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Ang

Cheng Siang Nicholas Ang, Gisborne AU

Patent application numberDescriptionPublished
20100088439INTELLIGENT CASE FOR HANDHELD COMPUTER - An intelligent case for a handheld computer, the case including a compartment for removably housing the handheld computer; a microcontroller; a first communication device to enable communication between the handheld computer and the microcontroller; one or more recesses for housing one or more data-capture modules; and a second communication device to enable communication between the data-capture modules and the microcontroller; wherein the microcontroller includes: a module manager adapted to handle activation of the data-capture modules, collection of data from the data-capture modules, and communication of the collected data to the hand-held computer; and a first set of applications for controlling, in a first mode, at least some operations of the module manager independently of the handheld computer.04-08-2010

Ching Seng Ang, Victoria AU

Patent application numberDescriptionPublished
20100209362Biofilm Treatment - The invention provides a method of preventing, inhibiting or reducing a 08-19-2010
20100297179Immunology Treatment for Biofilms - The invention provides a composition for use in raising an immune response to 11-25-2010

Ching Seng Ang, Kensington AU

Patent application numberDescriptionPublished
20100092471Porphyromonas Gingivalis Polypeptides Useful in the Prevention of Periodontal Disease - The invention is directed to vaccine compositions and methods based on 04-15-2010

Endang Saraswati Angka Ang, Bangkok TH

Patent application numberDescriptionPublished
20090162306Topical composition comprising coloring antioxidants - Topical compositions for delivering a desirable color are described. The color suitable to be delivered is stable and the result of colorants comprising an antioxidant like lycopene and a second colorant which is a dye or pigment. The topical compositions are stable notwithstanding the fact that they are free of formaldehyde generating preservatives.06-25-2009

Endang Saraswati Angka Ang, Shanghai CN

Patent application numberDescriptionPublished
20100158963Topical Composition for Influencing Skin Color - Topical compositions for delivering a desirable color are described. The color suitable to be delivered is stable and the result of colorants comprising an antioxidant like lycopene and a second colorant which is a dye or pigment. The topical compositions are stable notwithstanding the fact that they are free of formaldehyde generating preservatives.06-24-2010

Jane Hui Ching Ang, Victoria AU

Patent application numberDescriptionPublished
20110159154JELLY CONFECTIONERY - The invention relates to methods of producing jelly confectionery products, and to jelly confectionery products themselves. The centre-filled jelly confectionery comprises—a centre filling, —a casing, and —a backing layer, wherein the backing layer has a different visual appearance compared to the casing. According to one embodiment, the centre filling is coloured, the casing comprises a colouring agent, and the backing layer comprises said colouring agent of the casing, at a concentration that is greater than in the casing. According to another embodiment, the centre filling is coloured, the casing is uncoloured, and the backing layer is coloured. There is also provided a method for making a centre-filled jelly confectionery, the method comprising: (a) preparing a liquid jelly confectionery composition comprising bulk sweetener and a hydrocolloid gelling agent, (b) cooking the liquid jelly confectionery composition, (c) depositing the liquid jelly confectionery composition into a mould, (d) depositing the centre filling into a mould so that the liquid jelly confectionery composition deposited in (c) forms a casing around the centre filling to produce a casing containing a centre filling, and (e) applying a backing layer to the casing containing a centre filling, wherein the backing layer is provides a different visual appearance compared to the casing, to form the centre-filled jelly. Steps (c) and (d) can be preformed by co-depositing the liquid jelly confectionery composition and centre filling into the mould.06-30-2011

Kern-Huat Ang, Hsinchu TW

Patent application numberDescriptionPublished
20080293238Semiconductor device and method for fabricating the same - A method for fabricating a semiconductor device is provided. The method of fabricating a semiconductor device provides a semiconductor substrate; forming a first insulating layer, a first conductive layer and a chemical mechanical polishing (CMP) stop layer over the semiconductor substrate in sequence; forming openings in the chemical mechanical polishing (CMP) stop layer and the underlying first conductive layer to expose the first insulating layer, thereby leaving a patterned chemical mechanical polishing (CMP) stop layer and a patterned first conductive layer; forming a second insulating layer on the patterned chemical mechanical polishing (CMP) stop layer, filling in the openings; performing a planarization process to remove a portion of the second insulating layer until the patterned chemical mechanical polishing (CMP) stop layer is exposed, thereby leaving a remaining second insulating layer in the openings; removing the patterned chemical mechanical polishing (CMP) stop layer.11-27-2008

Kevin Ang, Bochum DE

Patent application numberDescriptionPublished
20110210983UNIFIED VISUAL PRESENTER - The present document relates to the presentation of visual data that is stored on a mobile communication device, in particular to the presentation of sequences of images such as slideshows that may further include animation sequences as well as static images. A method for displaying data includes: transferring visual data from a mobile communication device (09-01-2011

Ting Cheong Ang, Beijing CN

Patent application numberDescriptionPublished
20090280653METHOD FOR FORMING LOW DIELECTRIC CONSTANT FLUORINE-DOPED LAYERS - A method for forming a semiconductor device is provided. In one embodiment, the method includes providing a semiconductor substrate with a surface region. The surface region includes one or more layers overlying the semiconductor substrate. In addition, the method includes depositing a dielectric layer overlying the surface region. The dielectric layer is formed by a CVD process. Furthermore, the method includes forming a diffusion barrier layer overlying the dielectric layer. In addition, the method includes forming a conductive layer overlying the diffusion barrier layer. Additionally, the method includes reducing the thickness of the conductive layer using a chemical-mechanical polishing process. The CVD process utilizes fluorine as a reactant to form the dielectric layer. In addition, the dielectric layer is associated with a dielectric constant equal or less than 3.3.11-12-2009

