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Albaugh

John Albaugh, Freeland, MI US

Patent application numberDescriptionPublished
20090110917Electronic Package and Method of Preparing Same - An electronic package comprising an interfacial coating between a first inorganic barrier coating and a second inorganic barrier coating, wherein the interfacial coating comprises a cured product of a silicone resin; and methods of preparing the electronic package.04-30-2009

John Dean Albaugh, Freeland, MI US

Patent application numberDescriptionPublished
20090004606Radiation Sensitive Silicone Resin Composition - This invention relates to acrylic functional resin compositions. More particularly, this invention relates to Poly [organ-co-(meth)acryloxyorgano]silsequioxane resins that are curable upon exposure to ultraviolet radiation with photo initiator or upon heating with or without a free radical generator. The resin compositions have high storage stability at room temperature and produces films that are useful as planarization layer, interlayer dielectric, passivation layer, gas permeable layer, negative photoresist, antireflective coating, conformal coating and IC packaging.01-01-2009
20090130463Coated Substrates and Methods for their Preparation - Coated substrates comprising an inorganic barrier coating and an interfacial coating, wherein the interfacial coating comprises a cured product of a silicone resin having silicon-bonded radiation-sensitive groups; and methods of preparing the coated substrates.05-21-2009

Pamela Albaugh, Carmel, IN US

Patent application numberDescriptionPublished
20100267698Benzimidazole and Pyridylimidazole Derivatives - This invention relates to benzimidazoles, pyridylimidazoles and related bicyclic heteroaryl compounds, all of which may be described by of Formula I10-21-2010

Patent applications by Pamela Albaugh, Carmel, IN US