| Patent application number | Description | Published |
|---|
| 20090264558 | Capped polyurethane prepolymers and heat-curable epoxy resin compositions - The invention relates to differently blocked polyurethane polymers of formula, to their use as impact resistance modifiers, to heat-curable epoxy resin compositions containing said impact resistance modifiers and to methods for the production of said compositions. The invention also relates to bonding methods using said compositions and to articles produced by said methods. | 10-22-2009 |
| 20090288766 | Heat-curable epoxy resin composition containing one blocked and one epoxide-terminated polyurethane prepolymer - Discussed are heat-curable epoxy resin compositions containing at least one epoxy resin A with, on average, more than one epoxide group per molecule, at least one curing agent B for epoxy resins, which is activated by an increased temperature, at least one terminally blocked polyurethane prepolymer of formula (I) and at least one epoxide-terminated polyurethane prepolymer of formula (II). The epoxy resin compositions are particularly suitable for use as one-component, heat-curable adhesives and are characterized by excellent mechanical properties, high glass transition temperatures and high impact resistance. | 11-26-2009 |
| 20100009196 | Heat-curable epoxy resin composition comprising a blocked polyurethane prepolymer - Discussed are heat-curable epoxy resin compositions containing at least one epoxy resin with, on average, more than one epoxide group per molecule, at least one curing agent for epoxy resins, which is activated by an increased temperature and at least one terminally blocked polyurethane prepolymer. Said epoxy resin compositions are particularly suitable for use as one-component, heat-curable adhesives and are characterized by excellent mechanical properties, high glass transition temperatures and high impact resistance. | 01-14-2010 |
| 20100035041 | DERIVATIZED SOLID EPOXY RESIN AND USES THEREOF - Derivatized solid epoxy resins of the formula (I), which are outstandingly suitable as impact modifiers; and compositions which include such derivatized solid epoxy resins and are outstandingly suitable as one-component heat-curable adhesives, and as structural foams which have a high impact resistance and high mechanical stability. | 02-11-2010 |
| 20100048828 | ESTER PRE-EXTENDED EPOXY-TERMINATED VISCOSIFIERS AND METHOD FOR PRODUCING THE SAME - Viscosifiers, especially terminated polymers that have functional terminal groups, the polymers being pre-extended by polyols and being reacted to give polymers that are terminated by other functional groups, are produced. The viscosifiers have a low content in educts or educt descendants that deteriorate the properties of compositions. The formation of high-molecular addition products is considerably reduced or even excluded so that the products obtained have low viscosity and good storage stability. The epoxy-terminated polymer of formula (I) is especially preferred. | 02-25-2010 |
| 20100087567 | EPOXY GROUP-TERMINATED POLYMERS, THE COMPOSITIONS THEREOF AND THE USE THEREOF AS IMPACT RESISTANCE MODIFIERS - The present invention relates to epoxy group-terminated polymers of the formula (I). Said epoxy group-terminated polymers are suited extremely well as impact resistance modifiers, particularly in epoxy resin compostions. They are particularly suited for use in heat-curing epoxy resin adhesives. It has been found that such epoxy resin compostions not only have excellent mechanical properties and high glass transition temperatures, but also above all improved impact resistance properties, both at room temperature and at low temperatures. | 04-08-2010 |
| 20100087588 | Hydroxy Ester Pre-Extended Epoxy-Terminated Viscosifiers and Method for Producing the Same - Embodiments relate to viscosifiers that are terminated polymers that have functional terminal groups. The polymers being pre-extended by polyepoxides and being reacted to give polymers that are terminated by other functional groups. The viscosifiers have a low content in educts or educt descendants that deteriorate the properties of compositions and considerably reduce or even exclude the formation of high-molecular addition products so that the products obtained have low viscosity and good storage stability. | 04-08-2010 |
| 20100116433 | Low-Temperature Impact Resistant Thermosetting Epoxide Resin Compositions With Solid Epoxide Resins - The invention relates to compositions containing at least one solid epoxide resin A, at least one polymer B of formula (I), at least one thixotropic agent C made from a urea derivative and at least one curing agent for epoxide resins D activated by high temperatures. The compositions are particularly suitable for use as adhesives. Low-temperature impact-resistant adhesives can be produced for use in particular as structural adhesives. | 05-13-2010 |
| 20100184924 | Amide or Thioester Pre-Extended Epoxy-Terminated Viscosifiers and Method for Producing the Same - The invention relates to viscosifiers, especially terminated polymers that have functional terminal groups, said polymers being pre-extended by polyamines, polymercaptans, (poly)aminoalcohols, (poly)mercaptoalcohols or (poly)aminomercaptans and being reacted to give polymers that are terminated by other functional groups. The viscosifiers have a low content in educts or educt descendants that deteriorate the properties of compositions. They are also characterized in that the formation of high-molecular addition products is considerably reduced or even excluded so that products obtained have low viscosity and good storage stability. The epoxy-terminated polymer of formula (I) is especially preferred. | 07-22-2010 |
