Patent application number | Description | Published |
20090051016 | ELECTRONIC COMPONENT WITH BUFFER LAYER - An electronic component includes a metal substrate, a semiconductor chip configured to be attached to the metal substrate, and a buffer layer positioned between the metal substrate and the semiconductor chip configured to mechanically decouple the semiconductor chip and the metal substrate. The buffer layer extends across less than an entire bottom surface of the semiconductor chip. | 02-26-2009 |
20090273066 | SEMICONDUCTOR DEVICE AND METHOD - An electronic device and fabrication of an electronic device. One embodiment provides applying a paste including electrically conductive particles to a surface of a semiconductor wafer. The semiconductor wafer is singulated with the electrically conductive particles for obtaining a plurality of semiconductor chips. At least one of the plurality of semiconductor chips is placed over a carrier with the electrically conductive particles facing the carrier. The electrically conductive particles are heated until the at least one semiconductor chip adheres to the carrier. | 11-05-2009 |
20090283879 | SEMICONDUCTOR DEVICE AND METHOD - A chip carrier includes first, second and third layers with the second layer situated between the first and third layers. The first and third layers are formed of a first material and the second layer is formed of a second material. The second layer has a plurality of holes extending therethrough and the first material fills the holes. | 11-19-2009 |
20110084369 | DEVICE INCLUDING A SEMICONDUCTOR CHIP AND A CARRIER AND FABRICATION METHOD - A description is given of a method. In one embodiment the method includes providing a semiconductor chip with semiconductor material being exposed at a first surface of the semiconductor chip. The semiconductor chip is placed over a carrier with the first surface facing the carrier. An electrically conductive material is arranged between the semiconductor chip and the carrier. Heat is applied to attach the semiconductor chip to the carrier. | 04-14-2011 |
20110127314 | BONDING MATERIAL WITH EXOTHERMICALLY REACTIVE HETEROSTRUCTURES - A bonding material including a meltable joining material and a plurality of heterostructures distributed throughout the meltable joining material, the heterostructures comprising at least a first material and a second material capable of conducting a self-sustaining exothermic reaction upon initiation by an external energy to generate heat sufficient to melt the meltable joining material. | 06-02-2011 |
20120208323 | Method for Mounting a Semiconductor Chip on a Carrier - A method includes providing a semiconductor chip having a first main surface and a layer of solder material deposited on the first main surface, wherein the layer of solder material has a roughness of at least 1 μm. The semiconductor chip is placed on a carrier with the first main surface of the semiconductor chip facing the carrier. The semiconductor chip is pressed on the carrier with a pressure of at least 1 Newton per mm | 08-16-2012 |
20120313230 | SOLDER ALLOYS AND ARRANGEMENTS - A solder alloy is providing, the solder alloy including zinc, aluminum, magnesium and gallium, wherein the aluminum constitutes by weight 8% to 20% of the alloy, the magnesium constitutes by weight 0.5% to 20% of the alloy and the gallium constitutes by weight 0.5% to 20% of the alloy, the rest of the alloy including zinc. | 12-13-2012 |
20120316703 | METHOD AND APPARATUS FOR ACCESS AND/OR STARTING VERIFICATION - A method for access or starting verification for a vehicle using a mobile identification encoder and at least two antennas located in or on the vehicle at different locations includes: the antennas emitting electromagnetic signals at alterable times, wherein the electromagnetic signals are emitted in transmission blocks having alterable specific properties and wherein a plurality of transmission blocks are strung together to form a communication message in which each transmission block adopts an alterable position in time, the identification encoder receiving the electromagnetic signals emitted by the antennas and processing them to generate a response signal, and altering at least one of the times at which the individual antennas are actuated, the specific properties of the individual transmission blocks, and the position of the individual transmission blocks in time in the communication message in accordance with a cryptographical method. | 12-13-2012 |
20130140685 | Electronic Device and a Method for Fabricating an Electronic Device - The electronic device includes a carrier, a semiconductor substrate attached to the carrier, and a layer system disposed between the semiconductor substrate and the carrier. The layer system includes an electrical contact layer disposed on the semiconductor substrate. A functional layer is disposed on the electrical contact layer. An adhesion layer is disposed on the functional layer. A solder layer is disposed between the adhesion layer and the carrier. | 06-06-2013 |
20130200502 | Semiconductor Device and Method of Manufacturing Thereof - A method of manufacturing a semiconductor device includes providing a transfer foil. A plurality of semiconductor chips is placed on and adhered to the transfer foil. The plurality of semiconductor chips adhered to the transfer foil is placed over a multi-device carrier. Heat is applied to laminate the transfer foil over the multi-device carrier, thereby accommodating the plurality of semiconductor chips between the laminated transfer foil and the multi-device carrier. | 08-08-2013 |
20140070376 | Methods for manufacturing a chip arrangement, methods for manufacturing a chip package, a chip package and chip arrangements - A method for manufacturing a chip arrangement is provided, the method including: forming a hole in a carrier including at least one chip, wherein forming a hole in the carrier includes: selectively removing carrier material, thereby forming a cavity in the carrier, forming passivation material over one or more cavity walls exposed by the selective removal of the carrier material; selectively removing a portion of the passivation material and further carrier material exposed by the selective removal of the passivation material, wherein a further portion of the passivation material remains over at least one cavity side wall; the method further including subsequently forming a layer over the further portion of passivation material remaining over the at least one cavity side wall. | 03-13-2014 |
20140167224 | Semiconductor Device and Method of Producing the Same - A semiconductor device includes a semiconductor chip including a first main face and a second main face. The second main face is the backside of the semiconductor chip. The second main face includes a first region and a second region. The second region is a peripheral region of the second main face and the level of the first region and the level of the second region are different. The first region may be filled with metal and may be planarized to the same level as the second region. | 06-19-2014 |
20140329361 | Method for Mounting a Semiconductor Chip on a Carrier - A method includes providing a semiconductor chip having a first main surface and a layer of solder material deposited on the first main surface, wherein the layer of solder material has a roughness of at least 1 μm. The semiconductor chip is placed on a carrier with the first main surface of the semiconductor chip facing the carrier. The semiconductor chip is pressed on the carrier with a pressure of at least 1 Newton per mm | 11-06-2014 |