Ang
Ai-Tee Ang, Hsinchu City TW
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20140045300 | WARPAGE CONTROL IN A PACKAGE-ON-PACKAGE STRUCTURE - The present disclosure relates to a tool arrangement and method to reduce warpage within a package-on-package semiconductor structure, while minimizing void formation within an electrically-insulating adhesive which couples the packages. A pressure generator and a variable frequency microwave source are coupled to a process chamber which encapsulates a package-on-package semiconductor structure. The package-on-package semiconductor structure is simultaneously heated by the variable frequency microwave source at variable frequency, variable temperature, and variable duration and exposed to an elevated pressure by the pressure generator. This combination for microwave heating and elevated pressure limits the amount of warpage introduced while preventing void formation within an electrically-insulating adhesive which couples the substrates of the package-on-package semiconductor structure. | 02-13-2014 |
20140124955 | PACKAGE-ON-PACKAGE STRUCTURE INCLUDING A THERMAL ISOLATION MATERIAL AND METHOD OF FORMING THE SAME - A semiconductor device includes a first package component and a second package component. The first package component has a first die formed on a first substrate. A second package component has a second die formed on a second substrate. A thermal isolation material is attached on the first die, wherein the thermal isolation material thermally insulates the second die from the first die, and the thermal isolation material has a thermal conductivity of from about 0.024 W/mK to about 0.2 W/mK. A first set of conductive elements couples the first package component to the second package component. | 05-08-2014 |
Ai-Tee Ang, Hsin-Chu TW
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20130214431 | Fine-Pitch Package-on-Package Structures and Methods for Forming the Same - A method includes laminating a Non-Conductive Film (NCF) over a first package component, and bonding a second package component on the first package component. The NCF and the second package component are on a same side of the first package component. Pillars of a mold tool are then forced into the NCF to form openings in the NCF. The connectors of the first package component are exposed through the openings. | 08-22-2013 |
20140264858 | Package-on-Package Joint Structure with Molding Open Bumps - A device comprises a bottom package comprising a plurality of metal bumps formed on a first side of the bottom package and a plurality of first bumps formed on a second side of the bottom package, a top package bonded on the bottom package, wherein the top package comprises a plurality of second bumps, and wherein second bumps and respective metal bumps form a joint structure and an underfill layer formed between the top package and the bottom package, wherein the metal bumps are embedded in the underfill layer. | 09-18-2014 |
20150201462 | Systems for Processing Semiconductor Devices, and Methods of Processing Semiconductor Devices - Systems for processing semiconductor devices, and methods of processing semiconductor devices are disclosed. In some embodiments, a system for processing semiconductor devices includes a radiation energy source, a support, and a tool disposable between the support and the radiation energy source. The tool includes apertures adapted to retain a package component over the support. The system includes a cooling device proximate the support. | 07-16-2015 |
20150206779 | SEMICONDUCTOR PROCESSING BOAT DESIGN WITH PRESSURE SENSOR - Presented herein is a device comprising a device processing boat comprising a base at least one unit retainer disposed in the base. The device further comprises a cover having at least one recess configured to accept and retain at least one unit, the at least one recess aligned over, and configured to hold the at least one unit over, at least a portion of the at least one unit retainer. The cover is retained to the device processing boat by the at least one unit retainer. At least one pressure sensor having at least one sensel is disposed in the base and having the sensel configured to sense a clamping force applied by the cover to the at least one unit. | 07-23-2015 |
Ai-Tee Ang, Hsin-Chu City TW
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20140042622 | Fine Pitch Package-on-Package Structure - A package-on-package (PoP) device including a substrate having an array of contact pads arranged around a periphery of the substrate, a logic chip mounted to the substrate inward of the array of contact pads, and non-solder bump structures mounted on less than an entirety of the contact pads available. | 02-13-2014 |
