Patent application number | Description | Published |
20130207688 | Apparatus and Methods for Time-Multiplex Field-Programmable Gate Arrays - A time-multiplexed field programmable gate array (TM-FPGA) includes programmable logic circuitry, programmable interconnect circuitry, and a plurality of context registers. A user's circuit can be mapped to the programmable logic circuitry, the programmable interconnect circuitry, and the plurality of context registers without the user's intervention in mapping the design. | 08-15-2013 |
20130214815 | PLD ARCHITECTURE FOR FLEXIBLE PLACEMENT OF IP FUNCTION BLOCKS - In accordance with one aspect of the invention, a hole is formed within an LE array of a PLD by interrupting the LE array base signal routing architecture such that a hole is left for IP function block to be incorporated. An interface region is provided for interfacing the remaining LE array base signal routing architecture to the IP function block. | 08-22-2013 |
20130227182 | Adaptable Datapath for a Digital Processing System - The present invention includes an adaptable high-performance node (RXN) with several features that enable it to provide high performance along with adaptability. A preferred embodiment of the RXN includes a run-time configurable data path and control path. The RXN supports multi-precision arithmetic including 8, 16, 24, and 32 bit codes. Data flow can be reconfigured to minimize register accesses for different operations. For example, multiply-accumulate operations can be performed with minimal, or no, register stores by reconfiguration of the data path. Predetermined kernels can be configured during a setup phase so that the RXN can efficiently execute, e.g., Discrete Cosine Transform (DCT), Fast-Fourier Transform (FFT) and other operations. Other features are provided. | 08-29-2013 |
20130311534 | DEVICE WITH LOGIC CIRCUITRY SUPPORTING QUATERNARY ADDITION - A lookup table structure having multiple lookup tables is configured to include a quaternary adder. In particular examples, an adaptive logic module (ALM) including a fracturable lookup table (LUT) is configured to include a quaternary ( | 11-21-2013 |
20140101409 | 3D MEMORY BASED ADDRESS GENERATOR - Systems and methods are disclosed for reducing memory usage and increasing the throughput in variable-size Fast Fourier Transform (FFT) architectures. In particular, 3D symmetric virtual memory is disclosed to exploit the structure inherent in variable-size FFT computations. Data samples may be written to and read from the 3D symmetric virtual memory in a specific sequence of coordinates that exploits the structure inherent in variable-size FFT computations. Memory locations in the 3D symmetric virtual memory may be mapped to memory address in a 1D buffer using an address generation circuit. | 04-10-2014 |
20140111247 | METHODS AND APPARATUS FOR BUILDING BUS INTERCONNECTION NETWORKS USING PROGRAMMABLE INTERCONNECTION RESOURCES - Integrated circuits may include logic regions configurable to perform custom functions. Interconnects may be used to route signals throughout the integrated circuit. The logic region may be coupled to input selection circuitry for selecting and providing input signals from the interconnects to the logic regions and to output selection and routing circuitry for selecting and transmitting output signals over interconnects to other logic regions. Bypass circuitry may provide direct access to registers inside the logic regions and to the output selection and routing circuitry by bypassing the input selection circuitry and other processing circuitry inside the logic regions. Bus interconnections having logic regions performing register pipelining, wire stitching, and acting as data source/sink stations to get on and off the bus interconnections may be generated by configuring the bypass circuitry and the output selection and routing circuitry appropriately. | 04-24-2014 |
20140118026 | TECHNIQUES AND CIRCUITRY FOR CONFIGURING AND CALIBRATING AN INTEGRATED CIRCUIT - A technique for configuring an integrated circuit includes receiving configuration data from an external element with an interface circuit. The configuration data may include an identification field and an instruction for configuring a logic block. Configuration circuitry may be used to identify the logic block to be configured based on the identification field. A storage element in the identified logic block is configured by the configuration circuitry based on the instruction. | 05-01-2014 |
20140133529 | APPARATUS AND METHODS FOR ADAPTIVE RECEIVER DELAY EQUALIZATION - Disclosed are apparatus and methods for adaptive receiver delay equalization. One embodiment relates to a method for adaptive receiver delay equalization. Filtered positive and negative polarity signals are generated by a first variable-delay filter and a second variable-delay filter, respectively. A delay difference is determined between the filtered positive and negative polarity signals, and a skew-indication signal is generated based on the delay difference. A delay control signal is generated based on the skew-indication signal, and the delay control signal is sent to at least one of the first and second variable-delay filters. Other embodiments and features are also disclosed. | 05-15-2014 |
20140136905 | Methods for Testing Network Circuitry - A method of operating a test equipment system that is coupled to network circuitry is described. The method displays only selected information. Furthermore, the method may display the selected information in a manner as to allow a user of the test equipment to easily identify errors in the network circuitry. The method may select the information to be displayed by processing received signals according to a stacked protocol hierarchical structure. | 05-15-2014 |
