| Patent application number | Description | Published |
|---|
| 20080196930 | Method for Manufacturing a Circuit Board Structure, and a Circuit Board Structure - This publication discloses a method for manufacturing a circuit-board structure. According to the method, a conductor pattern ( | 08-21-2008 |
| 20080202801 | Circuit Board Structure and Method for Manufacturing a Circuit Board Structure - The present publication discloses a method for manufacturing a circuit-board structure. In the method, a conductor layer is made, which comprises a conductor foil ( | 08-28-2008 |
| 20090014872 | METHOD FOR MANUFACTURING A CIRCUIT BOARD STRUCTURE, AND A CIRCUIT BOARD STRUCTURE - This publication discloses a method for manufacturing a circuit-board structure. | 01-15-2009 |
| 20090133251 | MANUFACTURE OF A CIRCUIT BOARD AND CIRCUIT BOARD CONTAINING A COMPONENT - A method for the manufacture of a circuit board containing a component and circuit board containing a component. The invention is based on first manufacturing an intermediate product, which contains the insulator layer of the circuit board and the components, which are set in place inside the insulator layer in such a way that the contact elements of the components face the surface of the intermediate product. After this, the intermediate product is transferred to the circuit-board manufacturing line, on which a suitable number of conductor-pattern layers and, if necessary, insulator layers are manufactured on one or both sides of the intermediate product, in such a way that, when manufacturing the first conductor-pattern layer, the conductor material forms an electrical contact with the contact elements of the components. Alternatively, stages can also be performed on a single manufacturing line. | 05-28-2009 |
| 20100052129 | MULTI-CHIP PACKAGE AND MANUFACTURING METHOD - Manufacturing method and a multi-chip package, which comprises a conductor pattern ( | 03-04-2010 |
| 20100170703 | RIGID-FLEX MODULE AND MANUFACTURING METHOD - Rigid-flex-type circuit-board structure and manufacturing method, in which a flexible membrane ( | 07-08-2010 |
| 20100188823 | Method for Manufacturing an Electronic Module - This publication discloses a method for manufacturing an electronic module, in which manufacture commences from an insulating-material sheet ( | 07-29-2010 |
| 20100214750 | ELECTRONICS MODULE COMPRISING AN EMBEDDED MICROCIRCUIT - This publication discloses an electronics module comprising an insulating-material layer having two opposite surfaces, and at least one microcircuit embedded to the insulating-material layer. The microcircuit has a first contact surface comprising first contact terminals, from which the microcircuit is electrically connected to first conductor structures in the form of a patterned first conductor layer contained on first surface of the insulating-material layer, and a second contact surface opposite to the first contact surface, in which there is at least one second contact terminal, from which the microcircuit is electrically connected to second conductor structures contained in the form of a patterned second conductor layer on second surface of the insulating-material layer. According to the invention there is provided a local adhesive layer between the component and the first contact surface and first conductor layer, the adhesive layer filling the space between the component and the first conductor layer. With the aid of the invention, it is possible to achieve an electronic-module construction that saves space compared to the prior art. | 08-26-2010 |
| 20100308452 | ELECTRONIC MODULE WITH FEED THROUGH CONDUCTOR BETWEEN WIRING PATTERNS - The electronic module comprises a dielectric | 12-09-2010 |
| 20110061909 | CIRCUIT MODULE AND METHOD OF MANUFACTURING THE SAME - Manufacturing method and circuit module, which comprises an insulator layer ( | 03-17-2011 |