20140193952 | Methods for Metal Bump Die Assembly - Methods for assembling metal bump dies. In an embodiment, a method includes providing an integrated circuit die having a plurality of conductive terminals; depositing solder to form solder depositions on the conductive terminals; providing a substrate having a die attach region on a surface for receiving the integrated circuit die, the substrate having a plurality of conductive traces formed in the die attach region; aligning the integrated circuit die and the substrate and bringing the plurality of conductive terminals and the conductive traces into contact, so that the solder depositions physically contact the conductive traces; and selectively heating the integrated circuit die and the conductive terminals to a temperature sufficient to cause the solder depositions to melt and reflow, forming solder connections between the conductive traces on the substrate and the conductive terminals on the integrated circuit die. Various energy sources are disclosed for the selective heating. | 07-10-2014 |
20140264840 | Package-on-Package Structure - A device comprises a top package mounted on a bottom package, wherein the bottom package comprises a plurality of interconnection components and the bottom package comprises a plurality of first bumps formed on a first side of the bottom package, a semiconductor die is bonded on a second side of the bottom package, wherein the semiconductor die is electrically coupled to the first bumps through the interconnection components and the semiconductor die is located between the top package and the bottom package, and an underfill layer formed between the top package and the bottom package. | 09-18-2014 |
20150014851 | INTERCONNECT STRUCTURE AND METHOD OF FABRICATING SAME - A structure comprises a passivation layer formed over a semiconductor substrate, a connection pad enclosed by the passivation layer, a redistribution layer formed over the passivation layer, wherein the redistribution layer is connected to the connection pad, a bump formed over the redistribution layer, wherein the bump is connected to the redistribution layer and a molding compound layer formed over the redistribution layer. The molding compound layer comprises a flat portion, wherein a bottom portion of the bump is embedded in the flat portion of the molding compound layer and a protruding portion, wherein a middle portion of the bump is surrounded by the protruding portion of the molding compound layer. | 01-15-2015 |
Berniechrisanto Ang, Batangas PH
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20130168898 | COMPENSATING MOLD PLUNGER FOR INTEGRATED CIRCUIT MANUFACTURE - A device and method for manufacturing integrated circuit packaging using a mold plunger with position compensation in a manufacturing setting. In an embodiment, a compensating mold plunger, which may be used during the manufacture of an integrated circuit package, engages a die set on a carrier and within a bushing. This may be done to inject a mold compound on top of the die/carrier. If the bushing that is housing the die/carrier tandem is misaligned with the plunger in any lateral direction, the amount of pressure may be compromised. A compensating mold plunger includes a flexible portion that allows for the head of the plunger to properly engage the die/carrier despite any possible misalignments. Further, different die/carrier combinations may also be used with a compensating mold plunger because the pressure and force applied may be uniform inside a bushing despite the contents of the bushing. | 07-04-2013 |
Bernie Chrisanto Ang, Santo Tomas PH
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20140291842 | ENHANCED FLIP-CHIP DIE ARCHITECTURE - A method of assembling a multi-chip electronic device into a thin electronic package entails inverting a flip-chip die arrangement over a hollow substrate, stacking additional dies on the hollow substrate to form a multi-chip electronic device, and encapsulating the multi-chip electronic device. Containment of the encapsulant can be achieved by joining split substrate portions, or by reinforcing a hollow unitary substrate, using a removable adhesive film. Use of the removable adhesive film facilitates surrounding the multi-chip electronic device with the encapsulant. The adhesive film can also prevent encapsulant from creeping around the substrate to an underside of the substrate that supports solder ball pads for subsequent attachment to a ball grid array (BGA) or a land grid array (LGA). | 10-02-2014 |
Bernie Chrisanto Ang, Sto. Tomas PH
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20140048976 | METHOD AND SYSTEM FOR DETERMINING AND DISPENSING RESIN FOR A COMPRESSION MOLDING PROCESS FLOW - The present disclosure is directed to a system and method for forming a plurality of packaged dice on a carrier, the carrier including a storage medium configured to store an indication of a total number of unpackaged dice on the carrier. The forming includes providing a quantity of molding compound to a molding module based on the total number of the unpackaged dice on the carrier. The providing includes accessing the indication of the total number of the unpackaged dice on the carrier from the storage medium, determining the quantity of molding compound based on the indication of the total number of unpackaged dice on the carrier, and molding the unpackaged dice into the packaged dice using the quantity of molding compound. | 02-20-2014 |
