Patent application number | Description | Published |
20130056178 | EBULLIENT COOLING DEVICE - An ebullient cooling device includes a chamber, a heat sink, a heat receiving member, and a heat dissipating member. The chamber includes a heat conducting plate with a heat generating body on an outer side surface thereof, and an airtight space filled with coolant that undergoes a phase change between liquid and gas, on an inner side of the heat conducting plate. The heat sink is provided on the outer side surface of the heat conducting plate. The heat receiving member is provided on an inner side surface of the heat conducting plate so as to oppose the heat generating body with the heat conducting plate sandwiched therebetween, and transfers heat generated at the heat generating body to the coolant. The heat dissipating member is provided on the inner side surface of the heat conducting plate, receives heat transferred by the coolant, and dissipates the heat to the heat sink. | 03-07-2013 |
20130188314 | VAPOR PHASE COOLING APPARATUS AND ELECTRONIC EQUIPMENT USING SAME - A vapor phase cooling apparatus ( | 07-25-2013 |
20130206368 | COOLING DEVICE AND METHOD FOR PRODUCING THE SAME - In a cooling device using an ebullient cooling system, the cooling performance adversely decreases if the evaporator includes projections activating the convection heat transfer and the bubble nuclei are formed on the inner wall surface, therefore, a cooling device according to an exemplary aspect of the invention includes an evaporator storing a refrigerant; a condenser condensing and liquefying a vapor-state refrigerant vaporized in the evaporator and radiating heat; and a connection connecting the evaporator and the condenser; wherein the evaporator includes a base thermally contacting with an object to be cooled, and a container; the base includes a plurality of projections on a boiling surface of a surface at an inner wall side contacting with the refrigerant; and a bubble nucleus forming surface is included only on a part of a refrigerant contacting surface including the boiling surface and the surface of the projections. | 08-15-2013 |
20130219954 | COOLING DEVICE AND METHOD FOR PRODUCING THE SAME - In a cooling device using an ebullient cooling system, cooling performance adversely decreases if the evaporator includes projections activating convection heat transfer and the bubble nuclei are formed on the inner wall surface. A cooling device according to an exemplary embodiment includes an evaporator storing a refrigerant and a condenser condensing and liquefying a vapor-state refrigerant vaporized in the evaporator and radiating heat. The evaporator includes a base thermally contacting with an object to be cooled, and a container. The base includes a plurality of projections on a boiling surface of a surface at an inner wall side contacting with the refrigerant. The cross-sectional area cut along a plane parallel to the boiling surface at the top of the projection is smaller than that at the boiling surface. The evaporator includes a bubble nucleus forming surface only on a part of a refrigerant contacting surface. | 08-29-2013 |
20130319639 | COOLING DEVICE AND METHOD FOR MAKING THE SAME - In a cooling device using an ebullient cooling system, it is difficult to improve the cooling performance without increasing manufacturing costs, therefore, a cooling device according to an exemplary aspect of the invention includes a heat receiving unit storing a refrigerant and receiving the heat from an object to be cooled; a heat radiating unit radiating heat by condensing and liquefying a vapor-state refrigerant arising from a refrigerant vaporizing in the heat receiving unit; and a connection connecting the heat receiving unit to the heat radiating unit; wherein the heat receiving unit includes a base thermally contacting with the object to be cooled, and a container connected to the connection; the base includes a heat receiving unit outer wall composing a part of an outer wall of the heat receiving unit, and a plurality of projections disposed on a heat receiving unit undersurface of an undersurface at an inner wall side contacting with the refrigerant; the base includes a bubble nucleus forming surface on a refrigerant contacting surface composed of the heat receiving unit undersurface and the surface of the projection; and the heat receiving unit includes a vapor-state refrigerant region containing a vapor-state refrigerant between the top edge of the projection and one of inner wall surfaces of the container facing the heat receiving unit undersurface. | 12-05-2013 |
20140027100 | PIPING STRUCTURE OF COOLING DEVICE, METHOD FOR MAKING THE SAME, AND METHOD FOR CONNECTING PIPES - In a piping structure of a cooling device using an ebullient cooling system, the cooling performance of the cooling device is degraded if the pipe is provided with flexibility, therefore, a piping structure of a cooling device according to an exemplary aspect of the invention includes a first tubular part with a hollow portion through which a refrigerant used in the cooling device flows; wherein the first tubular part is made of metal materials; and the surface roughness of the inner surface of the first tubular part is less than or equal to the size of a condensation nucleus for the refrigerant. | 01-30-2014 |
20140083652 | SEALED CASING - A sealed casing includes a container provided with a plurality of opening and houses at least one heat-generating body, and a plurality of top boards sealing the openings respectively, and is characterized in that at least one of the openings is disposed in a heat-generating area where the heat-generating body is disposed, and that a cooling unit is disposed on the top board sealing the opening in the heat-generating area. | 03-27-2014 |
20140144169 | COOLING SYSTEM AND DEVICE HOUSING APPARATUS USING THE SAME - A cooling system comprising: an evaporator for evaporating a refrigerant by performing heat exchange with outside air; a condenser for condensing a gas refrigerant into a liquid refrigerant by making a refrigerant and a cooling medium perform heat exchange with each other; a gas refrigerant pipe and a liquid refrigerant pipe connecting the evaporator and the condenser; and the evaporator including: an upper part header provided in a highest position of the evaporator, and connected with the condenser by the gas refrigerant pipe, through the gas refrigerant pipe a gas refrigerant flowing; a lower part header provided in a lowest position of the evaporator, and connected with the condenser by the liquid refrigerant pipe, through the liquid refrigerant pipe a liquid refrigerant flowing; a middle header provided in an intermediate position between the upper part header and the lower part header, and connected with the condenser by the liquid refrigerant pipe, through the liquid refrigerant pipe the liquid refrigerant flowing; an upper part evaporator, arranged between the upper part header and the middle header, including an upper part steam generating tube having a first flow path for leading a refrigerant of the middle header to the upper part header while making the refrigerant of the middle header perform heat exchange with outside air and having a second flow path for leading a refrigerant of the lower part header to the upper part header while making the refrigerant of the lower part header perform heat exchange with outside air; and a lower part evaporator, arranged between the lower part header and the middle header, including a lower part steam generating tube having a third flow path inserted into the middle header while making a refrigerant of the lower part header perform heat exchange with outside air, the lower part steam generating tube communicated with the second flow path of the upper part steam generating tube. | 05-29-2014 |
