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| 20090196917 | Liposomal Formulations of Hydrophobic Lactone Drugs in the Presence of Metal Ions - Disclosed herein is a liposomal formulation that comprises a liposome and a liquid carrier. In the liposomal formulation, the liposome comprises a hydrophobic lactone drug and has an intraliposomal metal ion concentration higher than the metal ion concentration of the liquid carrier. Also disclosed herein is a method for active loading of a hydrophobic lactone drug into a liposome. The method includes preparing a liposome in the presence of a metal salt solution, an acid form of a counterion of the metal salt being membrane permeable, such that the liposome preparation contains entrapped metal ion. The method further includes forming a liposome with high intraliposomal pH by separating extravesicular metal salt solution from the liposome by exposing the liposome to a metal salt-free solution, resulting in diffusion of the acid form of the counterion out of the liposome and formation of an intraliposomal pH higher than that of the metal salt-free solution. The method also includes exposing the liposome with high intraliposomal pH to an isoosmolal solution containing a hydrophobic lactone drug, the isoosmolal solution having a pH lower than the intraliposomal pH, such that the hydrophobic lactone drug accumulates in the liposome predominantly in its ring-opened form. | 08-06-2009 |
| 20090196918 | Liposomal formulations of hydrophobic lactone drugs in the presence of metal ions - Provided is a liposome comprising a hydrophobic lactone drug and a cyclodextrin, wherein the liposome has an intraliposomal pH and cyclodextrin concentration such that upon administration of the liposome to a subject, the liposome exhibits a uniform release profile of the hydrophobic lactone drug. Also provided is a method of administering a hydrophobic lactone drug to a subject in need thereof. The method comprises administering a liposome to the subject in need, wherein the liposome comprises the hydrophobic lactone drug and a cyclodextrin. The liposome has an intraliposomal pH and cyclodextrin concentration such that upon administration of the liposome to the subject, the liposome exhibits a uniform release profile of the hydrophobic lactone drug. | 08-06-2009 |
| 20090246268 | LIPOSOMAL, RING-OPENED CAMPTOTHECINS WITH PROLONGED, SITE-SPECIFIC DELIVERY OF ACTIVE DRUG TO SOLID TUMORS - A method for preparing a stable dispersion of a camptothecin, camptothecin prodrug, or analog thereof for administration to a patient in need thereof includes preparing a solution of the camptothecin, wherein the solution has a pH which places substantially an entirety of that camptothecin in a carboxylate form. The camptothecin may be a neutral camptothecin. The solution is next loaded into a liposome including at least one lipid, which may be a phospholipid. An intraliposomal pH is maintained which preserves substantially an entirety of the camptothecin in the carboxylate form. The liposomal dispersion is administered to an individual in need thereof, whereby the liposomes accumulate at and permeate into tumor tissue and an active, lactone form camptothecin is released in situ at the tumor site. Compositions formulated in accordance with the described method for treatment of a cancer in an animal in need thereof are provided also. | 10-01-2009 |
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| 20080278542 | Micro-Fluid Ejection Devices Having Reduced Input/Output Addressable Heaters - Micro-fluid ejection devices, methods for making micro-fluid ejection, heads, and micro-fluid ejection heads having N actuators on a first substrate and logic capable of driving the N actuators on a second substrate. The ejection heads also have less than N electrical connections between the first and second substrates. | 11-13-2008 |
| 20080299361 | Composite Ceramic Substrate For Micro-Fluid Ejection Head - A composite ceramic substrate for receiving an ejection head chip for a micro-fluid ejection head and a method for making the composite ceramic substrate. The substrate includes a high temperature previously fired ceramic base having a substantially planarized first surface and at least one fluid supply slot therethrough. A low temperature co-fired ceramic (LTCC) tape layer bundle having at least two LTCC tape layers is attached to the ceramic base at an interface between the LTCC tape layer bundle and the first surface of the ceramic base. The LTTC tape layer bundle has at least one chip pocket therein and at least one of the LTCC tape layers includes a plurality of conductors. | 12-04-2008 |