20140145756 | MEMORY INTERFACE CIRCUITRY WITH IMPROVED TIMING MARGINS - Integrated circuits may include memory interface circuitry that communicates with memory. The memory interface circuitry may include latch circuitry that receives a data strobe enable signal from the memory controller and latches the data strobe enable signal using a data strobe signal received from the memory. The integrated circuit may include logic circuitry that gates the data strobe signal using the latched data strobe enable signal. The logic circuitry may pass the data strobe signal in response to activation of the latched data strobe enable signal. The integrated circuit may include counter circuitry that monitors the gated data strobe signal. The counter circuitry may monitor the gated data strobe signal by counting pulses in the gated data strobe signal to produce a counter value. When the counter value reaches a target value, the logic circuitry may block the data strobe signal from passing to the memory controller. | 05-29-2014 |
20140156703 | METHOD AND APPARATUS FOR TRANSLATING GRAPHICAL SYMBOLS INTO QUERY KEYWORDS - Computer equipment operable to translate a graphical symbol into keywords is disclosed. The computer equipment includes a database of keywords. An input analyzer tool may be used to retrieve a list of keywords from the database based on the graphical symbol. The input analyzer tool may be implemented using processing circuitry that accepts graphical input and performs symbol translation to formulate a search query related to the graphical input. An information search may be performed with the formulated search query using a search engine. | 06-05-2014 |
20140159157 | ANTENNA DIODE CIRCUITRY AND METHOD OF MANUFACTURE - An integrated circuit with an antenna diode is described. The integrated circuit includes a substrate, a transistor, first and second diffusion regions, and a dummy gate. The transistor and the first and second diffusion regions may be formed within the substrate. The transistor has its gate structure disposed on the substrate. The dummy gate structure may be disposed on a region of the substrate such that it separates the first diffusion region from the second diffusion region. The dummy gate structure may also be coupled to the transistor gate structure. | 06-12-2014 |
20140169074 | MEMORY ELEMENTS WITH STACKED PULL-UP DEVICES - Integrated circuits with memory cells are provided. A memory cell may include first and second cross-coupled inverting circuits configured to store a single data bit. The first inverting circuit may have an output serving as a first data storage node for the memory cell, whereas the second inverting circuit may have an output serving as a second data storage node for the memory cell. Access transistors may be coupled between the first and second data storage nodes and corresponding data lines. Each of the first and second inverting circuit may have a pull-down transistor and at least two pull-up transistors stacked in series. The pull-down transistors may have body terminals that are reverse biased to help reduce leakage current through the first and second inverting circuits. The memory cell may be formed using a narrower two-gate configuration or a wider four-gate configuration. | 06-19-2014 |
20140169439 | APPARATUS AND METHODS FOR EQUALIZER ADAPTATION - One embodiment relates to an equalizer circuit for a data link. The equalizer circuit including a continuous-time linear equalizer, a first circuit loop, and a second circuit loop. The continuous-time linear equalizer receives a received signal and outputs an equalized signal. The first circuit loop determines a first average signal amplitude. The first average signal amplitude may be an average signal amplitude of the equalized signal. The second circuit loop a second average signal amplitude. The second average signal amplitude may be an average signal amplitude of a high-frequency portion of the equalized signal. Other embodiments and features are also disclosed. | 06-19-2014 |
20140175666 | INTEGRATED CIRCUIT DEVICE WITH STITCHED INTERPOSER - Systems, methods, and devices are provided to enable an integrated circuit device of relatively higher capacity. Such an integrated circuit device may include at least two component integrated circuits that communicate with one another. Specifically, the component integrated circuits may communicate through a “stitched silicon interposer” that is larger than a reticle limit of the lithography system used to manufacture the interposer. To achieve this larger size, the stitched silicon interposer may be composed of at least two component interposers, each sized within the reticle limit and each separated from one another by a die seal structure. | 06-26-2014 |
20140189456 | 3D BUILT-IN SELF-TEST SCHEME FOR 3D ASSEMBLY DEFECT DETECTION - Techniques and mechanisms are provided for an improved built in self-test (BIST) mechanism for 3D assembly defect detection. According to an embodiment of the present disclosure, the described mechanisms and techniques can function to detect defects in interconnects which vertically connect different layers of a 3D device, as well as to detect defects on a 2D layer of a 3D integrated circuit. Additionally, according to an embodiment of the present disclosure, techniques and mechanisms are provided for determining not only the presence of a defect in a given set of interfaces of an integrated circuit, but the particular interface at which a defect may exist. | 07-03-2014 |
