Patent application number | Description | Published |
20100065616 | LEAD SOLDER-FREE ELECTRONICS - A composition may have metal nanoparticles having a diameter of 20 nanometers or less and have a fusion temperature of less than about 220° C. A method of fabricating the metal nanoparticles may include preparing a solvent, adding a precursor with a metal to the solvent, adding a first surfactant, mixing in a reducing agent, and adding in a second surfactant to stop nanoparticle formation. Copper and/or aluminum nanoparticle compositions formed may be used for lead-free soldering of electronic components to circuit boards. A composition may include nanoparticles, which may have a copper nanocore, an amorphous aluminum shell and an organic surfactant coating. A composition may have copper or aluminum nanoparticles. About 30-50% of the copper or aluminum nanoparticles may have a diameter of 20 nanometers or less, and the remaining 70-50% of the copper or aluminum nanoparticles may have a diameter greater than 20 nanometers. | 03-18-2010 |
20100075137 | CARBON NANOTUBE SYNTHESIS USING REFRACTORY METAL NANOPARTICLES AND MANUFACTURE OF REFRACTORY METAL NANOPARTICLES - Fabrication of refractory metal nanoparticles and carbon nanotubes is disclosed. As an example, a method may include providing a solvent and providing a surfactant having a first surfactant configured to stabilize low oxidation states of a refractory metal and a second surfactant configured to protect refractory metal nanoparticles. The method may further include providing a refractory metal precursor and providing a reactant for reacting with the refractory metal precursor and forming refractory metal nanoparticles. The refractory metal may include rhenium, tungsten, tantalum, or hafnium. The refractory metal nanoparticles may include rhenium, tungsten, tantalum, or hafnium nanoparticles. A carbon nanotube product may include refractory metal nanoparticles and carbon nanotubes, where the refractory metal nanoparticles may include rhenium, tungsten, tantalum, or hafnium nanoparticles. | 03-25-2010 |
20110088739 | HIGH EFFICIENCY THERMOELECTRIC CONVERTER - A composite includes a matrix having a plurality of matrix nanoparticles and a plurality of hetero-nanoparticles dispersed in the matrix. The hetero-nanoparticles include an atom having an atomic weight larger than the atoms in the matrix nanoparticles. A thermoelectric converter includes one or more first legs, each including an n-doped composite, and one or more second legs, each including a p-doped composite. The n-doped and p-doped composites include a matrix having a plurality of matrix nanoparticles and a plurality of hetero-nanoparticles dispersed in the matrix. The matrix nanoparticles and hetero-nanoparticles in each of the n-doped and p-doped composites can be the same or different. A method of making a composite for thermoelectric converter applications includes providing a mixture a plurality of matrix nanoparticles and a plurality of hetero-nanoparticles and applying current activated pressure assisted densification to form the composite. | 04-21-2011 |
20110127464 | NANOPARTICLE COMPOSITION AND METHODS OF MAKING THE SAME - A method of fabricating copper nanoparticles includes heating a copper salt solution that includes a copper salt, an N,N-dialkylethylenediamine, and a C6-C18 alkylamine in an organic solvent to a temperature between about 30° C. to about 50° C.; heating a reducing agent solution that includes a reducing agent, an N,N-dialkylethylenediamine, and a C6-C18 alkylamine in an organic solvent to a temperature between about 30° C. to about 50° C.; and adding the heated copper salt solution to the heated reducing agent solution, thereby producing copper nanoparticles. A composition includes copper nanoparticles, a C6-C18 alkylamine and an N,N′-dialkylethylenediamine ligand. Such copper nanoparticles in this composition have a fusion temperature between about 100° C. to about 200° C. A surfactant system for the stabilizing copper nanoparticles includes an N,N′-dialkylethylenediamine and a C6-C18 alkylamine. | 06-02-2011 |
20110215279 | COMPOSITIONS CONTAINING TIN NANOPARTICLES AND METHODS FOR USE THEREOF - Compositions containing tin nanoparticles and electrically conductive particles are described herein. The tin nanoparticles can have a size below about 25 nm so as to make the compositions fusable at temperatures below that of bulk tin (m.p.=232° C.). Particularly, when the tin nanoparticles are less than about 10 nm in size, the compositions can have a fusion temperature of less than about 200° C. The compositions can contain a whisker suppressant to inhibit or substantially minimize the formation of tin whiskers after tin nanoparticle fusion. In some embodiments, the compositions contain tin nanoparticles, electrically conductive particles comprising copper particles, and a whisker suppressant comprising nickel particles. Methods for using the present compositions are also described herein. The present compositions can be used as a lead solder replacement that allows rework to be performed. | 09-08-2011 |