| 20080319845 | PRINTING INCENTIVE AND OTHER INCENTIVE METHODS AND SYSTEMS - Embodiments of the invention provide printing incentive methods and systems. In one embodiment, a method of providing advertising content to a customer can be provided. The method can include receiving information associated with a customer. In addition, the method can include receiving information associated with at least one advertiser. Furthermore, the method can include associating at least one keyword with the at least one advertiser. Moreover, the method can include comparing the at least one keyword to a portion of information associated with the customer. Further, the method can include outputting advertising content to the customer based at least in part on the comparison. | 12-25-2008 |
| 20090189954 | INK JETTING STRUCTURE HAVING PROTECTED CONNECTIONS - An ink jetting structure includes a substrate that has a first surface and a second surface. A heater chip is mounted to the second surface of the substrate, and includes a first set of electrical contacts. A printhead circuit member has a third surface, a fourth surface, and an opening configured to receive the heater chip with the first set of electrical contacts of the heater chip being exposed through the opening. The third surface is mounted to the second surface of the substrate. The fourth surface has a second set of electrical contacts attached by wire bonds to the first set of electrical contacts. The third surface has a third set of electrical contacts electrically coupled to the second set of electrical contacts, and electrically connected to a flexible cable for coupling to corresponding contacts on a printer. | 07-30-2009 |
| 20090256891 | HEATER CHIPS WITH SILICON DIE BONDED ON SILICON SUBSTRATE AND METHODS OF FABRICATING THE HEATER CHIPS - A heater chip has a substrate and at least one die, made of silicon, and a bond non-adhesively attaching them. The substrate, thick enough to resist bowing, has ink supply vias from back to front surfaces. The die has ink flow vias from back to front surfaces and circuitry including heater elements adjacent the front surface interspersed with ink flow vias. The at least one die is superimposed on the substrate such that ink supply vias of the substrate align with ink flow vias of the die and portions of substrate front surface and die back surface are aligned, disposed adjacent and facing one another. The bond formed between substrate and die facing surface portions is hermetic and equal in strength to a Si—O bond. By separate processing of carrier and device wafers, size and features of substrate and die can be tailored to provide a desired heater chip construction. | 10-15-2009 |
| 20100132874 | Composite Ceramic Substrate for Micro-Fluid Ejection Head - A composite ceramic substrate for receiving an ejection head chip for a micro-fluid ejection head and a method for making the composite ceramic substrate. The substrate includes a high temperature previously fired ceramic base having a substantially planarized first surface and at least one fluid supply slot therethrough. A low temperature co-fired ceramic (LTCC) tape layer bundle having at least two LTCC tape layers is attached to the ceramic base at an interface between the LTCC tape layer bundle and the first surface of the ceramic base. The LTCC tape layer bundle has at least one chip pocket therein and at least one of the LTCC tape layers includes a plurality of conductors. | 06-03-2010 |
| 20100199497 | Micro-Fluid Ejection Heads with Chips in Pockets - Micro-fluid ejection heads and methods for fabricating micro-fluid ejection heads are provided, including those that use a non-conventional substrate and methods for making large array micro-fluid ejection heads. One such ejection head includes a substrate having a device surface with a plurality of fluid ejection actuator devices and a pocket disposed adjacent thereto. A chip associated with the plurality of fluid ejection actuator devices is attached in the chip pocket adjacent to the device surface of the substrate. A conductive material is deposited adjacent to the device surface of the substrate and in electrical communication with the chip. | 08-12-2010 |
| 20110122194 | High Volume Ink Delivery Manifold for a Page Wide Printhead - An ink manifold for supplying liquid ink to a heater chip of an inkjet printhead. Ink ports on one side of the manifold feed liquid ink to the ink channels on the other side of the manifold, and thus to the backside ink trenches of the heater chip. The placement and number of ink ports formed in the ink manifold are optimized so that when the heater chip and the ink manifold are scaled down in size, the ink carrying capacity of the printhead components is not compromised. Similarly, when the ink manifold is scaled down, the optimization process allows the seal width between the ink port features of the manifold to be maintained above a specified minimum. | 05-26-2011 |
