Patent application number | Description | Published |
20090130805 | ADVANCED CMOS USING SUPER STEEP RETROGRADE WELLS - The present invention is a method for forming super steep doping profiles in MOS transistor structures. The method comprises forming a carbon containing layer ( | 05-21-2009 |
20090212393 | METHOD OF MANUFACTURING AN ELECTRONIC DEVICE INCLUDING A PNP BIPOLAR TRANSISTOR - A method of manufacturing an electronic device including a PNP bipolar transistor comprises forming a collector in a substrate, depositing a base layer and an emitter layer on the substrate, and growing a nitride interface layer on the base layer as a base current modulation means, such that the nitride interface layer is arranged between the base layer and the emitter layer. | 08-27-2009 |
20100148308 | Dopant Profile Control for Ultrashallow Arsenic Dopant Profiles - A method of manufacturing a semiconductor device comprises growing or depositing an implantation oxide layer, implanting a dopant, activating the dopant, and removing the implantation oxide layer after the step of activating the dopant. | 06-17-2010 |
20100283119 | Semiconductor Device Including a Deep Contact and a Method of Manufacturing Such a Device - A semiconductor device includes a buried layer and a deep contact for providing a low resistive connection to the buried layer. The deep contact is formed by doped polycrystalline silicon. A method of manufacturing a semiconductor device and a deep contact for providing a low resistive connection to the buried layer, with the steps of forming a buried layer, providing an active region adjacent the buried layer and forming a deep contact for providing a low resistive connection to the buried layer by patterning a contact shape for the deep contact on an upper surface of the active region, removing part of the active region underneath the contact shape to create a deep contact cavity. Subsequently a polycrystalline silicon layer for filling the deep contact cavity is deposited and doped. | 11-11-2010 |
20110070719 | TUNING OF SOI SUBSTRATE DOPING - A method of manufacturing a semiconductor device, the method comprising: taking an SOI substrate comprising a bulk substrate, a buried insulating layer and an active layer, and implanting the bulk substrate from the side of and through the insulating layer and the active layer so as to generate an area having an increased doping concentration in the bulk substrate at the interface between the bulk substrate and the insulating layer. | 03-24-2011 |
20120164802 | ADVANCED CMOS USING SUPER STEEP RETROGRADE WELLS - The present invention is a method for forming super steep doping profiles in MOS transistor structures. The method comprises forming a carbon containing layer ( | 06-28-2012 |
20120205775 | METHOD FOR MANUFACTURING AN ELECTRONIC DEVICE - The invention relates to a method for manufacturing a semiconductor device. Accordingly, the trench processing sequence is changed and stress absorbing layers are applied. A shallow trench structure is etched. A deep trench structure is etched. A liner oxide is applied in the deep and shallow trench structure. An amorphous polysilicon liner is deposited on top of the liner oxide. A nitride liner is applied on top of the amorphous polysilicon liner, and the deep and shallow trenches are filled with oxide. | 08-16-2012 |
20130134531 | FULLY EMBEDDED MICROMECHANICAL DEVICE, SYSTEM ON CHIP AND METHOD FOR MANUFACTURING THE SAME - A fully embedded micromechanical device and a system on chip is manufactured on an SOI-substrate. The micromechanical device comprises a moveable component having a laterally extending upper and lower surface and vertical side surfaces. The upper surface is adjacent to an upper gap which laterally extends over at least a part of the upper surface and results from the removal of a shallow trench insulation material. The lower surface is adjacent to a lower gap which laterally extends over at least a part of the lower surface and results from the removal of the buried silicon oxide layer. The side surfaces of the movable component are adjacent to side gaps which surround at least a part of the vertical side surfaces of the moveable component and result from the removal of a deep trench insulation material. | 05-30-2013 |
20130280906 | SEMICONDUCTOR DEVICE INCLUDING A DEEP CONTACT AND A METHOD OF MANUFACTURING SUCH A DEVICE - A semiconductor device includes a buried layer and a deep contact for providing a low resistive connection to the buried layer. The deep contact is formed by doped polycrystalline silicon. A method of manufacturing a semiconductor device and a deep contact for providing a low resistive connection to the buried layer, with the steps of forming a buried layer, providing an active region adjacent the buried layer and forming a deep contact for providing a low resistive connection to the buried layer by patterning a contact shape for the deep contact on an upper surface of the active region, removing part of the active region underneath the contact shape to create a deep contact cavity. Subsequently a polycrystalline silicon layer for filling the deep contact cavity is deposited and doped. | 10-24-2013 |