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Andricacos
Caliopi Andricacos, Chicago, IL US
| Patent application number | Description | Published |
|---|---|---|
| 20100051474 | METHOD AND COMPOSITION FOR ELECTRO-CHEMICAL-MECHANICAL POLISHING - Methods and compositions for electro-chemical-mechanical polishing (e-CMP) of silicon chip interconnect materials, such as copper, are provided. The methods include the use of compositions according to the invention in combination with pads having various configurations. | 03-04-2010 |
Panayotis Andricacos, Croton-On-Hudson, NY US
| Patent application number | Description | Published |
|---|---|---|
| 20080237053 | STRUCTURE COMPRISING A BARRIER LAYER OF A TUNGSTEN ALLOY COMPRISING COBALT AND/OR NICKEL - An interconnection structure comprising a substrate having a dielectric layer with a via opening therein; wherein the opening has an underlayer of cobalt and/or nickel therein, barrier layer of an alloy of cobalt and/or nickel; and tungsten is provided. | 10-02-2008 |
Panayotis C. Andricacos, Croton-On-Hudson, NY US
| Patent application number | Description | Published |
|---|---|---|
| 20100047990 | METHOD OF FABRICATING A HIGH Q FACTOR INTEGRATED CIRCUIT INDUCTOR - A method of forming an inductor. The method including: (a) forming a dielectric layer on a top surface of a substrate; after (a), (b) forming a lower trench in the dielectric layer; after (b), (c) forming a resist layer on a top surface of the dielectric layer; after (c), (d) forming an upper trench in the resist layer, the upper trench aligned to the lower trench, a bottom of the upper trench open to the lower trench; and after (d), (e) completely filling the lower trench and at least partially filling the upper trench with a conductor in order to form the inductor. | 02-25-2010 |
| 20100051474 | METHOD AND COMPOSITION FOR ELECTRO-CHEMICAL-MECHANICAL POLISHING - Methods and compositions for electro-chemical-mechanical polishing (e-CMP) of silicon chip interconnect materials, such as copper, are provided. The methods include the use of compositions according to the invention in combination with pads having various configurations. | 03-04-2010 |