| 20110205305 | HEATER CHIPS WITH SILICON DIE BONDED ON SILICON SUBSTRATE - A heater chip has a substrate and at least one die, made of silicon, and a bond non-adhesively attaching them. The substrate, thick enough to resist bowing, has ink supply vias from back to front surfaces. The die has ink flow vias from back to front surfaces and circuitry including heater elements adjacent the front surface interspersed with ink flow vias. The at least one die is superimposed on the substrate such that ink supply vias of the substrate align with ink flow vias of the die and portions of substrate front surface and die back surface are aligned, disposed adjacent and facing one another. The bond formed between substrate and die facing surface portions is hermetic and equal in strength to a Si—O bond. A metal through the die connects a conductor on a front of the substrate to a heater element on a front of the die. | 08-25-2011 |
| 20110292122 | SKEWED NOZZLE ARRAYS ON EJECTION CHIPS FOR MICRO-FLUID APPLICATIONS - A micro-fluid ejection head has multiple ejection chips joined adjacently to create a lengthy array across a media to-be-imaged. The chips have fluid firing elements arranged along skewed fluid vias to enable seamless stitching of fluid ejections. The firing elements are energized to eject fluid and ones are spaced according to colors or fluid types. Overlapping firing elements serve redundancy efforts during imaging for reliable print quality. Variable chips sizes and shapes are disclosed as are relationships between differently colored fluid vias. Skew angles range variously each with noted advantages. Singulating chips from larger wafers provide still further embodiments. | 12-01-2011 |
| 20110292124 | LAMINATE CONSTRUCTS FOR MICRO-FLUID EJECTION DEVICES - A micro-fluid ejection head has an ejection chip to expel fluid. It connects to a laminate construct. The construct has vertically configured wiring layers interspersed with non-conductive layers, such as carbon fiber layers. An upper of the wiring layers electrically connects to the ejection chip. The upper layer may also support a planar undersurface of the chip directly on a surface or in a recessed pocket. The two can connect with a die bond, such as one having silica or boron nitride. Fluid connections exist between ink feed slots of the chip and the laminate construct. A silicon tile or other material may also fluidly interconnect with the two. A plastic manifold optionally supports the laminate construct and may fluidly connect to it. The wiring layers of the laminate contemplate ground, power, and various bond pads. Other construct layers contemplate prepreg or core FR4 layers. | 12-01-2011 |
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| 20080202709 | SINGLE CORD DRIVE FOR COVERINGS FOR ARCHITECTURAL OPENINGS - A shade for architectural openings incorporating a single cord drive featuring automatic braking of the shade when the user releases the drive cord. In a preferred embodiment, an automatic tilt-open mechanism is provided to tilt the shade open when the shade is in the fully extended down position. | 08-28-2008 |
| 20080245488 | SHUTTER-TYPE COVERING FOR ARCHITECTURAL OPENINGS - A Venetian-style window blind ( | 10-09-2008 |
| 20090101293 | LIGHT-BLOCKING HEADRAIL FOR ARCHITECTURAL COVERING - A light-blocking head-rail, and architectural coverings incorporating the headrail, include a light-blocking strip adapted to block out light. Embodiments of the light-blocking strip include bristles which tend to block substantially all of the light that might otherwise pass between a top surface of the headrail and a top beam of an architectural opening. The bristles can conform and fill in gaps between the top surface of the headrail and the top beam, and can further be compressed by a bracket connecting the headrail to the top beam of the architectural opening. Additional embodiments of the light-blocking strip are made from a flexible material that can be easily deflected and compressed when installed within an architectural opening. | 04-23-2009 |
| 20090242332 | SPRING MOTOR FOR DRIVE FOR COVERINGS FOR ARCHITECTURAL OPENINGS - A spring motor and drag brake for use in coverings for architectural openings. | 10-01-2009 |
| 20110031343 | SINGLE CORD DRIVE FOR COVERINGS FOR ARCHITECTURAL OPENINGS - A shade for architectural openings incorporating a single cord drive featuring automatic braking of the shade when the user releases the drive cord. In a preferred embodiment, an automatic tilt-open mechanism is provided to tilt the shade open when the shade is in the fully extended down position. | 02-10-2011 |
