| Patent application number | Description | Published |
|---|
| 20080237718 | METHODS OF FORMING HIGHLY ORIENTED DIAMOND FILMS AND STRUCTURES FORMED THEREBY - Methods and associated structures of forming a microelectronic device are described. Those methods may include forming a first HOD layer on a first side of a first silicon substrate, forming a CMOS region on a second side of the silicon substrate, forming amorphous silicon on the CMOS region, recrystallizing the amorphous silicon to form a first single crystal silicon layer, and forming a second HOD layer on the first single crystal silicon layer. | 10-02-2008 |
| 20080237844 | Microelectronic package and method of manufacturing same - A microelectronic package includes a package substrate ( | 10-02-2008 |
| 20090242247 | Package substrate and die spacer layers having a ceramic backbone - A layer or layers for use in package substrates and die spacers are described. The layer or layers include a plurality of ceramic wells lying within a plane and separated by metallic vias. Recesses within the ceramic wells are occupied by a dielectric filler material. | 10-01-2009 |
| 20090309687 | METHOD OF MANUFACTURING AN INDUCTOR FOR A MICROELECTRONIC DEVICE, METHOD OF MANUFACTURING A SUBSTRATE CONTAINING SUCH AN INDUCTOR, AND SUBSTRATE MANUFACTURED THEREBY, - A method of manufacturing an inductor for a microelectronic device comprises providing a substrate ( | 12-17-2009 |
| 20100327424 | Multi-chip package and method of providing die-to-die interconnects in same - A multi-chip package includes a substrate ( | 12-30-2010 |
| 20110278044 | MAGNETIC ATTACHMENT STRUCTURE - The present disclosure relates to the field of fabricating microelectronic packages, wherein components of the microelectronic packages may have magnetic attachment structures comprising a magnetic component and a metal component. The magnetic attachment structure may be exposed to a magnetic field, which, through the vibration of the magnetic component, can heat the magnetic attachment structure, and which when placed in contact with a solder material can reflow the solder material and attach microelectronic components of the microelectronic package. | 11-17-2011 |
| 20110278351 | MAGNETIC PARTICLE ATTACHMENT MATERIAL - The present disclosure relates to the field of fabricating microelectronic packages, wherein a magnetic particle attachment material comprising magnetic particles distributed within a carrier material may be used to achieve attachment between microelectronic components. The magnetic particle attachment material may be exposed to a magnetic field, which, through the vibration of the magnetic particles within the magnetic particle attachment material, can heat a solder material to a reflow temperature for attaching microelectronic components of the microelectronic packages. | 11-17-2011 |
| 20110302771 | METHOD OF MANUFACTURING AN INDUCTOR FOR A MICROELECTRONIC DEVICE, METHOD OF MANUFACTURING A SUBSTRATE CONTAINING SUCH AN INDUCTOR, AND SUBSTRATE MANUFACTURED THEREBY - A method of manufacturing an inductor for a microelectronic device comprises providing a substrate ( | 12-15-2011 |
