Patent application number | Description | Published |
20110127623 | MEMS Microphone Packaging and MEMS Microphone Module - A method for producing a microphone module includes arranging a MEMS microphone structure on a first surface of a first substrate, the first substrate further including a second surface, which is opposite to the first surface. Furthermore, a cap is arranging on the first surface of the first substrate such that the cap and the first surface enclose the MEMS microphone structure. A readout device for the MEMS microphone structure is arranged on a first surface of a second substrate which further includes a second surface, which is opposite to the first surface. The second surface of the first substrate is attached to the second surface of the second substrate. | 06-02-2011 |
20120148071 | Micromechanical Digital Loudspeaker - A digital loudspeaker includes a substrate, a first stator fixed with respect to the substrate, a second stator fixed with respect to the substrate and spaced at a distance from the first stator, and a membrane between the first stator and the second stator. The membrane is displaceable between a first position in which the membrane mechanically contacts the first stator and a second position in which the membrane mechanically contacts the second stator. The first stator and the second stator are arranged to electrostatically move the membrane from a rest position spaced apart from the first position and the second position to the first position and the second position, respectively. | 06-14-2012 |
20120207332 | Housed Loudspeaker Array - A housed loudspeaker array includes a first substrate having a plurality of loudspeaker elements formed therein, a second substrate fixed at a first surface of the first substrate in a flip-chip manner and comprising a plurality of orifices that are aligned with the loudspeaker elements of the plurality of loudspeaker elements of the first substrate, and a cover applied to a second surface of the first substrate opposite to the first surface. A method for manufacturing the housed loudspeaker array is also disclosed. | 08-16-2012 |
20120248554 | Micromechanical Sound Transducer Having a Membrane Support with Tapered Surface - A method for manufacturing a micromechanical sound transducer includes depositing successive layers of first and second membrane support material on a first main surface of a substrate arrangement with a first etching rate and a lower second etching rate, respectively. A layer of membrane material is then deposited. A cavity is created in the substrate arrangement from a side of the substrate arrangement opposite to the membrane support materials and the membrane material at least until the cavity extends to the layer of first membrane support material. The layers of first and second membrane support material are etched by applying an etching agent through the cavity in at least one first region located in an extension of the cavity also in a second region surrounding the first region. The etching creates a tapered surface on the layer of second membrane support material in the second region. The etching continues at least until the layer of second membrane support material has been removed in the first region to expose the layer of membrane material. | 10-04-2012 |
20120288130 | Microphone Arrangement - A microphone arrangement includes a housing having a sound hole, a first input audio transducer with a first sensitivity and a second input audio transducer with a second sensitivity. In this microphone arrangement, the first and the second input audio transducers are arranged in the housing, such that the first input audio transducer is directly acoustically coupled with the sound hole and the second input audio transducer is indirectly acoustically coupled with a sound hole via the first input audio transducer. | 11-15-2012 |
20120308053 | Plate, Transducer and Methods for Making and Operating a Transducer - A plate, a transducer, a method for making a transducer, and a method for operating a transducer are disclosed. An embodiment comprises a plate comprising a first material layer comprising a first stress, a second material layer arranged beneath the first material layer, the second material layer comprising a second stress, an opening arranged in the first material layer and the second material layer, and an extension extending into opening, wherein the extension comprises a portion of the first material layer and a portion of the second material layer, and wherein the extension is curved away from a top surface of the plate based on a difference in the first stress and the second stress. | 12-06-2012 |
20120319217 | Semiconductor Devices and Methods of Fabrication Thereof - In one embodiment, a method of manufacturing a semiconductor device includes oxidizing a substrate to form local oxide regions that extend above a top surface of the substrate. A membrane layer is formed over the local oxide regions and the top surface of the substrate. A portion of the substrate under the membrane layer is removed. The local oxide regions under the membrane layer is removed. | 12-20-2012 |
20130015467 | System and Method for Wafer Level PackagingAANM Krumbein; UlrichAACI RosenheimAACO DEAAGP Krumbein; Ulrich Rosenheim DEAANM Lohninger; GerhardAACI MuenchenAACO DEAAGP Lohninger; Gerhard Muenchen DEAANM Dehe; AlfonsAACI ReutlingenAACO DEAAGP Dehe; Alfons Reutlingen DE - In an embodiment, a semiconductor device includes a semiconductor substrate. The semiconductor substrate has a first cavity disposed through it, and conductive material covers at least the bottom portion of the first cavity. An integrated circuit is disposed on the top surface of the conductive material. The device further includes a cap disposed on the top surface of the substrate, such that a cavity disposed on a surface of the cap overlies the first cavity in the substrate. | 01-17-2013 |
20130062710 | Micro Electrical Mechanical System with Bending Deflection of Backplate Structure - A micro electrical mechanical system includes a membrane structure and a backplate structure. The backplate structure includes a backplate material and at least one pre-tensioning element mechanically connected to the backplate material. The at least one pre-tensioning element causes a mechanical tension on the backplate material for a bending deflection of the backplate structure in a direction away from the membrane structure. | 03-14-2013 |