20140189622 | PARTITIONING DESIGNS TO FACILITATE CERTIFICATION - This disclosure relates generally to field-programmable gate arrays (FPGAs). Some implementations relate to methods and systems for partitioning FPGA circuit designs to facilitate certification. In one aspect, a method includes generating a hardware description language (HDL) implementation of a circuit design. The method additionally includes partitioning the design into a first portion and a second portion. In some implementations, the second portion corresponds to a safety-critical portion of the design while the first portion corresponds to a non-safety-critical portion. The method additionally includes generating first configuration settings for the first portion and generating second configuration settings for the second portion. The method additionally includes verifying, or providing to a third-party certification body for verification, the first configuration settings for the first portion and the second configuration settings for the second portion. The method further includes providing the configuration settings for the second portion for programming into a PLD. | 07-03-2014 |
20140197463 | METAL-PROGRAMMABLE INTEGRATED CIRCUITS - A metal-programmable integrated circuit may include an array of metal-programmable cells. Each cell may include multi-gate transistor structures in which multiple surfaces of a gate structure serve to control current flow through at least one channel structure. The multi-gate transistor structures may form one or more fin-shaped field effect transistors. The gate structure may at least partially enclose multiple channel structures. Pairs of source-drain structures may be coupled to the channel structures. The transistor structures of each cell may be formed in a substrate covered with one or more metal interconnect layers. Paths formed in the metal interconnect layers may configure the cells to perform desired logic functions. The paths associated with a given cell may be selectively coupled to transistor structures of the cell to configure the cell for a desired logic function and/or for desired output drive strength. | 07-17-2014 |
20140198810 | METHODS AND APPARATUS FOR ALIGNING CLOCK SIGNALS ON AN INTEGRATED CIRCUIT - A method of aligning clock signals in multiple transceiver channels on an integrated circuit may include adjusting a slave clock signal at a slave transceiver channel based on a master clock signal received from a master transceiver channel. A clock generation circuit and/or a delay circuit in the slave transceiver channel may be used to adjust the slave clock signal to produce an intermediate slave clock signal. The master clock signal may be adjusted based on the intermediate slave clock signal received at the master transceiver channel to obtain a total adjustment value. The phase of the intermediate slave clock signal may further be adjusted at the slave transceiver channel based on the total adjustment made at the master transceiver channel. | 07-17-2014 |
20140210097 | INTEGRATED CIRCUIT PACKAGE WITH ACTIVE INTERPOSER - An integrated circuit package may include a substrate and an interposer. The interposer is disposed over the substrate. The interposer may include embedded switching elements that may be used to receive different power supply signals. An integrated circuit with multiple logic blocks is disposed over the substrate. The switching elements embedded in the interposer may be used to select a power supply signal from the power supply signals and may be used to provide at least one circuit block in the integrated circuit with a selected power supply signal. | 07-31-2014 |
20140210510 | BYPASSABLE CLOCKED STORAGE CIRCUITRY FOR DYNAMIC VOLTAGE-FREQUENCY SCALING - Integrated circuits with sequential logic circuitry are provided. Sequential logic circuitry may include a chain of bypassable clocked storage elements coupled between a speed critical input terminal and a speed critical output terminal. Combinational logic circuits may be interposed between each adjacent pair of bypassable clocked storage elements in the chain. Dynamic voltage-frequency scaling (DVFS) control circuitry may provide an adjustable power supply voltage to the combinational logic circuits and may provide an adjustable clock signal to control the clocked storage elements. The DVFS control circuitry may be used to selectively enable at least some of the bypassable clocked storage elements while disabling other bypassable clocked storage elements so that the power supply voltage can be reduced while maintaining the same operating frequency. The power supply voltage and the frequency of the clock signal can be adjusted to provide the desired voltage-frequency tradeoff. | 07-31-2014 |
20140218221 | Techniques For Alignment of Parallel Signals - Receiver circuits in serial lanes each generate a synchronous clock signal that is aligned with a master clock signal to allow synchronous transfer of data onto the master clock domain without corruption. A serial-to-parallel converter circuit in each receiver circuit converts a serial data signal into parallel data signals in response to one of the synchronous clock signals. Phase detection circuitry generates an indication of a phase shift based on a phase offset between the synchronous and master clock signals. A clock signal generation circuit provides an adjustment to a phase of the synchronous clock signal based on the indication of the phase shift. The serial-to-parallel converter circuit adjusts positions of bits indicated by the parallel data signals based on the adjustment to the phase of the synchronous clock signal. | 08-07-2014 |
