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| 20090150216 | Method and System for Providing Real Estate Information Using a Computer Network, Such as the Internet - The present invention provides methods and systems for providing real-estate information using a computer network, such as the Internet. A buyer information web page showing relevant buyer list information in an easy-to-read, summary format is created and displayed to a real estate agent. Buyer information provided includes summaries of various aspects of information needed by a real estate agent to effectively represent and assist a buyer. Examples of information provided include a potential buyer name, a new activity summary summarizing newly-listed properties and other activity meeting the buyer's profile, a new views summary summarizing any views of detailed property information by the buyer using an online property data search and information system provided by the agent, and a new tags summary summarizing any properties that the buyer or the agent finds of particular interest. Moreover, a comparative market analysis (CMA) list web page showing relevant CMA information in an easy-to-read, summary format is also created and displayed to the real estate agent. | 06-11-2009 |
| 20100057524 | METHOD AND SYSTEM FOR PROVIDING REAL ESTATE INFORMATION USING A COMPUTER NETWORK, SUCH AS THE INTERNET - The present invention provides methods and systems for providing real-estate information using a computer network, such as the Internet. A buyer information web page showing relevant buyer list information in an easy-to-read, summary format is created and displayed to a real estate agent. Buyer information provided includes summaries of various aspects of information needed by a real estate agent to effectively represent and assist a buyer. Examples of information provided include a potential buyer name, a new activity summary summarizing newly-listed properties and other activity meeting the buyer's profile, a new views summary summarizing any views of detailed property information by the buyer using an online property data search and information system provided by the agent, and a new tags summary summarizing any properties that the buyer or the agent finds of particular interest. Moreover, a comparative market analysis (CMA) list web page showing relevant CMA information in an easy-to-read, summary format is also created and displayed to the real estate agent. | 03-04-2010 |
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| 20100252851 | LED PACKAGE WITH INCREASED FEATURE SIZES - A light emitter package having increased feature sizes for improved luminous flux and efficacy. An emitter chip is disposed on a submount with a lens that covers the emitter chip. In some cases, the ratio of the width of the light emitter chip to the width of said lens in a given direction is 0.5 or greater. Increased feature sizes allow the package to emit light more efficiently. Some packages include submounts having dimensions greater than 3.5 mm square used in conjunction with larger emitter chips. Materials having higher thermal conductivities are used to fabricate the submounts, providing the package with better thermal management. | 10-07-2010 |
| 20110053297 | SUBMOUNTS FOR SEMICONDUCTOR LIGHT EMITTING DEVICES AND METHODS OF FORMING PACKAGED LIGHT EMITTING DEVICES INCLUDING DISPENSED ENCAPSULANTS - A submount for mounting an LED chip includes a substrate, a die attach pad configured to receive an LED chip on an upper surface of the substrate, a first meniscus control feature on the substrate surrounding the die attach pad and defining a first encapsulant region of the upper surface of the substrate, and a second meniscus control feature on the substrate surrounding the first encapsulant region and defining a second encapsulant region of the upper surface of the substrate. The first and second meniscus control features may be substantially coplanar with the die attach pad. A packaged LED includes a submount as described above and further includes an LED chip on the die attach pad, a first encapsulant on the substrate within the first encapsulant region, and a second encapsulant on the substrate within the second encapsulant region and covering the first encapsulant. Method embodiments are also disclosed. | 03-03-2011 |
| 20110180834 | Packaged Light Emitting Devices - Packaged semiconductor light emitting device are provided including a reflector having a lower sidewall portion defining a reflective cavity. A light emitting device is positioned in the reflective cavity. A first quantity of cured encapsulant material having a first index of refraction is provided in the reflective cavity including the light emitting device. A second quantity of cured encapsulant material having a second index of refraction, different from the first index of refraction, is provided on the first quantity of cured encapsulant material. The first and second index of refraction are selected to provide a buried lens in the reflective cavity. | 07-28-2011 |
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| 20080272386 | Light Emitting Devices for Light Conversion and Methods and Semiconductor Chips for Fabricating the Same - Broad spectrum light emitting devices and methods and semiconductor chips for fabricating such devices include a light emitting element, such as a diode or laser, which emits light in a predefined range of frequencies. The light emitting element includes a shaped substrate suitable for light extraction through the substrate and a cavity in the substrate proximate the light emitting element. For example, a trench adjacent the light emitting element may be provided. The cavity/trench is configured to contain light conversion material such that light extracted from sidewalls of the cavity/trench passes through the light conversion material contained in the cavity/trench. Methods of fabricating such devices and/or chips are also provided. | 11-06-2008 |
