Patent application number | Description | Published |
20090245520 | DIGITAL CONTENT PROTECTION METHODS - An digital content protection method and device are disclosed. In the method, digital content to be delivered from a content provider to a consumer terminal is retrieved. The digital content is encoded to prevent unauthorized playback. The encoded digital content and a key for decoding the content are separately transmitted from the content provider to the consumer terminal, playback of the encoded digital content requires decoding with the key. | 10-01-2009 |
20090254717 | STORAGE SYSTEM AND METHOD THEREOF - A storage system and a method thereof. The storage system comprises first and second storage devices, first and second analog front ends, and a controller. The first and second analog front ends, coupled to the first and second storage devices, receive first and second analog data from the first and second drive devices for conversion to first and second digital data. The controller, coupled to the first and second analog front ends, comprises a signal processor and a common memory. The signal processor receives the first and second digital data to perform first and second digital signal processing and access the common memory. The common memory is coupled to the signal processor to be accessed thereby. | 10-08-2009 |
20130168857 | MOLDED INTERPOSER PACKAGE AND METHOD FOR FABRICATING THE SAME - The invention provides a molded interposer package and a method for fabricating the same. The molded interposer package includes a plurality of metal studs. A molding material encapsulates the metal studs leaving the bottom surfaces of the metal studs exposed. A first chip is disposed on the molding material, connecting to the top surfaces of the metal studs. A plurality of solder balls connects and contacts to the bottom surfaces of the metal studs. | 07-04-2013 |
20140035095 | SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING BASE FOR SEMICONDUCTOR PACKAGE - The invention provides a semiconductor package and a method for fabricating a base for a semiconductor package. The semiconductor package includes a conductive trace embedded in a base. A semiconductor device is mounted on the conductive trace via a conductive structure. | 02-06-2014 |
20140127865 | MOLDED INTERPOSER PACKAGE AND METHOD FOR FABRICATING THE SAME - A method includes the operations performing a first anisotropic etching process to remove a portion of the metal sheet from a top surface of the metal sheet, thereby forming a plurality of first recesses in the metal sheet; mounting a carrier on the top surface of the metal sheet, covering the first recesses; performing a second anisotropic etching process to remove a portion of the metal sheet under the first recesses from the bottom surface of the metal sheet; filling a molding material from the bottom surface of the metal sheet, leaving the bottom surface of the metal sheet exposed; forming a passivation layer on the top surface of the metal sheet, having a plurality of openings therethrough; forming a plurality of first metal vias through the opening; and forming a solder mask layer on the passivation layer, leaving the first metal vias exposed. | 05-08-2014 |
20140151867 | SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING BASE FOR SEMICONDUCTOR PACKAGE - The invention provides a semiconductor package and a method for fabricating a base for a semiconductor package. The semiconductor package includes a conductive trace embedded in a base. A semiconductor device is mounted on the conductive trace via a conductive structure. | 06-05-2014 |
20140191396 | SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING BASE FOR SEMICONDUCTOR PACKAGE - In one configuration, a semiconductor package includes a conductive trace embedded in a base and a semiconductor device mounted on the conductive trace via a conductive structure, wherein the conductive structure is a bump structure and the width of the bump structure is bigger than the width of the conductive trace. In another configuration, a method for fabricating a semiconductor package includes providing a base, forming at least one conductive trace on the base, forming an additional insulation material on the base, and defining patterns upon the additional insulation material, wherein the pattern is formed on at least one conductive trace, wherein the conductive structure is a bump structure and the width of the bump structure is bigger than the width of the conductive trace. | 07-10-2014 |
20140377913 | MOLDED INTERPOSER PACKAGE AND METHOD FOR FABRICATING THE SAME - A method for fabricating a molded interposer package includes performing a first anisotropic etching process to remove a portion of the metal sheet from a top surface of the metal sheet, thereby forming a plurality of first recesses in the metal sheet, forming a molding material covering the top surface, filling the first recesses, forming a plurality of first via openings in the molding material, wherein the first via openings expose the top surface, forming a plurality of first metal vias in the first via openings and a plurality of first redistribution layer patterns respectively on the first metal vias, performing a second anisotropic etching process to remove a portion of the metal sheet from a bottom surface of the metal sheet until a bottom of the molding material is exposed, and forming a solder mask layer on the molding material, leaving the first redistribution layer patterns exposed. | 12-25-2014 |