| 20100273005 | HEAT-CURING EPOXY RESIN COMPOSITION CONTAINING NON-AROMATIC UREAS AS ACCELERATOR - The present invention relates to heat-curing epoxy resin compositions, which are characterized by high impact strength, good storage stability, and a low curing temperature. The epoxy resin compositions are suitable for use as a construction shell adhesive and for producing structural foams. They can already be cured in so-called bottom-baking conditions. Furthermore, it has been found that the use of an accelerator of the formula (Ia) or (Ib) results in an increase of the impact strength of heat-curing epoxy resin compositions. | 10-28-2010 |
| 20100297457 | (Meth) acrylate composition featuring reduced oxygen inhibition - The invention relates to two-component or multicomponent compositions comprising at least the following ingredients: a) at least one (meth)acrylate; b) at least one compound of formula (I); c) at least one inorganic salt or a metal complex compound of at least one metal selected among the group encompassing the transition metals; and d) at least one peroxide or at least one perester or at least one hydroperoxide. A first component K | 11-25-2010 |
| 20100323202 | USE OF CARBOXYLIC ACID HYDRAZIDE FOR DE-BONDING POLYURETHANE ADHESIVES - This disclosure relates to the use of carboxylic acid hydrazide for de-bonding (e.g., detaching) polyurethane adhesives. The carboxylic acid hydrazide is present in the polyurethane adhesive as a solid in free form and is thus not incorporated in the polymer. When the adhesive is heated to a temperature of at least 80° C., the polymer is thermally degraded. With such an adhesive, components that are bonded in such a way can be detached in a simple method, by which the repair, the use or the recycling of the components is more easily possible. | 12-23-2010 |
| 20110030893 | POLYURETHANE POLYMER BASED ON AN AMPHIPHILIC BLOCK COPOLYMER AND ITS USE AS IMPACT MODIFIER - Novel impact strength modifiers which are obtained by reaction of amphiphilic block copolymers. These impact strength modifiers are suitable in particular for use in heat-curing epoxy resin adhesives. In particular, combinations of different impact strength modifiers are also suitable for use in heat-curing epoxy resin adhesives. Also disclosed are methods of bonding heat-stable substrates. | 02-10-2011 |
| 20110039109 | ACTIVATOR FOR EPOXY RESIN COMPOSITIONS - Activators for heat-curing epoxy resin compositions, as well as use thereof in heat-curing epoxy resin compositions. These activators are distinguished by a good activation effect as well as good storage stability. | 02-17-2011 |
| 20110067813 | HEAT-CURING EPOXY RESIN COMPOSITION COMPRISING AN ACCELERATOR HAVING HETEROATOMS - A heat-curing epoxy resin composition that includes an epoxy resin, a curing agent, an accelerator, and an optional toughener. The epoxy resin compositions are suitable in particular for use as bodyshell adhesives and for preparation of structural foams. An accelerator of formula (I) results in increased impact strength the of heat-curing epoxy resin compositions. | 03-24-2011 |
| 20110114257 | REACTION PRODUCTS BASED ON AMPHIPHILIC BLOCK COPOLYMERS AND THEIR USE AS IMPACT MODIFIER - Novel impact modifiers obtained by the reaction of amphiphilic block copolymers. These impact modifiers are suitable for use in thermosetting epoxy resin adhesives. The impact modifiers include a carboxylic acid group prepared from the reaction of an intramolecular anhydride of a di- or tricarboxylic acid with at least one amphiphilic block copolymer including at least one hydroxyl group. A method for adhesively binding heat-stable substrates includes applying a single-component thermosetting epoxy resin composition to the surface of a first heat-stable substrate; contacting the epoxy resin composition with the surface of second heat-stable substrate; heating the epoxy resin composition to 20-100° C.; bringing the two substrates and the epoxy resin composition into contact with a wash liquid; and heating the epoxy resin composition to 140-220° C. | 05-19-2011 |
| 20110130479 | ADHESION PROMOTER COMPOUNDS FOR OILED STEEL - Compounds of formula (I) in the field of heat-curing and two-component epoxy resin compositions, which may be used as adhesion promoters or adhesion promoter ingredients and methods of producing such compounds. Such compounds may be prepared as liquids. A heat-curing epoxy resin composition including at least one epoxy resin with more than one epoxy group per molecule on the average; at least one curing agent for epoxy resins, which is activated by elevated temperature; and at least one compound of formula (I). | 06-02-2011 |
| 20110155320 | SILANE/UREA COMPOUND AS A HEAT-ACTIVATABLE CURING AGENT FOR EPOXIDE RESIN COMPOSITIONS - Silanes of formula (I), or of substrates whose surface is coated or derivatized with a silane of formula (I), as a curing agent for epoxy resins which is activatable at elevated temperature. Such thermosetting epoxy resin compositions allow a large reduction in the curing temperature without great impairment of their storage stability. | 06-30-2011 |