20130089224 | ELECTROSTATIC LOUDSPEAKER WITH MEMBRANE PERFORMING OUT-OF-PLANE DISPLACEMENT - An electrostatic loudspeaker comprises a membrane structure and an electrode structure. The membrane structure comprises a central membrane portion and a circumferential membrane portion. The electrode structure is configured to electrostatically interact with the membrane structure for causing a movement of the membrane structure along an axis of movement. The electrode structure comprises a circumferential electrode portion and an opening, the circumferential electrode portion being substantially aligned to the circumferential membrane portion and the opening being substantially aligned to the central membrane portion with respect to a direction parallel to the axis of movement. In an end position of the movement of the membrane structure, the central membrane portion is configured to extend at least partially through the opening. A method for operating an electrostatic loudspeaker and a method for manufacturing an electrostatic loudspeaker are also described. | 04-11-2013 |
20130121509 | Sound Transducer with Interdigitated First and Second Sets of Comb Fingers - A sound transducer includes a substrate with a cavity with extending from a first surface of the substrate, a body at least partially covering the cavity and being connected to the substrate by at least one resilient hinge, a first set of comb fingers mounted to the substrate, and a second set of comb fingers mounted to the body. The first set of comb fingers and the second set of comb fingers are interdigitated and configured to create an electrostatic force driving the body in a direction perpendicular to the first surface of the substrate. The body and the at least one resilient hinge are configured for a resonant or a near-resonant excitation by the electrostatic force. | 05-16-2013 |
20130221453 | Tunable MEMS Device and Method of Making a Tunable MEMS Device - A tunable MEMS device and a method of manufacturing a tunable MEMS device are disclosed. In accordance with an embodiment of the present invention, a semiconductor device comprises a substrate, a moveable electrode and a counter electrode. The moveable electrode or the counter electrode comprises a first region and a second region, wherein the first region is isolated from the second region, wherein the first region is configured to be tuned, wherein the second region is configured to provide a sensing signal or control a system, and wherein the moveable electrode and the counter electrode are mechanically connected to the substrate. | 08-29-2013 |
20130223023 | MEMS Structure with Adjustable Ventilation Openings - A MEMS structure includes a backplate, a membrane, and an adjustable ventilation opening configured to reduce a pressure difference between a first space contacting the membrane and a second space contacting an opposite side of the membrane. The adjustable ventilation opening is passively actuated as a function of the pressure difference between the first space and the second space. | 08-29-2013 |
20130223654 | Adjustable Ventilation Openings in MEMS Structures - A MEMS structure and a method for operation a MEMS structure are disclosed. In accordance with an embodiment of the present invention, a MEMS structure comprises a substrate, a backplate, and a membrane comprising a first region and a second region, wherein the first region is configured to sense a signal and the second region is configured to adjust a threshold frequency from a first value to a second value, and wherein the backplate and the membrane are mechanically connected to the substrate. | 08-29-2013 |
20130257218 | Plate, Transducer and Methods for Making and Operating a Transducer - A plate, a transducer, a method for making a transducer, and a method for operating a transducer are disclosed. An embodiment comprises a plate comprising a first material layer comprising a first stress, a second material layer arranged beneath the first material layer, the second material layer comprising a second stress, an opening arranged in the first material layer and the second material layer, and an extension extending into opening, wherein the extension comprises a portion of the first material layer and a portion of the second material layer, and wherein the extension is curved away from a top surface of the plate based on a difference in the first stress and the second stress. | 10-03-2013 |
20130258301 | Test Structures and Methods - Test structures and methods for semiconductor devices, lithography systems, and lithography processes are disclosed. In one embodiment, a method of manufacturing a semiconductor device includes using a lithography system to expose a layer of photosensitive material of a workpiece to energy through a lithography mask, the lithography mask including a plurality of first test patterns having a first phase shift and at least one plurality of second test patterns having at least one second phase shift. The layer of photosensitive material of the workpiece is developed, and features formed on the layer of photosensitive material from the plurality of first test patterns and the at least one plurality of second test patterns are measured to determine a optimal focus level or optimal dose of the lithography system for exposing the layer of photosensitive material of the workpiece. | 10-03-2013 |
20130264663 | MEMS Device and Method of Making a MEMS Device - A MEMS device and a method of making a MEMS device are disclosed. In one embodiment a semiconductor device comprises a substrate, a moveable electrode and a counter electrode, wherein the moveable electrode and the counter electrode are mechanically connected to the substrate. The movable electrode is configured to stiffen an inner region of the movable membrane. | 10-10-2013 |
20140028192 | Field Emission Devices and Methods of Making Thereof - In one embodiment of the present invention, an electronic device includes a first emitter/collector region and a second emitter/collector region disposed in a substrate. The first emitter/collector region has a first edge/tip, and the second emitter/collector region has a second edge/tip. A gap separates the first edge/tip from the second edge/tip. The first emitter/collector region, the second emitter/collector region, and the gap form a field emission device. | 01-30-2014 |