20150179477 | PACKAGED IC DEVICES AND ASSOCIATED IC DEVICE PACKAGING METHODS - A method of making packaged integrated circuit (IC) devices includes mixing a waste thermoset polymer material with a thermosetting polymer to form a mixed thermosetting polymer and packaging IC devices in a molding operation using the mixed thermosetting polymer to thereby recycle the waste thermoset polymer material. A packaged IC device includes an IC device and an encapsulating material surrounding the IC device. The encapsulating material includes a thermoset polymer matrix and thermoset polymer particles dispersed in thermoset polymer matrix. | 06-25-2015 |
Boon Khai Ang, Singaport SG
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20130289456 | GARMENT BASED AIRWAY CLEARANCE SYSTEMS AND METHODS - A garment based airway clearance system for mobilizing secretions in a patient's airway and related methods are disclosed. The garment based airway clearance system comprises a therapy chamber mounted substantially around the circumference of the garment such that inflation of the therapy chamber causing a compressive force to be applied on the thorax or chest of the wearer of the garment. | 10-31-2013 |
Cheng Siang Nicholas Ang, Gisborne AU
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20100088439 | INTELLIGENT CASE FOR HANDHELD COMPUTER - An intelligent case for a handheld computer, the case including a compartment for removably housing the handheld computer; a microcontroller; a first communication device to enable communication between the handheld computer and the microcontroller; one or more recesses for housing one or more data-capture modules; and a second communication device to enable communication between the data-capture modules and the microcontroller; wherein the microcontroller includes: a module manager adapted to handle activation of the data-capture modules, collection of data from the data-capture modules, and communication of the collected data to the hand-held computer; and a first set of applications for controlling, in a first mode, at least some operations of the module manager independently of the handheld computer. | 04-08-2010 |
Ching Seng Ang, Preston AU
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20130028847 | BIOFILM TREATMENT - The invention provides a method of preventing, inhibiting or reducing a | 01-31-2013 |
20130202641 | IMMUNOLOGY TREATMENT FOR BIOFILMS - The invention provides a composition for use in raising an immune response to | 08-08-2013 |
Ching Seng Ang, Kensington AU
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20100092471 | Porphyromonas Gingivalis Polypeptides Useful in the Prevention of Periodontal Disease - The invention is directed to vaccine compositions and methods based on | 04-15-2010 |
Ching Seng Ang, Victoria AU
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20100209362 | Biofilm Treatment - The invention provides a method of preventing, inhibiting or reducing a | 08-19-2010 |
20100297179 | Immunology Treatment for Biofilms - The invention provides a composition for use in raising an immune response to | 11-25-2010 |
20130236488 | PORPHYROMONAS GINGIVALIS POLYPEPTIDES USEFUL IN THE PREVENTION OF PERIODONTAL DISEASE - The invention is directed to vaccine compositions and methods based on | 09-12-2013 |
Endang Saraswati Angka Ang, Shanghai CN
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20100158963 | Topical Composition for Influencing Skin Color - Topical compositions for delivering a desirable color are described. The color suitable to be delivered is stable and the result of colorants comprising an antioxidant like lycopene and a second colorant which is a dye or pigment. The topical compositions are stable notwithstanding the fact that they are free of formaldehyde generating preservatives. | 06-24-2010 |
Endang Saraswati Angka Ang, Bangkok TH
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20090162306 | Topical composition comprising coloring antioxidants - Topical compositions for delivering a desirable color are described. The color suitable to be delivered is stable and the result of colorants comprising an antioxidant like lycopene and a second colorant which is a dye or pigment. The topical compositions are stable notwithstanding the fact that they are free of formaldehyde generating preservatives. | 06-25-2009 |
George Weilun Ang, London CA
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20120278504 | SYSTEM AND METHOD FOR TOKENIZATION OF DATA FOR STORAGE IN A CLOUD - An intercepting proxy server processes traffic between an enterprise user and a cloud application. The intercepting proxy server provides interception of real data elements in communications from the enterprise to the cloud and replacing them with obfuscating tokens which are randomly generated. To the cloud application real data are only visible as tokens. Tokens included in results returned from the cloud, are intercepted by the intercepting proxy server, and replaced with the corresponding real data elements. The obfuscating tokens are not computationally related to the original sensitive value. Each intercepted real data element is stored in a local persistent storage layer, and indexed by the corresponding obfuscating token, allowing the real data element to be retrieved when the token is returned from the cloud, for delivery to the user. | 11-01-2012 |