| 20090014731 | LED Chip Design for White Conversion - A light emitting diode is disclosed, together with associated wafer structures, and fabrication and mapping techniques. The diode includes an active portion, a raised border on the top surface of the active portion and around the perimeter of the top surface of the active portion, a resin in the space defined by the border and the top surface of the active portion, and phosphor particles in the resin that convert the frequencies emitted by the active portion. | 01-15-2009 |
| 20090039365 | SEMICONDUCTOR LIGHT EMITTING DEVICES WITH APPLIED WAVELENGTH CONVERSION MATERIALS AND METHODS OF FORMING THE SAME - A semiconductor structure includes an active region configured to emit light upon the application of a voltage thereto, a window layer configured to receive the light emitted by the active region, and a plurality of discrete phosphor-containing regions on the window layer and configured to receive light emitted by the active region and to convert at least a portion of the received light to a different wavelength than a wavelength of light emitted by the active region. Methods of forming a semiconductor structure including an active region configured to emit light and a window layer include forming a plurality of discrete phosphor-containing regions on the window layer. | 02-12-2009 |
| 20100006883 | LIGHT EMITTING DIODES INCLUDING BARRIER LAYERS/SUBLAYERS AND MANUFACTURING METHODS THEREFOR - Semiconductor light emitting devices, such as light emitting diodes, include a substrate, an epitaxial region on the substrate that includes a light emitting region such as a light emitting diode region, and a multilayer conductive stack including a reflector layer, on the epitaxial region. A barrier layer is provided on the reflector layer and extending on a sidewall of the reflector layer. The multilayer conductive stack can also include an ohmic layer between the reflector and the epitaxial region. The barrier layer further extends on a sidewall of the ohmic layer. The barrier layer can also extend onto the epitaxial region outside the multilayer conductive stack. The barrier layer can be fabricated as a series of alternating first and second sublayers. | 01-14-2010 |
| 20110037080 | METHODS FOR COMBINING LIGHT EMITTING DEVICES IN A PACKAGE AND PACKAGES INCLUDING COMBINED LIGHT EMITTING DEVICES - Methods of forming a light emitting device package assembly include defining a chromaticity region in a two dimensional chromaticity space within a 10-step MacAdam ellipse of a target chromaticity point, and subdividing the defined chromaticity region into at least three chromaticity subregions, providing a plurality of light emitting devices that emit light having a chromaticity that falls within the defined chromaticity region, selecting at least three of the plurality of light emitting devices, wherein each of the three light emitting devices emits light from a different one of the chromaticity subregions. The at least three light emitting devices are selected from chromaticity subregions that are complementary relative to the target chromaticity point to at least one other chromaticity subregion from which a light emitting device is selected. | 02-17-2011 |
| 20110056734 | ELECTRONIC DEVICE SUBMOUNTS WITH THERMALLY CONDUCTIVE VIAS AND LIGHT EMITTING DEVICES INCLUDING THE SAME - A submount for an electronic device includes an electrically insulating substrate including first and second surfaces and having a thickness between the first and second surfaces, a thermally conductive pad on the first surface of the substrate, and a thermally conductive via extending from the first surface of the substrate toward the second surface of the substrate and having a length that is less than the thickness of the substrate. The thermally conductive via has a higher thermal conductivity than a thermal conductivity of the substrate. Methods of forming submounts are also disclosed. | 03-10-2011 |
| 20110089456 | SEMICONDUCTOR LIGHT EMITTING DEVICES WITH APPLIED WAVELENGTH CONVERSION MATERIALS AND METHODS FOR FORMING THE SAME - A semiconductor structure includes an active region configured to emit light upon the application of a voltage thereto, a window layer configured to receive the light emitted by the active region, and a plurality of discrete phosphor-containing regions on the window layer and configured to receive light emitted by the active region and to convert at least a portion of the received light to a different wavelength than a wavelength of light emitted by the active region. Methods of forming a semiconductor structure including an active region configured to emit light and a window layer include forming a plurality of discrete phosphor-containing regions on the window layer. | 04-21-2011 |
| 20110121333 | Solid State Light Emitting Apparatus with Thermal Management Structures and Methods of Manufacturing - Provided are apparatus and methods corresponding to a solid state light emitting element. Such methods include mounting, to a thermally conductive component, a solid state light emitting element that includes first and second electrical connection points that are configured to be conductively engaged on a first side of a circuit structure. The solid state light emitting element is electrically insulated from the thermally conductive component to provide that electrical connections are arranged on the first side of the circuit structure and heat is conducted to a second side of the circuit structure that is opposite the first side of the circuit structure. | 05-26-2011 |
