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Alur
Amruthavalli P. Alur, Chandler, AZ US
| Patent application number | Description | Published |
|---|---|---|
| 20090053466 | Heat resistant halogen free substrate core material - In one embodiment, a substrate includes a core material formed from a filler including aluminum trihydrate and a secondary filler material. The secondary filler material has a secondary decomposition reaction that occurs at a temperature higher than a reflow temperature reached during processing of the substrate, or the secondary filler traps water released at reflow temperature by aluminum trihydrate. Other embodiments are described and claimed. | 02-26-2009 |
| 20090246462 | METHOD OF MANUFACTURING A SUBSTRATE FOR A MICROELECTRONIC DEVICE, AND SUBSTRATE FORMED THEREBY - A method of manufacturing a substrate for a microelectronic device comprises providing a dielectric material ( | 10-01-2009 |
| 20100078805 | METHOD AND CORE MATERIALS FOR SEMICONDUCTOR PACKAGING - A semiconductor package comprises a semiconductor substrate that may comprise a core. The core may comprise one or more materials selected from a group comprising ceramics and glass dielectrics. The package further comprises a set of one or more inner conductive elements that is provided on the core, a set of one or more outer conductive elements that is provided on an outer side of the substrate, and a semiconductor die to couple to the substrate via one or more of the outer conductive elements. Example materials for the core may comprise one or more from alumina, zirconia, carbides, nitrides, fused silica, quartz, sapphire, and Pyrex. A laser may be used to drill one or more plated through holes to couple an inner conductive element to an outer conductive element. A dielectric layer may be formed in the substrate to insulate an outer conductive element from the core or an inner conductive element. | 04-01-2010 |
| 20110135883 | METHOD OF MANUFACTURING A SUBSTRATE FOR A MICROELECTRONIC DEVICE, AND SUBSTRATE FORMED THEREBY - A method of manufacturing a substrate for a microelectronic device comprises providing a dielectric material ( | 06-09-2011 |
Amruthavalll P. Alur, Chandler, AZ US
| Patent application number | Description | Published |
|---|---|---|
| 20100289154 | METHOD AND CORE MATERIALS FOR SEMICONDUCTOR PACKAGING - A semiconductor package comprises a semiconductor substrate that may comprise a core. The core may comprise one or more materials selected from a group comprising ceramics and glass dielectrics. The package further comprises a set of one or more inner conductive elements that is provided on the core, a set of one or more outer conductive elements that is provided on an outer side of the substrate, and a semiconductor die to couple to the substrate via one or more of the outer conductive elements. Example materials for the core may comprise one or more from alumina, zirconia, carbides, nitrides, fused silica, quartz, sapphire, and Pyrex. A laser may be used to drill one or more plated through holes to couple an inner conductive element to an outer conductive element. A dielectric layer may be formed in the substrate to insulate an outer conductive element from the core or an inner conductive element. | 11-18-2010 |
Hemant H. Alur, Haskell, NJ US
| Patent application number | Description | Published |
|---|---|---|
| 20100324110 | Self Solidifying Bioerodible Barrier Implant - Provided are bioerodible compositions that can be implanted into cavities of mammalian tissue as a liquid or semi-liquid and which solidify upon exposure to body temperature of the mammal. The implants erode over a prescribed period of time and elute a drug. The implants also form a seal with the skin or mucosa surrounding the cavity to prevent the entry of bacterial pathogens. | 12-23-2010 |
Hemant H. Alur, Parsippany, NJ US
| Patent application number | Description | Published |
|---|---|---|
| 20090170955 | Fast Release Paracetamol Tablets - A pharmaceutical composition such as a swallow tablet or capsule formulation is described comprising paracetamol, calcium carbonate, at least one binding agent and at least one disintegrating agent in the form of a granulate, optionally combined with one or more pharmaceutically acceptable extragranular components. | 07-02-2009 |
Pallavi Alur, Chandler, AZ US
| Patent application number | Description | Published |
|---|---|---|
| 20090321932 | Coreless substrate package with symmetric external dielectric layers - A thin die Package Substrate is described that may be produced using existing chemistry. In one example, a package substrate is built over a support material. A dry film photoresist layer is formed over the package substrate. The support material is removed from the package substrate. The dry film photoresist layer is removed from the substrate and the substrate is finished for use with a package. | 12-31-2009 |