| Patent application number | Description | Published |
|---|
| 20090256748 | WIRELESS DISTRIBUTION OF DATA AND CONTROL - A phased array system having a plurality of array elements, a beam steering computer; at plurality of attenuation and phase control elements for controlling attenuation and phase of energy passing through such attenuation and phase control elements, and a feed network for feeding phase and attenuation data to the plurality of attenuation and phase control elements. The feed network includes at least one slave, wireless receive unit connected to a corresponding one of the plurality of attenuation and phase control elements; and a master wireless transmit unit coupled to the beam steering computer and in wireless communication with the at least one of the plurality of slave, wireless receive units, for transmitting the phase and attenuation data from the beam steering unit to the at least one of the plurality of attenuation and phase control elements. The slave wireless receive unit and the master transmit unit are a spread spectrum communication system. The one slave wireless receive unit and the master transmit unit are Bluetooth units. | 10-15-2009 |
| 20100033262 | RADIO FREQUENCY INTERCONNECT CIRCUITS AND TECHNIQUES - A multilayer circuit board assembly includes one or more radio frequency (RF) interconnects between different circuit layers on different circuit boards which make up the circuit board assembly. The RF interconnects can include one or more RF matching pads which provide a mechanism for matching impedance characteristics of RF stubs to provide the RF interconnects having desired insertion loss and impedance characteristics over a desired RF operating frequency band. The RF matching pads allow the manufacture of circuit boards having RF interconnects without the need to perform any back drill and back fill operation to remove stub portions of the RF interconnects in the multilayer circuit board assembly. | 02-11-2010 |
| 20100066631 | Panel Array - A mixed-signal, multilayer printed wiring board fabricated in a single lamination step is described. The PWB includes one or more radio frequency (RF) interconnects between different circuit layers on different circuit boards which make up the PWB. The PWB includes a number of unit cells with radiating elements and an RF cage disposed around each unit cell to isolate the unit cell. A plurality of flip-chip circuits are disposed on an external surface of the PWB and a heat sink can be disposed over the flip chip components. | 03-18-2010 |
| 20100126010 | Radio Frequency Interconnect Circuits and Techniques - A multilayer circuit board assembly includes one or more radio frequency (RF) interconnects between different circuit layers on different circuit boards which make up the circuit board assembly. The RF interconnects can include one or more RF matching pads which provide a mechanism for matching impedance characteristics of RF stubs to provide the RF interconnects having desired insertion loss and impedance characteristics over a desired RF operating frequency band. The RF matching pads allow the manufacture of circuit boards having RF interconnects without the need to perform any back drill and back fill operation to remove stub portions of the RF interconnects in the multilayer circuit board assembly. | 05-27-2010 |
| 20100245179 | Method and Apparatus for Thermal Management of a Radio Frequency System - A thermal management system includes an air duct assembly comprising a supply air duct having an air inlet opening, a return air duct having an air exit opening and a plurality of distribution air ducts configured to be in fluid communication with the air inlet opening of the supply air duct and with the air exit opening of the return air duct. A fan is disposed within the air duct assembly to direct air from the air inlet opening of the supply air duct through the supply air duct and out the air exit opening of the return air duct. The fan and supply duct are disposed to direct air over a first surface of a heat sink. A second opposing surface of the heat sink is disposed over and configured to be in thermal contact with a plurality of active circuits disposed on a first surface of a radio frequency (RF) multi-layer printing wiring board (PWB). | 09-30-2010 |