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| 20090039375 | SEMICONDUCTOR LIGHT EMITTING DEVICES WITH SEPARATED WAVELENGTH CONVERSION MATERIALS AND METHODS OF FORMING THE SAME - A semiconductor device includes a semiconductor light emitting device (LED) that emits light having a first peak wavelength upon the application of a voltage thereto, and first and second phosphor-containing regions on the LED that receive the light and convert at least a portion of the light to light having a longer wavelength. The first phosphor-containing region is between the second phosphor-containing region and the LED so that a light ray emitted by the LED passes through the first phosphor-containing region before passing through the second phosphor-containing region. The first phosphor-containing region is configured to convert light emitted by the LED to light having a second peak wavelength and the second phosphor-containing region is configured to convert light emitted by the LED to light having a third peak wavelength, shorter than the second peak wavelength. | 02-12-2009 |
| 20090315061 | METHODS OF ASSEMBLY FOR A SEMICONDUCTOR LIGHT EMITTING DEVICE PACKAGE - Methods of assembly for a semiconductor light emitting device package may include positioning a submount on a mounting substrate with a flux material therebetween and at least substantially free of solder material therebetween. The submount has a metal bonding layer facing the mounting substrate. A semiconductor light emitting device is positioned on a top side of the submount with a flux material therebetween to provide an assembled stack. The assembled stack is reflowed to attach the metal bonding layer of the submount to the mounting substrate and to attach the light emitting device to the submount. | 12-24-2009 |
| 20100321893 | Heat Dissipation Packaging for Electrical Components - The emphasis for transporting heat energy to ambient in an efficient manner is critical for many semiconductor components to maintain highest performance. A heat dissipation system with low thermal resistance for the packaging of high power electrical components, and the methods for assembling a low thermal resistance system, is proposed. Unique in this method is the emphasis on moving heat with a primary thermal conductor away from the source and creating large area interface zones to improve heat transfer. | 12-23-2010 |
| 20110121345 | POWER SURFACE MOUNT LIGHT EMITTING DIE PACKAGE - A light emitting die package is provided which includes a metal substrate having a first surface and a first conductive lead on the first surface. The first conductive lead is insulated from the substrate by an insulating film. The first conductive lead forms a mounting pad for mounting a light emitting device. The package includes a metal lead electrically connected to the first conductive lead and extending away from the first surface. | 05-26-2011 |
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| 20100286197 | Carboxamide Derivatives As Therapeutic Agents - This invention provides certain compounds, methods of their preparation, pharmaceutical compositions comprising the compounds, and their use in treating human or animal disorders. The compounds of the invention are useful as modulators of the interaction between the receptor for advanced glycated end products (RAGE) and its ligands, such as advanced glycated end products (AGEs), S100/calgranulin/EN-RAGE, β-amyloid and amphoterin, and for the management, treatment, control, or as an adjunct treatment for diseases in humans caused by RAGE. Such diseases or disease states include acute and chronic inflammation, the development of diabetic late complications such as increased vascular permeability, nephropathy, atherosclerosis, and retinopathy, the development of Alzheimer's disease, erectile dysfunction, and tumor invasion and metastasis. | 11-11-2010 |
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| 20090216013 | Heteroaryl-Ureas and Their Use as Glucokinase Activators - This invention relates to compounds of formula (I) | 08-27-2009 |
| 20100204288 | Heteroaryl-Ureas and Their Use as Glucokinase Activators - This invention relates to compounds of formula (I) | 08-12-2010 |
| 20100331379 | BENZAMIDE GLUCOKINASE ACTIVATORS - The present invention relates to N-heteroaryl-benzamides, pharmaceutical compositions comprising the same, and methods of using the same. The N-heteroaryl-benzamides are useful in diseases or medical conditions mediated by glucokinase. | 12-30-2010 |
| 20110060019 | HETEROARYL-UREAS AND THEIR USE AS GLUCOKINASE ACTIVATORS - This invention relates to compounds of formula (I) | 03-10-2011 |
| 20110082144 | N-HETEROARYL INDOLE CARBOXAMIDES AND ANALOGUES THEREOF, FOR USE AS GLUCOKINASE ACTIVATORS IN THE TREATMENT OF DIABETES - This invention relates to compounds that are activators of glucokinase and thus may be useful for the management, treatment, control, or adjunct treatment of diseases, where increasing glucokinase activity is beneficial. The compounds are of the general formula (I) | 04-07-2011 |
| 20110160198 | SUBSTITUTED AZOANTHRACENE DERIVATIVES, PHARMACEUTICAL COMPOSITIONS, AND METHODS OF USE THEREOF - The present invention is directed to substituted azoanthracene derivatives or pharmaceutically acceptable salts thereof that modulate the human GLP-1 receptor and that may be useful in the treatment of diseases, disorders, or conditions in which modulation of the human GLP-1 receptor is beneficial, such as diabetes mellitus type 2. The invention is also directed to pharmaceutical compositions comprising these compounds and to the use of these compounds and compositions in the treatment of such diseases, disorders, or conditions in which modulation of the human GLP-1 receptor is beneficial. | 06-30-2011 |
| 20110201604 | Substituted Fused Imidazole Derivatives, Pharmaceutical Compositions, and Methods of Use Thereof - Substituted fused imidazole derivatives, methods of their preparation, pharmaceutical compositions comprising a substituted fused imidazole derivative, and methods of use in treating inflammation are provided. The substituted fused imidazole derivatives may control the activity or the amount or both the activity and the amount of heme-oxygenase. | 08-18-2011 |
