Patent application number | Description | Published |
20090164797 | SECURE OFF-CHIP PROCESSING SUCH AS FOR BIOMETRIC DATA - In a biometric sensor system and method, storage of acquired biometric data and/or processing of that data may be shifted from specialized secure processing hardware to host system resources for improved speed and reduced cost of biometric sensor devices and systems. Stored data may be encrypted and/or signed by the specialized secure processing hardware and/or software. A database of authorized biometric data (e.g., patterns or key features representing all or a portion of the fingerprints of authorized users) may be stored on the host system either encrypted or non-encrypted or both. Preliminary matching against a database of many enrolled fingerprints may be accomplished by the system processor to ease the processing burden on the specialized secure processing hardware/software. Final match confirmation remains within exclusive control of the specialized secure processing hardware/software in order to prevent data tampering or other efforts to defeat the security provided by biometric identification. | 06-25-2009 |
20090166411 | HYBRID MULTI-SENSOR BIOMETRIC IDENTIFICATION DEVICE - An improved fingerprint sensing device is provided with multiple sensing apparatus, two or more of which operating on different sensing principles. For example, a capacitive sensor may be integrally formed with an optical sensor on a single substrate. Ideally, the multiple sensing apparatus are disposed such that they may sense nearly identical portions of a fingerprint simultaneously. A primary sensor may be employed to establish the identity of a user based on a fingerprint, while a secondary sensor may be employed to establish that the fingerprint is part of a live human (anti-spoofing). Integrated light sources may be provided to drive an optical sensor. The light sources may also provide visual cues for usage, and enhance the aesthetics of the device. | 07-02-2009 |
20090169071 | Pseudo-Translucent Integrated Circuit Package - An integrated circuit (IC) package includes at least one light source disposed together with an IC structure within an encapsulation structure. The material forming the encapsulation structure is generally opaque. Accordingly, the light source and at least a portion of the IC are not visible to the unaided human eye. The thickness and geometry of the encapsulation are such that when the light source is caused to emit light, the encapsulation structure permits at least a portion of that light to be visible to a user. The IC may be a portion of a fingerprint sensor, exposed for receiving a fingertip of a user. The light source, or a plurality of such light sources, may be functional (e.g., providing visual indication of the of the condition or state of an item of hardware or software, assist the user in operation of a device), be primarily aesthetic, or a combination thereof. | 07-02-2009 |
20100127366 | Integrated Leadframe And Bezel Structure And Device Formed From Same - An integrated leadframe and bezel structure includes a planar carrier frame, a plurality of bonding leads, a die pad region, and a bezel structure. The bezel structure includes a bending portion shaped and disposed to facilitate a portion of said bezel structure being bent out of the plane of said carrier frame. A sensor IC may be secured to the die pad region, and wire bonds made to permit external connection to the sensor IC. The bezel structure includes portions which are bent such that their upper extent is in or above a sensing surface. The assembly is encapsulated, exposing on the top surface part of the bezel portions and the upper surface of the sensor IC, and on the bottom surface the contact pads. Two or more bezel portions may be provided, one or more on each side of the sensor IC. | 05-27-2010 |
20110215341 | Biometric Sensor Assembly With Integrated Visual Indicator - A biometric sensor assembly comprises a substrate to which is mounted a die containing sensor circuitry, at least one conductive bezel having a visual indicator region formed therein, and electrically connected to said die by way of said substrate, a light source, and a light-directing region directing light from the light source to the visual indicator region. The die, the light-directing region, and the bezel are encased in an encapsulation structure such that a portion of a surface of the die and the visual indication region are exposed or at most thinly covered by the encapsulation structure. The light-directing region directs light emitted by the light source within the encapsulation structure to the visual indicator region. Desired indicia in the visual indicator region may thereby be illuminated, while the die and bezel, and optionally the light source, are protected by the encapsulation structure. | 09-08-2011 |
20110215484 | Integrally Molded Die And Bezel Structure For Fingerprint Sensors And The Like - A biometric sensor device, such as a fingerprint sensor, comprises a substrate to which is mounted a die on which is formed a sensor array and at least one conductive bezel. The die and the bezel are encased in a unitary encapsulation structure to protect those elements from mechanical, electrical, and environmental damage, yet with a portion of the sensor array and the bezel exposed or at most thinly covered by the encapsulation or other coating material structure. | 09-08-2011 |
20130154031 | INTEGRALLY MOLDED DIE AND BEZEL STRUCTURE FOR FINGERPRINT SENSORS AND THE LIKE - A biometric sensor device, such as a fingerprint sensor, comprises a substrate to which is mounted a die on which is formed a sensor array and at least one conductive bezel. The die and the bezel are encased in a unitary encapsulation structure to protect those elements from mechanical, electrical, and environmental damage, yet with a portion of the sensor array and the bezel exposed or at most thinly covered by the encapsulation or other coating material structure. | 06-20-2013 |
20130320464 | INTEGRALLY MOLDED DIE AND BEZEL STRUCTURE FOR FINGERPRINT SENSORS AND THE LIKE - A biometric sensor device, such as a fingerprint sensor, comprises a substrate to which is mounted a die on which is formed a sensor array and at least one conductive bezel. The die and the bezel are encased in a unitary encapsulation structure to protect those elements from mechanical, electrical, and environmental damage, yet with a portion of the sensor array and the bezel exposed or at most thinly covered by the encapsulation or other coating material structure. | 12-05-2013 |