20140239483 | HEAT SPREADING IN MOLDED SEMICONDUCTOR PACKAGES - A molded semiconductor package comprises a substrate, a semiconductor die mounted on the substrate, a molding compound encircling the die on the substrate, and one or more heat conductors in the molding compound that are thermally coupled to the substrate. Advantageously, the heat conductors are mounted in the molding compound near one or more of the corners of the die. The package may also include a lid. The heat conductors produce a more uniform distribution of heat in the substrate. The package is assembled by mounting the die on the substrate, mounting the heat conductors on the substrate and applying the molding compound to the substrate, the die, and the heat conductors mounted on the substrate. For packages that use a lid, the lid is then secured to the package and coupled to the heat conductors. | 08-28-2014 |
20140239487 | HEAT PIPE IN OVERMOLDED FLIP CHIP PACKAGE - The present invention is an improvement in a molded semiconductor package and the method for its manufacture. The package comprises a substrate, a semiconductor die mounted on the substrate, a molding compound encircling the die on the substrate, a lid on the molding compound, and a heat pipe extending between the semiconductor die and the lid. Preferably, the heat pipe is formed so that it encircles the die. The package is assembled by mounting the die on the substrate, applying the molding compound to the substrate while a channel is formed in the molding compound adjacent the semiconductor die, inserting a heat pipe material in the channel, and mounting the lid on the molding compound and the heat pipe material. | 08-28-2014 |
20140255028 | SUB-RATE MAPPING FOR LOWEST-ORDER OPTICAL DATA UNIT - One embodiment relates a method for communicating data using an optical transport network. Multiple sub-rate client data signals are received from client sources. The sub-rate client data signals each have a data rate which is less than a data rate capacity of a lowest-order data unit. A predetermined number of tributary slots are provided in the lowest-order optical channel data unit, and each sub-rate client data signal are mapped to at least one of the tributary slots. Another embodiment relates to an optical data communication server that includes a sub-rate mapper for mapping multiple sub-rate client data streams to a predetermined number of tributary slots. Other embodiments and features are also disclosed. | 09-11-2014 |
20140264783 | APPARATUS FOR ELECTRONIC ASSEMBLY WITH IMPROVED INTERCONNECT AND ASSOCIATED METHODS - An apparatus includes a substrate that includes electronic circuitry. The apparatus further includes a first die that includes electronic circuitry, and at least one shielded interconnect. The shielded interconnect(s) couple(s) electronic circuitry in the substrate to electronic circuitry in the first die. | 09-18-2014 |
20140269117 | CIRCUITS AND METHODS FOR DQS AUTOGATING - In one aspect, a method includes receiving a differential strobe signal including first and second components; buffering, by a first buffer, both the first and second components; and buffering, by a second buffer, the first component. The method includes receiving, by a control logic block, the output of the second buffer. The method includes, after a period when the values of both the first and second components are at a first logic state, but before receiving a burst of clock edges in the differential strobe signal, detecting a transition in the first component from the first logic state to a second logic state, and in response to the detected transition, asserting an enable signal. The method further includes receiving, by a gating logic block, the enable signal and the output of the first buffer, and, when the enable signal is asserted, un-gating the output of the first buffer. | 09-18-2014 |
20140269983 | APPARATUS FOR IMPROVED COMMUNICATION AND ASSOCIATED METHODS - An apparatus includes a transmitter adapted to transmit encoded information to a communication link. The transmitter includes a DC balance skew generator. The DC balance skew generator is adapted to skew a DC balance of the information before information is provided to the communication link. | 09-18-2014 |
20140281379 | Hybrid Programmable Many-Core Device with On-Chip Interconnect - The present invention provides a hybrid programmable logic device which includes a programmable field programmable gate array logic fabric and a many-core distributed processing subsystem. The device integrates both a fabric of programmable logic elements and processors in the same device, i.e., the same chip. The programmable logic elements may be sized and arranged such that place and route tools can address the processors and logic elements as a homogenous routing fabric. The programmable logic elements may provide hardware acceleration functions to the processors that can be defined after the device is fabricated. The device may include scheduling circuitry that can schedule the transmission of data on horizontal and vertical connectors in the logic fabric to transmit data between the programmable logic elements and processor in an asynchronous manner. | 09-18-2014 |
20140282560 | Mapping Network Applications to a Hybrid Programmable Many-Core Device - A hybrid programmable logic is described that performs packet processing functions on received data packets using programmable logic elements, and processors interleaved with the programmable logic elements. The header data may be scheduled for distribution to processing threads associated with the processors by the programmable logic elements. The processors may perform packet processing functions on the header data using both the processing threads and hardware acceleration functions provided by the programmable logic elements. | 09-18-2014 |