20120278897 | SYSTEM AND METHOD OF SORT-ORDER PRESERVING TOKENIZATION - An intercepting proxy server processes traffic between an enterprise user and a cloud application. The intercepting proxy server provides interception of real data elements in communications from the enterprise to the cloud and replacing them with obfuscating tokens. Tokens included in results returned from the cloud, are intercepted by the intercepting proxy server, and replaced with the corresponding real data elements. In order for the sort order of the tokens to correspond to the sort order of the corresponding real data elements, a sort order preserving data compression is performed on parts of the real data elements, and the compressed values concatenated with the obfuscated tokens, thus producing sortable tokens which, even though they are obfuscated, appear in the correct sort order in the cloud application. | 11-01-2012 |
Jane Hui Ching Ang, Victoria AU
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20110159154 | JELLY CONFECTIONERY - The invention relates to methods of producing jelly confectionery products, and to jelly confectionery products themselves. The centre-filled jelly confectionery comprises—a centre filling, —a casing, and —a backing layer, wherein the backing layer has a different visual appearance compared to the casing. According to one embodiment, the centre filling is coloured, the casing comprises a colouring agent, and the backing layer comprises said colouring agent of the casing, at a concentration that is greater than in the casing. According to another embodiment, the centre filling is coloured, the casing is uncoloured, and the backing layer is coloured. There is also provided a method for making a centre-filled jelly confectionery, the method comprising: (a) preparing a liquid jelly confectionery composition comprising bulk sweetener and a hydrocolloid gelling agent, (b) cooking the liquid jelly confectionery composition, (c) depositing the liquid jelly confectionery composition into a mould, (d) depositing the centre filling into a mould so that the liquid jelly confectionery composition deposited in (c) forms a casing around the centre filling to produce a casing containing a centre filling, and (e) applying a backing layer to the casing containing a centre filling, wherein the backing layer is provides a different visual appearance compared to the casing, to form the centre-filled jelly. Steps (c) and (d) can be preformed by co-depositing the liquid jelly confectionery composition and centre filling into the mould. | 06-30-2011 |
Kern-Huat Ang, Hsinchu TW
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20080293238 | Semiconductor device and method for fabricating the same - A method for fabricating a semiconductor device is provided. The method of fabricating a semiconductor device provides a semiconductor substrate; forming a first insulating layer, a first conductive layer and a chemical mechanical polishing (CMP) stop layer over the semiconductor substrate in sequence; forming openings in the chemical mechanical polishing (CMP) stop layer and the underlying first conductive layer to expose the first insulating layer, thereby leaving a patterned chemical mechanical polishing (CMP) stop layer and a patterned first conductive layer; forming a second insulating layer on the patterned chemical mechanical polishing (CMP) stop layer, filling in the openings; performing a planarization process to remove a portion of the second insulating layer until the patterned chemical mechanical polishing (CMP) stop layer is exposed, thereby leaving a remaining second insulating layer in the openings; removing the patterned chemical mechanical polishing (CMP) stop layer. | 11-27-2008 |
Kevin Ang, Bochum DE
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20110210983 | UNIFIED VISUAL PRESENTER - The present document relates to the presentation of visual data that is stored on a mobile communication device, in particular to the presentation of sequences of images such as slideshows that may further include animation sequences as well as static images. A method for displaying data includes: transferring visual data from a mobile communication device ( | 09-01-2011 |
Leykim Ang, Yokohama-Shi JP
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20140174995 | PAPER SHEET PROCESSING SYSTEM AND PAPER SHEET PROCESSING METHOD - According to one embodiment, a paper sheet processing system includes a reader unit, a determination unit, a sorting controller, a plurality of storage units, and a display. The reader unit is configured to read paper sheet information. The determination unit is configured to determine a storage destination of the paper sheet based on the paper sheet information read. The sorting controller is configured to control sorting of the paper sheet based on a determination result of the storage destination from the determination unit. The plurality of storage units are configured to store the paper sheets sorted through the sorting control of the sorting controller. The display is configured to display the paper sheet information for each storage destination based on the determination result. | 06-26-2014 |
Ley Kim Ang, Yokohama JP
