiece on a ring, engaging at least one engagement feature of the ring with at least one retaining feature defined by the member and flexing the member to provide a force to the at least one engagement feature to cause the ring to form a barrier to fluid entry with the workpiece. | 11-25-2010 |
| 20100301564 | BALANCING PRESSURE TO IMPROVE A FLUID SEAL - A method of fluid sealing a workpiece is provided. The method includes providing a force to cause a ring to form a barrier to fluid entry with the workpiece and preventing fluid from crossing the barrier to fluid entry by forming a pressure differential across the barrier. | 12-02-2010 |
| 20110024964 | SUBSTRATE PROCESSING PALLET WITH COOLING - In one exemplary embodiment, a substrate processing pallet is provided. The substrate processing pallet includes a base member, and an interface pad attachable to the base member. The interface pad has substantially the same coefficient of thermal expansion as the base member and adapted to facilitate cooling of the substrate. The substrate processing pallet also having a surface of the base member having features for aligning a substrate on the interface pad. | 02-03-2011 |
| 20110114623 | Apparatus for thermal processing with micro-environment - A substrate thermal processing system. The system has at least one substrate holding module having a housing configured for holding an isolated environment therein. A substrate heater is located in the housing and has a substrate heating surface. A substrate cooler is located in the housing and having a substrate cooling surface. A gas feed opening into the housing and feeding inert or reducing gas into the housing when the substrate is heated by the heating surface. A gas restrictor is within the housing restricting the fed gas between the substrate heating surface and a surrounding atmospheric region substantially surrounding the substrate heating surface in the housing and forming an aperture through which the fed gas communicates with the atmospheric region. | 05-19-2011 |
| 20110139627 | METHOD AND APPARATUS FOR FLUID PROCESSING A WORKPIECE - A method of fluid processing a semiconductor workpiece, including disposing a workpiece holder with a housing capable of containing a fluid, the workpiece holder retaining the workpiece, providing an agitation system connected to the housing and comprising a member disposed within the housing adjacent the workpiece holder, and agitating the fluid by moving the member substantially parallel to a surface of the workpiece with a non-uniform oscillatory motion, the non-uniform oscillatory motion being a series of substantially continuous geometrically asymmetric oscillations wherein each consecutive oscillation of the series is geometrically asymmetric having at least two substantially continuous opposing strokes wherein reversal positions of each substantially continuous stroke of the substantially continuous asymmetric oscillation are disposed asymmetrically with respect to a center point of each immediately preceding substantially continuous stroke of the oscillation. | 06-16-2011 |
| 20110240481 | SEED LAYER DEPOSITION IN MICROSCALE FEATURES - A method and system for coating the interior surfaces of microscale hole features fabricated into the substantially planar surface of a work piece. The method comprises providing a work piece with a barrier metal coating that is substantially continuous and uniform both along the planar surface of the work piece and the inner surfaces of the microscale hole features wherein said barrier metal coating is applied by a substantially surface reaction limited process. The workpiece is provided with a coating, on the planar surface of the work piece, of a thick metal layer anchored to the barrier metal coat and disposed to provide substantially uniform electrical conduction capability to the microscale features located throughout and across the workpiece. An electrical contact path is provided to the electrically conductive coating at the perimeter of the work piece. The workpiece is immersed in a chemical bath, causing said chemical bath to fully contact the interior surfaces of the microscale hole features, said chemical bath containing metal ions suitable for electrodeposition. An electric potential is applied at the perimeter of the work piece to cause electrodeposition of metal ions onto all surfaces of the work piece including the interior surfaces of the microscale hole features to a predetermined finish coating in one step. | 10-06-2011 |
