| Patent application number | Description | Published |
|---|
| 20080230881 | INTEGRATED CIRCUIT PACKAGE SYSTEM WITH LEAD SUPPORT - An integrated circuit package system is provided including forming a paddle having an integrated circuit die thereover, an outer lead, and an inner lead between the paddle and the outer lead. The integrated circuit package system is also provided including placing a lead support over the inner lead without traversing to an inner body bottom side of the inner lead, connecting the integrated circuit die and the inner lead, and encapsulating the inner lead having the lead support thereover and the inner lead exposed. | 09-25-2008 |
| 20080251901 | STACKED INTEGRATED CIRCUIT PACKAGE SYSTEM - A stacked integrated circuit package system is provided providing a lead frame having a die paddle, attaching a first integrated circuit on the die paddle of the lead frame, connecting first electrical interconnects between the first integrated circuit and the lead frame, encapsulating the first integrated circuit and the first electrical interconnects with the lead frame directly on a bottom mold and clamped by a top mold, attaching a second integrated circuit on the die paddle of the first integrated circuit, connecting second electrical interconnects between the second integrated circuit and the lead frame, and encapsulating the second integrated circuit and the second electrical interconnects. | 10-16-2008 |
| 20090008761 | INTEGRATED CIRCUIT PACKAGE SYSTEM WITH FLEX BUMP - An integrated circuit package system includes: forming a flex bump over an integrated circuit device structure, the flex bump having both a base portion and an offset portion over the base portion; forming a first ball bond of a first internal interconnect over the offset portion; and encapsulating the integrated circuit device structure, the flex bump, and the first internal interconnect. | 01-08-2009 |
| 20090014849 | INTEGRATED CIRCUIT PACKAGE SYSTEM WITH MULTIPLE MOLDING - An integrated circuit package system is provided forming a lead from a padless lead frame, and encapsulating the lead for supporting an integrated circuit die with a first molding compound for encapsulation with a second molding compound. | 01-15-2009 |
| 20090072363 | INTEGRATED CIRCUIT PACKAGE-IN-PACKAGE SYSTEM WITH LEADS - An integrated circuit package-in-package system includes: forming an integrated circuit package system including: connecting a first integrated circuit die and a lead, and forming an inner encapsulation covering the first integrated circuit die and a portion of the lead; mounting a second integrated circuit die to the integrated circuit package system; connecting the second integrated circuit die and the lead; and forming a package encapsulation covering the integrated circuit package system and the second integrated circuit die with the lead exposed. | 03-19-2009 |
| 20090079048 | INTEGRATED CIRCUIT PACKAGE SYSTEM WITH UNDER PADDLE LEADFINGERS - An integrated circuit package system is provided including: forming a die paddle; forming an under paddle leadframe including lower leadfingers thereon; attaching the under paddle leadframe to the die paddle with the lower leadfingers extending under the die paddle; attaching a die to the die paddle; and planarizing the bottom surface of the under paddle leadframe to separate the lower leadfingers under the die paddle. | 03-26-2009 |
| 20090079096 | INTEGRATED CIRCUIT PACKAGE SYSTEM WITH MULTIPLE DEVICE UNITS - An integrated circuit package system comprising forming a first device unit, having a first external interconnect, and a second device unit, having a second external interconnect, in an array configuration; mounting an integrated circuit die over the first device unit; connecting the integrated circuit die and the first external interconnect; and encapsulating the integrated circuit die, the first device unit, and the second device unit with both the first external interconnect and the second external interconnect partially exposed. | 03-26-2009 |
| 20090179314 | INTEGRATED CIRCUIT PACKAGE SYSTEM WITH LEADFINGER SUPPORT - An integrated circuit package system including forming a leadframe having a lead with a leadfinger support of a predetermined height, and attaching an integrated circuit die with an electrical interconnect at a predetermined collapse height determined by the predetermined height of the leadfinger support. | 07-16-2009 |
| 20100244273 | INTEGRATED CIRCUIT PACKAGE SYSTEM WITH MULTIPLE DEVICE UNITS AND METHOD FOR MANUFACTURING THEREOF - A method for manufacturing an integrated circuit package system includes: forming a first device unit, having first external interconnects arranged along a perimeter of the first device unit, and a second device unit, having second external interconnects arranged along a perimeter of the second device unit, in an array configuration; mounting an integrated circuit die over the first device unit; connecting the integrated circuit die and the first external interconnects; encapsulating with an encapsulation covering the integrated circuit die, the first device unit, and the second device unit with both the first external interconnects and the second external interconnects partially exposed; and forming a partial encapsulation cut in the encapsulation electrically isolating the first external interconnects and the second electrical interconnects. | 09-30-2010 |
| 20100264529 | INTEGRATED CIRCUIT PACKAGE SYSTEM WITH INTEGRAL INNER LEAD AND PADDLE AND METHOD OF MANUFACTURE THEREOF - A method of manufacture of an integrated circuit package system includes: forming a paddle, an outer lead, and an inner lead between the paddle and the outer lead; forming a non-vertical paddle edge of the paddle and a non-vertical lead edge of the inner lead facing the non-vertical paddle edge; and encapsulating an integrated circuit die over the paddle. | 10-21-2010 |