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20150066188 | SHEET PROCESSING SYSTEM AND SHEET PROCESSING METHOD - According to one embodiment, a sheet processing system includes estimation means which, based on bundle information relating to a number of sheets by denomination of a plurality of the sheets included in a bundle, and weight information of the sheets by denomination, estimates a weight of the bundle, to output estimated weight information, measurement means for measuring a weight of the bundle, to output measured weight information; comparison means for comparing the estimated weight information and the measured weight information, and control means for controlling a processing of the bundle, based on a comparison result of the estimated weight information and the measured weight information. | 03-05-2015 |
Marco Ang, Troinex / Ge CH
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20130153260 | ESP Power Cables - An electrical submersible pump (ESP) power cable for use in oil wells is provided, comprising at least two electrical conductors, a first fluoropolymer layer surrounding each of the at least two electrical conductors, an outer metal armouring, wherein the first fluoropolymer layer surrounding each of the at least two electrical conductors is composed of at least one fluoropolymer chosen among ETFE (ethylene tetrafluoroethylene copolymer), PFA (perfluoroalkoxy copolymer), FEP (fluorinated ethylene propylene copolymer) and/or mixtures thereof. | 06-20-2013 |
Su-Shin Ang, Oxfordshire GB
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20140074407 | DEVICE AND METHOD FOR ESTIMATING ENERGY EXPENDITURE DURING EXERCISE - The present invention relates to a device and method for estimating energy expenditure during exercise. The device includes a module for estimating whether a person is exceeding their anaerobic threshold and, if they are exceeding their anaerobic threshold calculating the additional energy expenditure due to the anaerobic metabolism of ATP. The additional energy expenditure can then be added to an estimate of the energy expenditure due to aerobic metabolism and output to the user in order to provide an estimate of the energy expenditure occurring during anaerobic exercise. | 03-13-2014 |
Su-Shin Ang, Abingdon GB
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20130331723 | RESPIRATION MONITORING METHOD AND SYSTEM - A method of determining a respiration rate from a signal representative of a recorded respiration episode comprises identifying two or more uncorrupted segments within the signal, the uncorrupted segments being separated by corrupted segments, identifying the longest of the uncorrupted segments or the segment with a lowest average absolute deviation (AAD) between respiration peaks or troughs, and determining a respiration rate from the longest uncorrupted segment or the segment with the lowest AAD. | 12-12-2013 |
Sze Vin Julius Ang, Tokyo JP
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20150135137 | User Experience for Processing and Cropping Images - A user experience for processing and cropping images is provided. A menu of image processing modes may be displayed by a computing device. A selection of one of the image processing modes from the menu may then be received. An image may then be received by the computing device. The computing device may then process the received image based on the selected image processing mode. The computing device may then display user controls overlaying the processed image. A selection of one or more of the user controls may then be received to re-frame one or more boundaries of the processed image. The computing device may then send the processed and re-framed image to a productivity application. | 05-14-2015 |
Ting Cheong Ang, Beijing CN
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20090280653 | METHOD FOR FORMING LOW DIELECTRIC CONSTANT FLUORINE-DOPED LAYERS - A method for forming a semiconductor device is provided. In one embodiment, the method includes providing a semiconductor substrate with a surface region. The surface region includes one or more layers overlying the semiconductor substrate. In addition, the method includes depositing a dielectric layer overlying the surface region. The dielectric layer is formed by a CVD process. Furthermore, the method includes forming a diffusion barrier layer overlying the dielectric layer. In addition, the method includes forming a conductive layer overlying the diffusion barrier layer. Additionally, the method includes reducing the thickness of the conductive layer using a chemical-mechanical polishing process. The CVD process utilizes fluorine as a reactant to form the dielectric layer. In addition, the dielectric layer is associated with a dielectric constant equal or less than 3.3. | 11-12-2009 |
Ting Cheong Ang, Shanghai CN