20140103460 | MEMS Device and Method of Manufacturing a MEMS Device - A method for manufacturing a MEMS device is disclosed. Moreover a MEMS device and a module including a MEMS device are disclosed. An embodiment includes a method for manufacturing MEMS devices includes forming a MEMS stack on a first main surface of a substrate, forming a polymer layer on a second main surface of the substrate and forming a first opening in the polymer layer and the substrate such that the first opening abuts the MEMS stack. | 04-17-2014 |
20140197501 | MEMS Device with Polymer Layer, System of a MEMS Device with a Polymer Layer, Method of Making a MEMS Device with a Polymer Layer - A MEMS device, a method of making a MEMS device and a system of a MEMS device are shown. In one embodiment, a MEMS device includes a first polymer layer, a MEMS substrate disposed on the first polymer layer and a MEMS structure supported by the MEMS substrate. The MEMS device further includes a first opening disposed in the MEMS substrate and a second opening disposed in the first polymer layer. | 07-17-2014 |
20140197502 | Comb MEMS Device and Method of Making a Comb MEMS Device - A MEMS device and a method to manufacture a MEMS device are disclosed. An embodiment includes forming trenches in a first main surface of a substrate, forming conductive fingers by forming a conductive material in the trenches and forming an opening from a second main surface of the substrate thereby exposing the conductive fingers, the second main surface opposite the first main surface. | 07-17-2014 |
20140210020 | MEMS Device and Method of Manufacturing a MEMS Device - MEMS devices with a rigid backplate and a method of making a MEMS device with a rigid backplate are disclosed. In one embodiment, a device includes a substrate and a backplate supported by the substrate. The backplate includes elongated protrusions. | 07-31-2014 |
20140264651 | Semiconductor Devices and Methods of Forming Thereof - In accordance with an embodiment of the present invention, a method of forming a semiconductor device includes forming a sacrificial layer over a first surface of a workpiece having the first surface and an opposite second surface. A membrane is formed over the sacrificial layer. A through hole is etched through the workpiece from the second surface to expose a surface of the sacrificial layer. At least a portion of the sacrificial layer is removed from the second surface to form a cavity under the membrane. The cavity is aligned with the membrane. | 09-18-2014 |
20140270271 | MEMS Acoustic Transducer, MEMS Microphone, MEMS Microspeaker, Array of Speakers and Method for Manufacturing an Acoustic Transducer - A MEMS acoustic transducer includes a substrate having a cavity therethrough, and a conductive back plate unit including a plurality of conductive perforated back plate portions which extend over the substrate cavity. A dielectric spacer arranged on the back plate unit between adjacent conductive perforated back plate portions, and one or more graphene membranes are supported by the dielectric spacer and extend over the conductive perforated back plate portions. | 09-18-2014 |
20150014796 | Device with MEMS Structure and Ventilation Path in Support Structure - A device includes a support structure, a sound port disposed in the support structure, and a MEMS structure including a membrane acoustically coupled to the sound port. The membrane separates a first space contacting a first side of the membrane from a second space contacting an opposite second side of the membrane. The device further includes an adjustable ventilation path disposed in the support structure and extending from the sound port to the second space. | 01-15-2015 |
20150021722 | MEMS Device - A MEMS device includes a membrane comprising a first plurality of fingers. A counter electrode arrangement includes a second plurality of fingers disposed in a interdigitated relationship with the first plurality of fingers of the membrane. A deflector is configured to deflect the membrane such that the first and second plurality of fingers are displaced in a position excluding maximum overlapping of surfaces of the fingers. | 01-22-2015 |
20150024536 | MEMS Device and Method of Manufacturing a MEMS Device - MEMS devices with a rigid backplate and a method of making a MEMS device with a rigid backplate are disclosed. In one embodiment, a device includes a substrate and a backplate supported by the substrate. The backplate includes elongated protrusions. | 01-22-2015 |
20150054097 | Method for Manufacturing a MEMS Device and MEMS Device - A method for manufacturing a MEMS device includes providing a cavity within a layer adjacent to a sacrificial layer. The cavity extends to the sacrificial layer and includes a capillary slot protruding into the layer. The sacrificial layer is removed by exposing the sacrificial layer to an etching agent that is introduced through the cavity. | 02-26-2015 |
20150061048 | Packaged MEMS Device - A packaged MEMS device may include an embedding arrangement, a MEMS device disposed in the embedding arrangement, a sound port disposed in the embedding arrangement and acoustically coupled to the MEMS device, and a grille within the sound port. Some embodiments relate to a sound transducer component including an embedding material and a substrate-stripped MEMS die embedded into the embedding material. The MEMS die may comprise a diaphragm for sound transduction. The sound transducer component may further comprise a sound port within the embedding material in fluidic or acoustic contact with the diaphragm. Further embodiments relate to a method for packaging a MEMS device or to a method for manufacturing a sound transducer component. | 03-05-2015 |
20150078587 | Adjustable Ventilation Openings in MEMS Structures - A MEMS structure and a method for operation a MEMS structure are disclosed. In accordance with an embodiment of the present invention, a MEMS structure comprises a substrate, a backplate, and a membrane comprising a first region and a second region, wherein the first region is configured to sense a signal and the second region is configured to adjust a threshold frequency from a first value to a second value, and wherein the backplate and the membrane are mechanically connected to the substrate. | 03-19-2015 |