| Patent application number | Description | Published |
|---|
| 20080247585 | Electrical Module Comprising a Mems Microphone - An electrical module includes a base plate having an acoustic channel that opens into a first cavity at a first end and that is closed off by a microphone chip at a second end. The microphone chip borders a second cavity that opens to an exterior of the electrical module. The second cavity is separated from the acoustic channel by the microphone chip. | 10-09-2008 |
| 20080253056 | Adjustable Capacitor and Circuit Provided Therewith - A capacitor with a multilayer structure on a ceramic or crystalline substrate is proposed that comprises at least one lower and one upper electrode as well as a tunable dielectric arranged therebetween in which resonant oscillation modes of bulk acoustic waves can be propagated, wherein, by suitable selection regarding material and thickness and a suitable number of layers in the multilayer structure, the latter is tuned such that the resonant frequencies of the oscillation modes lie outside of band ranges used in mobile telephones. Circuits with tunable capacitors that find multiple uses inside terminal devices for mobile communication are additionally proposed. | 10-16-2008 |
| 20080267431 | Mems Microphone - A microphone includes a first diaphragm and a second diaphragm coupled to the first diaphragm by a closed air volume. The first diaphragm and the second diaphragm each constitutes a piezoelectric diaphragm. The first diaphragm and the second diaphragm are electrically coupled so that movement of the first diaphragm causes movement of the second diaphragm. | 10-30-2008 |
| 20090001553 | Mems Package and Method for the Production Thereof - A micro electro-mechanical systems (MEMS) package is described herein. The package includes a carrier substrate having a top side, a MEMS chip mounted on the top side of the carrier substrate, and at least one chip component on or above the top side of the carrier substrate or embedded in the carrier substrate. The package also includes a thin metallic shielding layer covering the MEMS chip and the chip component and forming a seal with the top side of the carrier substrate. | 01-01-2009 |
| 20090011554 | Component With Sensitive Component Structures and Method for the Production Thereof - An electrical component has electrically conducting structures placed on an electrically isolating or semiconductive substrate and component structures sensitive to a voltage or an electrical arcing and galvanically separated from one another. To prevent an arcing between the galvanically separated component structures, the component structures are short-circuited with a shunt line having a smaller cross-section than the remaining electrical conductor tracks. The shunt lines can be burnt through by application of an electrical current at any given time, whereby a galvanic separation of the component structures is effected, if necessary, for the function of the component. | 01-08-2009 |
| 20090129611 | Microphone Membrane And Microphone Comprising The Same - The invention relates to a microphone membrane (M | 05-21-2009 |
| 20090255337 | ROTATING MOTION SENSOR - A rotating motion sensor includes at least one electroacoustic resonator to stimulate a surface acoustic wave. The at least one electroacoustic resonator is configured so that rotation of the at least one electroacoustic resonator about an axis of rotation causes a change in resonance frequency of the at least one electroacoustic resonator. The at least one electroacoustic resonator includes oscillating structures configured to oscillate in a first direction that is a direction of propagation of the surface acoustic wave and/or a second direction that is transverse to the direction of propagation of the surface acoustic wave. | 10-15-2009 |
| 20100176899 | COMPONENT HAVING STRESS-REDUCED MOUNTING - A component ( | 07-15-2010 |
| 20100272302 | Arrangement Comprising a Microphone - An arrangement includes a circuit carrier and a housed microphone. A mounting side of the housed microphone is mounted on a top side of the circuit carrier. The housed microphone includes solderable contacts on the mounting side and a sound entry opening facing the circuit carrier. An acoustic channel connects the sound entry opening and surroundings above the circuit carrier. | 10-28-2010 |
| 20110018076 | MEMS Component, Method for Producing a MEMS Component, and Method for Handling a MEMS Component - A MEMS component includes a substrate in which at least one cavity is present. The cavity is closed off toward an active side of the substrate. An inactive side is arranged opposite the active side of the substrate, and the substrate is covered with a covering film on the inactive side. | 01-27-2011 |
