| Patent application number | Description | Published |
|---|
| 20090258574 | POLISHING SYSTEM HAVING A TRACK - Embodiments described herein relate to a track system in a polishing system. One embodiment described herein provides a track system configured to transfer polishing heads in a polishing system. The track system comprises a supporting frame, a track coupled to the supporting frame and defining a path along which the polishing heads are configured to move, and one or more carriages configured to carry at least one polishing head along the path defined by the track, wherein the one or more carriages are coupled to the track and independently movable along the track. | 10-15-2009 |
| 20090264049 | PLATEN EXHAUST FOR CHEMICAL MECHANICAL POLISHING SYSTEM - The present invention generally relates to a substrate transferring system. Particularly, the present invention relates to apparatus and method to effectively remove the chemical fume, vapor and other byproducts generated during a polishing process. One embodiment of the present invention provides an apparatus for polishing a substrate comprising a platen having a polishing surface configured to polish the substrate by contacting the substrate while moving relatively to the substrate, a polishing head configured to support the substrate and position the substrate to be in contact with the polishing surface during polishing, a solution nozzle configured to dispense a polishing solution on the polishing surface, and an exhaust assembly configured to remove fume, vapor and other byproducts generated during polishing. | 10-22-2009 |
| 20090270015 | HIGH THROUGHPUT CHEMICAL MECHANICAL POLISHING SYSTEM - Embodiments of a system and method for polishing substrates are provided. In one embodiment, a polishing system is provided that includes a polishing module, a cleaner and a robot. The robot has a range of motion sufficient to transfer substrates between the polishing module and cleaner. The polishing module includes at least two polishing stations, at least one load cup and at least four polishing heads. The polishing heads are configured to move independently between the at least two polishing stations and the at least one load cup. | 10-29-2009 |
| 20090280727 | POLISHING SYSTEM WITH THREE HEADED CAROUSEL - Embodiments of the present invention provide a polishing module configured to use in a polishing system. The polishing module comprises a base member, two polishing stations disposed on the base member, one load cup, and a carousel having three polishing heads. | 11-12-2009 |
| 20090305610 | MULTIPLE WINDOW PAD ASSEMBLY - A method and apparatus for detecting and obtaining a metric indicative of a polishing process is described. The apparatus includes a polishing pad having an optically transparent region adapted to obtain polishing metric from at least one substrate from at least two distinct radial positions of the polishing pad. The method includes obtaining a polishing metric from at least two substrates being polished simultaneously on a single polishing pad. | 12-10-2009 |
| 20090320875 | DUAL CHAMBER MEGASONIC CLEANER - Embodiments described herein relate to semiconductor device manufacturing, and more particularly to a vertically oriented dual megasonic module for simultaneously cleaning multiple substrates. In one embodiment, an apparatus for cleaning multiple substrates is provided. The apparatus comprises an outer tank for collecting overflow processing fluid comprising at least one sidewall and a bottom. A first inner module adapted to contain a processing fluid is positioned partially within the outer tank. The first inner module comprises one or more roller assemblies to hold a substrate in a substantially vertical orientation. A second inner module adapted to contain a processing fluid is positioned partially within the outer tank. The second inner module comprises one or more roller assemblies adapted to hold a substrate in a substantially vertical orientation. Each inner module contains a transducer adapted to direct vibrational energy through the processing fluid toward the substrates. | 12-31-2009 |
| 20100078041 | BRUSH BOX CLEANER MODULE WITH FORCE CONTROL - Embodiments of the present invention relates to an apparatus and method for cleaning a substrate using scrubber brushes. One embodiment of the present invention provides a substrate cleaner comprises two scrubber brush assemblies movably disposed in a processing volume. The two scrubber brush assemblies are configured to contact and clean opposite surfaces of a substrate disposed in the processing volume. The substrate cleaner also comprises a positioning assembly configured to simultaneously adjust positions of the two scrubber brush assemblies, wherein the positioning assembly makes substantially the same amount of adjustment to the first and second scrubber brush assemblies in mirror symmetry. | 04-01-2010 |
| 20100078044 | APPARATUS AND METHOD FOR CLEANING SEMICONDUCTOR SUBSTRATE USING PRESSURIZED FLUID - Embodiments of the present invention generally relate to an apparatus and a method for cleaning a semiconductor substrate after a polishing process. Particularly, embodiments of the present invention relates to an apparatus and method for cleaning a substrate using pressurized fluid. One embodiment of the present invention comprises two rollers to support and rotate a substrate in a substantially vertical orientation, a pressure wheel to apply a force to engage the substrate with the two rollers, and a swinging nozzle configured to dispense a pressurized fluid towards the substrate. | 04-01-2010 |