Ting Cheong Ang, Shanghai CN

Patent application numberDescriptionPublished
20090075454Method and High Gapfill Capability for Semiconductor Devices - A method of performing an STI gapfill process for semiconductor devices is provided. In a specific embodiment of the invention, the method includes forming an stop layer overlying a substrate. In addition, the method includes forming a trench within the substrate, with the trench having sidewalls, a bottom, and a depth. The method additionally includes forming a liner within the trench, the liner lining the sidewalls and bottom of the trench. Furthermore, the method includes filling the trench to a first depth with a first oxide. The first oxide is filled using a spin-on process. The method also includes performing a first densification process on the first oxide within the trench. In addition, the method includes depositing a second oxide within the trench using an HDP process to fill at least the entirety of the trench. The method also includes performing a second densification process on the first and second oxides within the trench.03-19-2009
20100006975METHOD OF ELIMINATING MICRO-TRENCHES DURING SPACER ETCH - A method of forming a semiconductor structure is provided. The method includes providing a semiconductor substrate with a substrate region. The method also includes forming a pad oxide layer overlying the substrate region. The method additionally includes forming a stop layer overlying the pad oxide layer. Furthermore, the method includes patterning the stop layer and the pad oxide layer to expose a portion of the substrate region. In addition, the method includes forming a trench within an exposed portion of the substrate region, the trench having sidewalls and a bottom and a height. Also, the method includes depositing alternating layers of oxide and silicon nitride to at least fill the trench, the oxide being deposited by an HDP-CVD process. The method additionally includes performing a planarization process to remove a portion of the silicon nitride and oxide layers. In addition, the method includes removing the pad oxide and stop layers.01-14-2010
20110198734METHOD OF IMPROVING A SHALLOW TRENCH ISOLATION GAPFILL PROCESS - A method of forming a graded trench for a shallow trench isolation region is provided. The method includes providing a semiconductor substrate with a substrate region. The method further includes forming a pad oxide layer overlying the substrate region. Additionally, the method includes forming an etch stop layer overlying the pad oxide layer. The method further includes patterning the etch stop layer and the pad oxide layer to expose a portion of the substrate region. In addition, the method includes forming a trench within an exposed portion of the substrate region, the trench having sidewalls and a bottom and a first depth. The method additionally includes forming a dielectric layer overlying the trench sidewalls, the trench bottom, and mesa regions adjacent to the trench. The method further includes removing a first portion of the dielectric layer from the trench bottom to expose the substrate region with a second portion of the dielectric layer remaining on the sidewalls of the trench. In addition, the method includes etching the substrate region to increase the depth of at least a portion of the trench to a second depth. Also, the method includes removing the second portion of the dielectric layer from the trench.08-18-2011

Patent applications by Ting Cheong Ang, Shanghai CN

Ting Shih Ang, Hsinchu City TW

Patent application numberDescriptionPublished
20100192115POWER-AWARE DEBUGGING - A debugging system produces displays in response to an IC design and results of a logic simulation of IC behavior based on the IC design. The IC design includes a hardware description language (HDL) model of the IC describing the IC as comprising cell instances communicating via data signals and power sources for supplying power to the cell instances. The IC design also includes power definition markup language (PDML) model describing a power intent of the IC design. The debugging system generates displays representing HDL code that are annotated to indicate how the power intent of the IC design described by the PDML model relates to the portion of the HDL model represented by the display. The debugging system also generates signals trace displays indicating how both the logic and power intent of the IC design affect the value of a user-selected signal at a user-selected time during the logic simulation.07-29-2010

Wangleng Ang, Aichi-Ken JP

Patent application numberDescriptionPublished
20090314558Voltage Conversion Apparatus and Vehicle Including the Same - A voltage control portion generates a current command for controlling a voltage to an inverter input voltage command. A dividing portion divides the current command into first and second current commands in accordance with a division ratio from a division ratio setting portion. A first current control portion generates a modulated wave for controlling a current of a first converter to the first current command. A second current control portion generates a modulated wave for controlling a current of a second converter to the second current command.12-24-2009

Wangleng Ang, Toyota-Shi JP

Patent application numberDescriptionPublished
20090183934POWER SUPPLY SYSTEM, VEHICLE PROVIDED WITH THE SAME, POWER SUPPLY SYSTEM CONTROL METHOD AND COMPUTER-READABLE RECORDING MEDIUM BEARING PROGRAM FOR CAUSING COMPUTER TO CONTROL THE POWER SUPPLY SYSTEM - First and second converters are connected in parallel to positive and negative lines, respectively. When a required power is smaller than a reference value, an ECU controls the first and second converters such that one of the first and second converters operates and the other stops. When the required power is equal to or larger than the reference value, the ECU controls the first and second converters such that both the first and second converters operate.07-23-2009

Wee Han Ang, Ecublens CH

Patent application numberDescriptionPublished
20090312301Transition Metal Complexes for Inhibiting Resistance in the Treatment of Cancer and Metastasis - The present invention relates to organometallic compounds useful in the treatment of metastasis. The organometallic compounds comprise a ligand that is covalently bound to a bioactive compound, which is an inhibitor of a resistance pathway or a derivative thereof. Preferably, the organometallic compounds are half-sandwich (“piano-stool”) compounds. The compounds of the present invention offer a high variability with respect to the bioactive compound and to the nature of the ligand bound to a central transition metal.12-17-2009

Woon T. Ang, Edmonton CA

Patent application numberDescriptionPublished
20110189748ULTRASOUND ENHANCED GROWTH OF MICROORGANISMS. - A method of increasing the rate of growth, useful product production, or protein expression of a microorganism includes the step of exposing the microorganism to ultrasound having a frequency greater than about 1 MHz.08-04-2011