| Patent application number | Description | Published |
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| 20080240204 | METHOD AND SYSTEM FOR CHANNEL ESTIMATION - The present invention is directed to a system and method for channel estimation for a communication channel such as, for example, that found in a wireless communication network. One or more synchronization and channel estimate symbols can be combined to compute a refined channel estimate. | 10-02-2008 |
| 20080240261 | METHOD AND SYSTEM FOR CHANNEL ESTIMATION IN BURST MODE - The present invention is directed to a system and method for channel estimation for a communication channel such as, for example, that found in a wireless communication network. One or more channel estimates or channel observables can be combined to compute a refined channel estimate, for example, when the channel estimates or channel observables are from the same channel. | 10-02-2008 |
| 20080247480 | METHODS AND SYSTEMS FOR DETECTING A NARROW-BAND INTERFERER - Various embodiments of the systems and methods described herein may be used to compute a minimum variance unbiased estimator by receiving a first OFDM signal at a pilot tone, receiving a second OFDM signal sent in the same frequency band and determining a differential phase metric between the first OFDM signal and the second OFDM signal. In some embodiments, the differential phase metric may be used to diversity combine synchronization statistics. In various embodiments, the differential phase metric may be used to detect a narrow-band interference. | 10-09-2008 |
| 20080247481 | METHODS AND SYSTEMS FOR COMPUTING A MINIMUM VARIANCE UNBIASED ESTIMATOR OF CARRIER AND SAMPLING CLOCK FREQUENCY - Various embodiments of the systems and methods described herein may be used to compute a minimum variance unbiased estimator by receiving a first OFDM signal at a pilot tone, receiving a second OFDM signal sent in the same frequency band and determining a differential phase metric between the first OFDM signal and the second OFDM signal. In some embodiments, the differential phase metric may be used to diversity combine synchronization statistics. In various embodiments, the differential phase metric may be used to detect a narrow-band interference. | 10-09-2008 |
| 20090067532 | METHODS AND SYSTEMS FOR DIVERSITY COMBINING OF SYNCHRONIZATION STATISTICS IN OFDM SYSTEMS - Various embodiments of the systems and methods described herein may be used to compute a minimum variance unbiased estimator by receiving a first OFDM signal at a pilot tone, receiving a second OFDM signal sent in the same frequency band and determining a differential phase metric between the first OFDM signal and the second OFDM signal. In some embodiments, the differential phase metric may be used to diversity combine synchronization statistics. In various embodiments, the differential phase metric may be used to detect a narrow-band interference. | 03-12-2009 |
| Patent application number | Description | Published |
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| 20080246958 | Multiple surface inspection system and method - A system for inspecting components is provided. The system includes a prism having a first end, a second end, a first reflecting surface, and a second reflecting surface. The first end of the prism is located in a plane that is parallel to and axially separated from a plane of one or more of a plurality of inspection pieces. An image data system is disposed beyond the second end of the prism and generates image data of one or more of the inspection piece that includes a top surface of at least one of the inspection pieces and at least one side of at least one of the inspection pieces. An inspection piece transportation system, such as a pick and place tool or conveyor, moves a plurality of inspection pieces past the first end of the prism through an inspection area. | 10-09-2008 |
| 20090034831 | Patterned wafer defect inspection system and method - A system for inspecting semiconductor devices is provided. The system includes a region system selecting a plurality of regions from a semiconductor wafer. A golden template system generates a region golden template for each region, such as to allow a die image to be compared to golden templates from a plurality of regions. A group golden template system generates a plurality of group golden templates from the region golden templates, such as to allow the die image to be compared to golden templates from a plurality of group golden templates. | 02-05-2009 |
| 20090073426 | Multiple Surface Inspection System and Method - A system for on-the-fly inspection of components is provided. The system includes a prism structure disposed below an inspection item transit path. An image data system is disposed below the prism structure. A lighting assembly provides a first lighting source to illuminate a plurality of sides of an inspection item and a second lighting source to illuminate a bottom of the inspection item. | 03-19-2009 |
| 20100188486 | System and method for inspecting a wafer - An inspection system for inspecting a semiconductor wafer. The inspection system comprises an illumination setup for supplying broadband illumination. The broadband illumination can be of different contrasts, for example brightfield and darkfield broadband illumination. The inspection system further comprises a first image capture device and a second image capture device, each configured for receiving broadband illumination to capture images of the semiconductor wafer while the semiconductor wafer is in motion. The system comprises a number of tube lenses for enabling collimation of the broadband illumination. The system also comprises a stabilizing mechanism and an objective lens assembly. The system further comprises a thin line illumination emitter and a third image capture device for receiving thin line illumination to thereby capture three-dimensional images of the semiconductor wafer. The system comprises a reflector assembly for enabling the third image capture device to receive illumination reflected from the semiconductor wafer in multiple directions. | 07-29-2010 |
| 20100188499 | System and method for inspecting a wafer - A method and a system for inspecting a wafer. The system comprises an optical inspection head, a wafer table, a wafer stack, a XY table and vibration isolators. The optical inspection head comprises a number of illuminators, image capture devices, objective lens and other optical components. The system and method enables capture of brightfield images, darkfield images, 3D profile images and review images. Captured images are converted into image signals and transmitted to a programmable controller for processing. Inspection is performed while the wafer is in motion. Captured images are compared with reference images for detecting defects on the wafer. An exemplary reference creation process for creating reference images and an exemplary image inspection process is also provided by the present invention. The reference image creation process is an automated process. | 07-29-2010 |
| 20100189339 | System and method for inspecting a wafer - A method for inspecting a wafer. The method comprises a training process for creating reference images. The training process comprises capturing a number of images of a first wafer of unknown quality, each of the number of images of the first wafer being captured at a predetermined contrast illumination and each of the number of images of the first wafer comprising a plurality of pixels. The training process also comprises determining a plurality of reference intensities for each of the plurality of pixels of each of the number of images of the first wafer, calculating a plurality of statistical parameters for the plurality of reference intensities of each of the plurality of pixels of each of the number of images of the first wafer, and selecting a plurality of reference images from the plurality of images of the first wafer based on the calculated plurality of statistical parameters. The method for inspecting the wafer further comprises capturing an image of a second wafer, the second wafer being of an unknown quality, selecting a first reference image from the plurality of reference images, and comparing the captured image of the second wafer with the first reference image to thereby determine at least one of presence and type of defect on the second wafer. | 07-29-2010 |