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20090075454 | Method and High Gapfill Capability for Semiconductor Devices - A method of performing an STI gapfill process for semiconductor devices is provided. In a specific embodiment of the invention, the method includes forming an stop layer overlying a substrate. In addition, the method includes forming a trench within the substrate, with the trench having sidewalls, a bottom, and a depth. The method additionally includes forming a liner within the trench, the liner lining the sidewalls and bottom of the trench. Furthermore, the method includes filling the trench to a first depth with a first oxide. The first oxide is filled using a spin-on process. The method also includes performing a first densification process on the first oxide within the trench. In addition, the method includes depositing a second oxide within the trench using an HDP process to fill at least the entirety of the trench. The method also includes performing a second densification process on the first and second oxides within the trench. | 03-19-2009 |
20100006975 | METHOD OF ELIMINATING MICRO-TRENCHES DURING SPACER ETCH - A method of forming a semiconductor structure is provided. The method includes providing a semiconductor substrate with a substrate region. The method also includes forming a pad oxide layer overlying the substrate region. The method additionally includes forming a stop layer overlying the pad oxide layer. Furthermore, the method includes patterning the stop layer and the pad oxide layer to expose a portion of the substrate region. In addition, the method includes forming a trench within an exposed portion of the substrate region, the trench having sidewalls and a bottom and a height. Also, the method includes depositing alternating layers of oxide and silicon nitride to at least fill the trench, the oxide being deposited by an HDP-CVD process. The method additionally includes performing a planarization process to remove a portion of the silicon nitride and oxide layers. In addition, the method includes removing the pad oxide and stop layers. | 01-14-2010 |
20110198734 | METHOD OF IMPROVING A SHALLOW TRENCH ISOLATION GAPFILL PROCESS - A method of forming a graded trench for a shallow trench isolation region is provided. The method includes providing a semiconductor substrate with a substrate region. The method further includes forming a pad oxide layer overlying the substrate region. Additionally, the method includes forming an etch stop layer overlying the pad oxide layer. The method further includes patterning the etch stop layer and the pad oxide layer to expose a portion of the substrate region. In addition, the method includes forming a trench within an exposed portion of the substrate region, the trench having sidewalls and a bottom and a first depth. The method additionally includes forming a dielectric layer overlying the trench sidewalls, the trench bottom, and mesa regions adjacent to the trench. The method further includes removing a first portion of the dielectric layer from the trench bottom to expose the substrate region with a second portion of the dielectric layer remaining on the sidewalls of the trench. In addition, the method includes etching the substrate region to increase the depth of at least a portion of the trench to a second depth. Also, the method includes removing the second portion of the dielectric layer from the trench. | 08-18-2011 |
20120211863 | METHOD OF ELIMINATING MICRO-TRENCHES DURING SPACER ETCH - A semiconductor structure includes a semiconductor substrate with a substrate region and a trench extending into the surface region of the semiconductor substrate. The trench includes sidewalls, a bottom and a depth. The semiconductor structure further includes a trench liner overlying the bottom and the sidewalls of the trench. The semiconductor structure also includes a shallow trench isolation structure filling at least the depth of the trench. The shallow trench isolation structure is formed from alternating layers of silicon nitride and high-density plasma oxide. | 08-23-2012 |
Ting Shih Ang, Hsinchu City TW
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20100192115 | POWER-AWARE DEBUGGING - A debugging system produces displays in response to an IC design and results of a logic simulation of IC behavior based on the IC design. The IC design includes a hardware description language (HDL) model of the IC describing the IC as comprising cell instances communicating via data signals and power sources for supplying power to the cell instances. The IC design also includes power definition markup language (PDML) model describing a power intent of the IC design. The debugging system generates displays representing HDL code that are annotated to indicate how the power intent of the IC design described by the PDML model relates to the portion of the HDL model represented by the display. The debugging system also generates signals trace displays indicating how both the logic and power intent of the IC design affect the value of a user-selected signal at a user-selected time during the logic simulation. | 07-29-2010 |
Wangleng Ang, Aichi-Ken JP
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20090314558 | Voltage Conversion Apparatus and Vehicle Including the Same - A voltage control portion generates a current command for controlling a voltage to an inverter input voltage command. A dividing portion divides the current command into first and second current commands in accordance with a division ratio from a division ratio setting portion. A first current control portion generates a modulated wave for controlling a current of a first converter to the first current command. A second current control portion generates a modulated wave for controlling a current of a second converter to the second current command. | 12-24-2009 |