20110240716 | METHODS FOR REWORK OF A SOLDER - Methods for reworking a solder containing one or more joined members are described herein. Such methods can include applying a disintegrating agent to a solder containing a solder material, disintegrating the solder material to form a disintegrated solder material, and removing the disintegrated solder material from the solder. Such methods can also include applying a disintegrating agent containing bismuth to a solder containing a solder material, and heating the solder to liquefy the disintegrating agent. Such methods can also include applying a disintegrating agent containing a bismuth alloy to a solder having a solder material that contains metal nanoparticles, and heating the solder to liquefy the bismuth alloy. | 10-06-2011 |
20120100374 | METAL NANOPARTICLES AND METHODS FOR PRODUCING AND USING SAME - A composition may have metal nanoparticles having a diameter of 20 nanometers or less and have a fusion temperature of less than about 220° C. A method of fabricating the metal nanoparticles may include preparing a solvent, adding a precursor with a metal to the solvent, adding a first surfactant, mixing in a reducing agent, and adding in a second surfactant to stop nanoparticle formation. Copper and/or aluminum nanoparticle compositions formed may be used for lead-free soldering of electronic components to circuit boards. A composition may include nanoparticles, which may have a copper nanocore, an amorphous aluminum shell and an organic surfactant coating. A composition may have copper or aluminum nanoparticles. About 30-50% of the copper or aluminum nanoparticles may have a diameter of 20 nanometers or less, and the remaining 70-50% of the copper or aluminum nanoparticles may have a diameter greater than 20 nanometers. | 04-26-2012 |
20120114521 | STABILIZED METAL NANOPARTICLES AND METHODS FOR PRODUCTION THEREOF - Processes for synthesizing metal nanoparticles, particularly copper nanoparticles, are described. The processes can involve reacting an insoluble complex of a metal salt with a reducing agent in a reaction mixture containing a primary amine first surfactant, a secondary amine second surfactant, and a diamine chelating agent third surfactant. More specifically, processes for forming copper nanoparticles can involve forming a first solution containing a copper salt, a primary amine first surfactant, a secondary amine second surfactant, and a diamine chelating agent third surfactant; allowing an insoluble complex of the copper salt to form from the first solution; combining a second solution containing a reducing agent with the insoluble complex; and forming copper nanoparticles from the insoluble complex. Such copper nanoparticles can be about 10 nm or smaller in size, more particularly about 3 nm to about 6 nm in size, and have a fusion temperature of about 200° C. or lower. | 05-10-2012 |
20120237831 | TIN NANOPARTICLES AND METHODOLOGY FOR MAKING SAME - A method of preparing tin (Sn) nanoparticles based on a bottom-up approach is provided. The method includes combining a first solution comprising Sn ions with a second solution comprising a reducing agent. After the combination, the Sn ions and the reducing agent undergo a reaction in which at least some of the Sn ions are reduced to Sn nanoparticles. The first solution comprises a tin salt dissolved in a solvent; the second solution comprises an alkali metal and naphthalene dissolved in a solvent; and the combined solution further comprises a capping agent that moderates a growth of aggregates of the Sn nanoparticles. | 09-20-2012 |
20120251381 | ARTICLES CONTAINING COPPER NANOPARTICLES AND METHODS FOR PRODUCTION AND USE THEREOF - Articles containing a matrix material and plurality of copper nanoparticles in the matrix material that have been at least partially fused together are described. The copper nanoparticles are less than about 20 nm in size. Copper nanoparticles of this size become fused together at temperatures and pressures that are much lower than that of bulk copper. In general, the fusion temperatures decrease with increasing applied pressure and lowering of the size of the copper nanoparticles. The size of the copper nanoparticles can be varied by adjusting reaction conditions including, for example, surfactant systems, addition rates, and temperatures. Copper nanoparticles that have been at least partially fused together can form a thermally conductive percolation pathway in the matrix material. | 10-04-2012 |