20140165638 | COOLING DEVICE AND ELECTRONIC DEVICE MADE THEREWITH - A cooling device employing a boiling cooling method cannot exhibit sufficient cooling performance when it is installed in a low-profile electronic device. | 06-19-2014 |
20140190738 | ELECTRONIC SUBSTRATE AND AN ELECTRONIC APPARATUS - An electronic substrate | 07-10-2014 |
20140321056 | ELECTRONIC SUBSTRATE HOUSING EQUIPMENT AND ELECTRIC APPARATUS - An electronic substrate | 10-30-2014 |
20140326016 | COOLING DEVICE AND ELECTRIC EQUIPMENT USING THE SAME - A cooling device of the present invention is a cooling device arranged in a chassis equipped with an upper surface, and comprises: a refrigerant; a vaporizer that includes an evaporative vessel having a side face of a curved surface shape, and performs heat-absorption by making the refrigerant change its phase from a liquid phase state to a vapor phase state; a condenser that performs heat-radiation by making the refrigerant change its phase from a vapor phase state to a liquid phase state; a pipe that connects the vaporizer and the condenser; and a flow path suppression means for suppressing a cooling wind that flows between an area over the evaporative vessel and the upper surface. | 11-06-2014 |
20140331709 | COOLING DEVICE AND ELECTRONIC DEVICE USING THE SAME - When a cooling device employing an ebullient cooling system is mounted in a low-profile electronic device, not only is it impossible to obtain the sufficient cooling performance, but also the cooling efficiency of the entire electronic device decreases, therefore, a cooling device according to an exemplary aspect of the invention includes evaporating means for storing a refrigerant; condensing means for condensing and liquefying a vapor-phase refrigerant vaporized in the evaporation means and radiating heat; a pipe connecting the evaporating means to the condensing means; and flow regulating means for regulating a flow direction of air passing through the condensing means, wherein the evaporating means and the condensing means are located on roughly the same level in the vertical direction; the evaporating means includes an evaporation container and bulkhead means for separating the refrigerant disposed in the evaporation container; the height of the bulkhead means is larger than or equal to the height of a vapor-liquid interface of the refrigerant and is smaller than the height of the evaporation container; the pipe includes a vapor pipe through which vapor-phase refrigerant flows and a liquid pipe through which condensed and liquefied liquid-phase refrigerant flows; the condensing means includes first condensing means and second condensing means which differ in condensing-means height which is defined as the height in vertical direction of a condensation container composing the condensing means, and the condensing-means height of the first condensing means is configured to be larger than the condensing-means height of the second condensing means; the first condensing means includes a vapor pipe connection portion which is connected to the vapor pipe at the position above the condensing-means height of the second condensing means in vertical direction; and the flow regulating means is disposed in the upper part of the second condensing means. | 11-13-2014 |
20140366572 | COOLING DEVICE - [Problem] When a size of a cooling device using a boiling cooling system is reduced, a cooling performance decreases. | 12-18-2014 |
20150034288 | Flat Plate Cooling Device and Method for Using the Same - In a cooling device using an ebullient cooling system, a cooling device becomes larger when a degree of freedom of the arrangement in installing it in electronic equipment is increased, and that it is impossible to obtain a sufficient degree of freedom of the arrangement, therefore, a flat plate cooling device according to an exemplary aspect of the invention includes a plate-like container including a first flat plate and a second flat plate opposite to the first flat plate; a refrigerant enclosed in the plate-like container; and a guiding wall unit connecting the first flat plate to the second flat plate and controlling a flow of the refrigerant in the plate-like container; wherein the plate-like container includes a heat receiving area which is thermally connected to a heating element disposed on at least one of the first flat plate and the second flat plate; and the guiding wall unit includes a pair of guiding walls, and the guiding walls are disposed on opposite sides of the heat receiving area. | 02-05-2015 |
20150062821 | Cooling Structure for Electronic Circuit Board, and Electronic Device Using the Same - The size of an electronic device using a cooling structure for an electronic circuit board is increased when using a heating element with a large amount of heat generation, therefore, a cooling structure for an electronic circuit board according to an exemplary aspect of the present invention includes an evaporator with an evaporation container storing a refrigerant; a condenser condensing and liquefying a vapor-phase refrigerant vaporized in the evaporator and radiating heat; and a pipe connecting the evaporator to the condenser, wherein the evaporator includes a heat receiving area, on one side of the evaporation container, thermally connecting to a heating element disposed on the electronic circuit board, and a plurality of flow path plates, in an area including the heat receiving area, extending in the direction parallel to the electronic circuit board; and a vapor-liquid interface of the refrigerant is positioned above or at the level of a lower end and below an upper end of the heat receiving area in the vertical direction, in the arrangement condition that the drawing direction of the flow path plates is approximately parallel to the vertical direction. | 03-05-2015 |