Wangleng Ang, Toyota-Shi JP
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20090183934 | POWER SUPPLY SYSTEM, VEHICLE PROVIDED WITH THE SAME, POWER SUPPLY SYSTEM CONTROL METHOD AND COMPUTER-READABLE RECORDING MEDIUM BEARING PROGRAM FOR CAUSING COMPUTER TO CONTROL THE POWER SUPPLY SYSTEM - First and second converters are connected in parallel to positive and negative lines, respectively. When a required power is smaller than a reference value, an ECU controls the first and second converters such that one of the first and second converters operates and the other stops. When the required power is equal to or larger than the reference value, the ECU controls the first and second converters such that both the first and second converters operate. | 07-23-2009 |
Wan Leng Ang, Okazaki-Shi JP
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20120248869 | VEHICULAR ELECTRIC POWER UNIT AND METHOD OF CONTROLLING THE SAME - An electric power unit for a vehicle mounted on a vehicle includes a base battery, a boost converter that converts the voltage supplied from the base battery to a target voltage to supply electric power to an inverter, an electric power line that connects the inverter with the boost converter, and a first battery and a second battery whose respective positive electrodes are connected with a node provided on the electric power line to supply electric power to the inverter. | 10-04-2012 |
Wee Han Ang, Ecublens CH
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20090312301 | Transition Metal Complexes for Inhibiting Resistance in the Treatment of Cancer and Metastasis - The present invention relates to organometallic compounds useful in the treatment of metastasis. The organometallic compounds comprise a ligand that is covalently bound to a bioactive compound, which is an inhibitor of a resistance pathway or a derivative thereof. Preferably, the organometallic compounds are half-sandwich (“piano-stool”) compounds. The compounds of the present invention offer a high variability with respect to the bioactive compound and to the nature of the ligand bound to a central transition metal. | 12-17-2009 |
20150190362 | TRANSITION METAL COMPLEXES FOR INHIBITING RESISTANCE IN THE TREATMENT OF CANCER AND METASTASIS - The present invention relates to organometallic compounds useful in the treatment of metastasis. The organometallic compounds comprise a ligand that is convalently bound to a bioactive compound, which is an inhibitor of a resistance pathway or a derivative thereof. Preferably, the organometallic compounds are half-sandwich (“piano-stool”) compounds. The compounds of the present invention offer a high variability with respect to the bioactive compound and to the nature of the ligand bound to a central transition metal. | 07-09-2015 |
Woon T. Ang, Edmonton CA
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20110189748 | ULTRASOUND ENHANCED GROWTH OF MICROORGANISMS. - A method of increasing the rate of growth, useful product production, or protein expression of a microorganism includes the step of exposing the microorganism to ultrasound having a frequency greater than about 1 MHz. | 08-04-2011 |
20110275054 | ENHANCED ANIMAL CELL GROWTH USING ULTRASOUND - A method of increasing the rate of growth of an animal cell or cell culture include the use of ultrasound at a frequency greater than about 1 MHz. | 11-10-2011 |
20120100525 | ULTRASOUND ENHANCED GROWTH OF MICROORGANISMS - A method of increasing the rate of growth, useful product production, or protein expression of a microorganism includes the step of exposing the microorganism to ultrasound having a frequency greater than about 1 MHz. | 04-26-2012 |
20130022957 | ENHANCED ANIMAL CELL GROWTH USING ULTRASOUND - A method of increasing animal cell growth and monoclonal antibody production in an animal cell or cell culture includes the use of ultrasound at a frequency greater than about 1 MHz. | 01-24-2013 |
Woon Tiong Ang, Edmonton CA
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20150202920 | APPARATUS FOR HANDLING A VEHICLE WHEEL - A vehicle wheel handler comprises a base frame comprising base arms and an end base member forming a generally U-shape. A mobile frame comprises supporting arms and an end member forming a generally U-shape. An elevation guide system is joined to the base aims and disposed proximate a distal end of the base arm. The elevation guide system is configured for slidable engagement with a one of the supporting aims to enable vertical movement of the mobile frame. A roller support system is joined to the supporting arms to enable a rotational positioning of a supported vehicle wheel. A lifting member is joined to the supporting aims. A lever frame comprises a handle and lever arms. The lever arms are in pivotal engagement with the base arms and in engagement with the lifting member for enabling a vertical positioning of the supported vehicle wheel. | 07-23-2015 |