20120276289 | NANOPOROUS COATING SYNTHESIS AND APPARATUS - An example of a nanoballoon thermal protection system includes a refractory ceramic foam having carbide balloons. The foam has a closed cell structure not allowing liquid to penetrate through the foam. Each of the carbide balloons is hollow and has a diameter greater than 0 nm and less than 900 nm. Each of the carbide balloons includes a refractory carbide. In addition, a vehicle with thermal shield includes a surface and a first and second nanoballoon closed cell foam coatings. Each of the foam coatings has a melting point temperature greater than 1000° C. and a density less than 85%. Each of the foam coatings has hollow balloons having a diameter less than 900 nm. Each of the foam coatings includes a closed cell structure not allowing liquid to penetrate through the respective coating. Methods for manufacturing a nanoballoon system and a nanoballoon thermal protection system are also disclosed. | 11-01-2012 |
20120305306 | COPPER NANOPARTICLE APPLICATION PROCESSES FOR LOW TEMPERATURE PRINTABLE, FLEXIBLE/CONFORMAL ELECTRONICS AND ANTENNAS - An ink adapted for forming conductive elements is disclosed. The ink includes a plurality of nanoparticles and a carrier. The nanoparticles comprise copper and have a diameter of less than 20 nanometers. Each nanoparticle has at least a partial coating of a surfactant configured to separate adjacent nanoparticles. Methods of creating circuit elements from copper-containing nanoparticles by spraying, tracing, stamping, burnishing, or heating are disclosed. | 12-06-2012 |
20130206225 | PHOTOVOLTAIC CELLS HAVING ELECTRICAL CONTACTS FORMED FROM METAL NANOPARTICLES AND METHODS FOR PRODUCTION THEREOF - Photovoltaic cells having copper contacts can be made by using copper nanoparticles during their fabrication. Such photovoltaic cells can include a copper-based current collector located on a semiconductor substrate having an n-doped region and a p-doped region. The semiconductor substrate is configured for receipt of electromagnetic radiation and generation of an electrical current therefrom. The copper-based current collector includes an electrically conductive diffusion barrier disposed on the semiconductor substrate and a copper contact disposed on the electrically conductive diffusion barrier. The copper contact is formed from copper nanoparticles that have been at least partially fused together. The electrically conductive diffusion barrier limits the passage of copper therethrough. | 08-15-2013 |
20130209692 | NANOPARTICLE PASTE FORMULATIONS AND METHODS FOR PRODUCTION AND USE THEREOF - Nanoparticle paste formulations can be configured to maintain a fluid state, promote dispensation, and mitigate crack formation during nanoparticle fusion. Such nanoparticle paste formulations can contain an organic matrix and a plurality of metal nanoparticles dispersed in the organic matrix, where the plurality of metal nanoparticles constitute about 30% to about 90% of the nanoparticle paste formulation by weight. The nanoparticle paste formulations can maintain a fluid state and be dispensable through a micron-size aperture. The organic matrix can contain one or more organic solvents, such as the combination of one or more hydrocarbons, one or more alcohols, one or more amines, and one or more organic acids. Optionally, the nanoparticle paste formulations can contain about 0.01 to about 15 percent by weight micron-scale metal particles or other additives. | 08-15-2013 |
20130251900 | NANO-STRUCTURED REFRACTORY METALS, METAL CARBIDES, AND COATINGS AND PARTS FABRICATED THEREFROM - Refractory metal and refractory metal carbide nanoparticle mixtures and methods for making the same are provided. The nanoparticle mixtures can be painted onto a surface to be coated and heated at low temperatures to form a gas-tight coating. The low temperature formation of refractory metal and refractory metal carbide coatings allows these coatings to be provided on surfaces that would otherwise be uncoatable or very difficult to coat, whether because they are carbon-based materials (e.g., graphite, carbon/carbon composites) or temperature sensitive materials (e.g., materials that would melt, oxidize, or otherwise not withstand temperatures above 800° C.), or because the high aspect ratio of the surface would prevent other coating methods from being effective (e.g., the inner surfaces of tubes and nozzles). The nanoparticle mixtures can also be disposed in a mold and sintered to form fully dense components. | 09-26-2013 |
20140003991 | NANOPARTICLE COMPOSITION AND METHODS OF MAKING THE SAME | 01-02-2014 |
