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Ananthakrishnan
Avinash N. Ananthakrishnan, Hillsboro, OR US
| Patent application number | Description | Published |
|---|---|---|
| 20120095607 | Method, Apparatus, and System for Energy Efficiency and Energy Conservation Through Dynamic Management of Memory and Input/Output Subsystems - According to one embodiment of the invention, an integrated circuit device comprises an interconnect, at least one compute engine and a control unit. Coupled to the at least one compute engine via the interconnect, the control unit to analyze heuristic information from the at least one compute engine and to increase or decrease a bandwidth of the interconnect based on the heuristic information. | 04-19-2012 |
Hariharan Ananthakrishnan, Choolaimedu IN
| Patent application number | Description | Published |
|---|---|---|
| 20110286454 | Method and System for Transparently Transcoding a Multicast Stream - A method and apparatus for transparently transforming a multicast stream is provided. The method includes transforming the multicast stream in a content engine. The multicast stream has a first bandwidth. The content engine receives a request for the multicast stream from a multicast receiver with a second bandwidth availability. Thereafter, the content engine transforms the multicast stream to a multicast stream with a third bandwidth. The third bandwidth is less than or equal to the second bandwidth. The transformed multicast stream is sent to the multicast receiver. | 11-24-2011 |
Nisha Ananthakrishnan, Chandler, AZ US
| Patent application number | Description | Published |
|---|---|---|
| 20090170247 | MAGNETIC PARTICLES FOR LOW TEMPERATURE CURE OF UNDERFILL - Electronic devices and methods for fabricating electronic devices are described. One embodiment includes a method comprising providing a first body and a second body, and electrically coupling the first body to the second body using a plurality of solder bumps, wherein a gap remains between the first body and the second body. The method also includes placing an underfill material into the gap between the first body and the second body, the underfill material comprising magnetic particles in a polymer composition. The method also includes curing the underfill material in the gap by applying a magnetic field powered by alternating current, to induce heat in the magnetic particles, wherein the heat in the magnetic particles heats the polymer composition, and the magnetic field is applied for a sufficient time to cure the polymer composition. Other embodiments are described and claimed. | 07-02-2009 |
| 20100078806 | MICROELECTRONIC PACKAGE WITH WEAR RESISTANT COATING - A microelectronic package is provided. The microelectronic package includes a semiconductor substrate and a die having a top surface and a bottom surface, wherein the bottom surface of the die is coupled to the semiconductor substrate. The microelectronic package also includes a nanomaterial layer disposed on the top surface of the die. | 04-01-2010 |
| 20120074597 | FLEXIBLE UNDERFILL COMPOSITIONS FOR ENHANCED RELIABILITY - Underfill materials for fabricating electronic devices are described. One embodiment includes an underfill composition including an epoxy mixture, an amine hardener component, and a filler. The epoxy mixture may include a first epoxy comprising a bisphenol epoxy, a second epoxy comprising a multifunctional epoxy, and a third epoxy comprising an aliphatic epoxy, the aliphatic epoxy comprising a silicone epoxy. The first, second, and third epoxies each have a different chemical structure. Other embodiments are described and claimed. | 03-29-2012 |
Subramanyan Ananthakrishnan, Bangalore IN
| Patent application number | Description | Published |
|---|---|---|
| 20090302979 | TOOL FREE CONTACT BLOCK - The present invention relates to an auxiliary contact block. The auxiliary contact block comprises a housing and a tool free latching mechanism. The tool free latching mechanism further comprising a stationary member integral to the housing and a latching bar. The latching bar comprising a button in communication with a moveable member by a central body. | 12-10-2009 |
Viswesh Ananthakrishnan, Sunnyvale, CA US
| Patent application number | Description | Published |
|---|---|---|
| 20100246584 | MAINTAINING PACKET ORDER USING HASH-BASED LINKED-LIST QUEUES - Ordering logic ensures that data items being processed by a number of parallel processing units are unloaded from the processing units in the original per-flow order that the data items were loaded into the parallel processing units. The ordering logic includes a pointer memory, a tail vector, and a head vector. Through these three elements, the ordering logic keeps track of a number of “virtual queues” corresponding to the data flows. A round robin arbiter unloads data items from the processing units only when a data item is at the head of its virtual queue. | 09-30-2010 |
| 20120027019 | MAINTAINING PACKET ORDER USING HASH-BASED LINKED-LIST QUEUES - Ordering logic ensures that data items being processed by a number of parallel processing units are unloaded from the processing units in the original per-flow order that the data items were loaded into the parallel processing units. The ordering logic includes a pointer memory, a tail vector, and a head vector. Through these three elements, the ordering logic keeps track of a number of “virtual queues” corresponding to the data flows. A round robin arbiter unloads data items from the processing units only when a data item is at the head of its virtual queue. | 02-02-2012 |