20140134350 | METAL NANOPARTICLES AND METHODS FOR PRODUCING AND USING SAME - A composition may have metal nanoparticles having a diameter of 20 nanometers or less and have a fusion temperature of less than about 220° C. A method of fabricating the metal nanoparticles may include preparing a solvent, adding a precursor with a metal to the solvent, adding a first surfactant, mixing in a reducing agent, and adding in a second surfactant to stop nanoparticle formation. Copper and/or aluminum nanoparticle compositions formed may be used for lead-free soldering of electronic components to circuit boards. A composition may include nanoparticles, which may have a copper nanocore, an amorphous aluminum shell and an organic surfactant coating. A composition may have copper or aluminum nanoparticles. About 30-50% of the copper or aluminum nanoparticles may have a diameter of 20 nanometers or less, and the remaining 70-50% of the copper or aluminum nanoparticles may have a diameter greater than 20 nanometers. | 05-15-2014 |
20140220251 | NANOPOROUS COATING SYNTHESIS AND APPARATUS - An example of a nanoballoon thermal protection system includes a refractory ceramic foam having carbide balloons. The foam has a closed cell structure not allowing liquid to penetrate through the foam. Each of the carbide balloons is hollow and has a diameter greater than 0 nm and less than 900 nm. Each of the carbide balloons includes a refractory carbide. In addition, a vehicle with thermal shield includes a surface and a first and second nanoballoon closed cell foam coatings. Each of the foam coatings has a melting point temperature greater than 1000° C. and a density less than 85%. Each of the foam coatings has hollow balloons having a diameter less than 900 nm. Each of the foam coatings includes a closed cell structure not allowing liquid to penetrate through the respective coating. Methods for manufacturing a nanoballoon system and a nanoballoon thermal protection system are also disclosed. | 08-07-2014 |
20140239534 | NANO-STRUCTURED REFRACTORY METALS, METAL CARBIDES, AND COATINGS AND PARTS FABRICATED THEREFROM - Refractory metal and refractory metal carbide nanoparticle mixtures and methods for making the same are provided. The nanoparticle mixtures can be painted onto a surface to be coated and heated at low temperatures to form a gas-tight coating. The low temperature formation of refractory metal and refractory metal carbide coatings allows these coatings to be provided on surfaces that would otherwise be uncoatable or very difficult to coat whether because they are carbon-based materials (e.g., graphite, carbon/carbon composites) or temperature sensitive materials (e.g., materials that would melt, oxidize, or otherwise not withstand temperatures above 800° C.), or because the high aspect ratio of the surface would prevent other coating methods from being effective (e.g., the inner surfaces of tubes and nozzles). The nanoparticle mixtures can also be disposed in a mold and sintered to form folly dense components. | 08-28-2014 |
20140374079 | CONFORMABLE AND ADHESIVE SOLID COMPOSITIONS FORMED FROM METAL NANOPARTICLES AND METHODS FOR THEIR PRODUCTION AND USE - Materials that readily adhere to and conform to various surfaces can be desirable for a number of applications. In heat transfer and thermal management applications, for example, conformable materials can be used in establishing a thermal interface between a heat source and a heat sink. There are limited materials that provide good thermal conductivity values while maintaining capabilities to readily adhere and conform to a surface. Compositions including a conformable and adhesive solid can include a reaction product formed by heating a mixture containing a plurality of metal nanoparticles, one or more amines, and one or more carboxylic acids. The compositions can further include one or more additives dispersed in the conformable and adhesive solid. | 12-25-2014 |
20150054020 | HIGH-POWER ELECTRONIC DEVICES CONTAINING METAL NANOPARTICLE-BASED THERMAL INTERFACE MATERIALS AND RELATED METHODS - High-power electronic components generate significant amounts of heat that must be removed in the course of normal device operations. Certain types of electronic components, such as some monolithic microwave integrated circuits and LEDs, can contain materials that are difficult to effectively bond to a heat gink in order to establish a thermal interface between the two. Device assemblies can include a heat-generating electronic component in thermal communication with a metallic heat sink via a metallic thermal interface layer. The metallic thermal interface layer is disposed between the heat-generating electronic component and the metallic heat sink. The metallic thermal interface layer is formed from a composition including a plurality of metal nanoparticles that are at least partially fused together with one another. Methods for forming a thermal interface layer include heating metal nanoparticles above their fusion temperature and subsequently cooling the liquefied metal nanoparticles to promote bonding of the electronic component. | 02-26-2015 |