| Patent application number | Description | Published |
|---|
| 20080277787 | METHOD AND PAD DESIGN FOR THE REMOVAL OF BARRIER MATERIAL BY ELECTROCHEMICAL MECHANICAL PROCESSING - A method and apparatus for processing barrier and metals disposed on a substrate in an electrochemical mechanical planarizing system are provided. In certain embodiments a method for electroprocessing a substrate is provided. The method comprises contacting the substrate with the non-conductive surface of a polishing pad assembly, establishing a first electrically conductive path through an electrolyte between an exposed layer of barrier material and a first electrode, establishing a second electrically conductive path through the electrolyte between the exposed layer of barrier material and a second electrode, applying a voltage to the first electrode to cause a voltage drop between the substrate and the second electrode, and removing the barrier material from the substrate. | 11-13-2008 |
| 20090061617 | EDGE BEAD REMOVAL PROCESS WITH ECMP TECHNOLOGY - A method and apparatus for the removal of a deposited conductive layer along an edge of a substrate using a power ring configured to electro polish an edge of the substrate are provided. The electro polishing of the substrate edge may occur simultaneously with the electrochemical mechanical processing of a substrate face. In certain embodiments a method of electrochemically polishing a substrate having a conductive material disposed thereon is provided. A substrate is coupled with a carrier head comprising a power ring which surrounds an edge of the substrate, wherein the edge of the substrate includes the conductive material. A polishing pad is contacted with a face of the substrate. A first voltage is applied to the power ring to remove conductive material from the edge of the substrate. A second voltage different from the first voltage is applied to the polishing pad to remove a portion of the conductive material from the face of the substrate. | 03-05-2009 |
| 20090061741 | ECMP POLISHING SEQUENCE TO IMPROVE PLANARITY AND DEFECT PERFORMANCE - A method for processing a substrate having a conductive layer disposed thereon is provided. The substrate is coupled with a planarizing head. The planarizing head is moved to a position above a polishing pad assembly. The planarizing pad is positioned relative to the polishing pad assembly without applying a voltage to the substrate. A first voltage is applied to the substrate for a first time period. A second voltage is applied to the substrate for a second time period in order to remove a portion of the conductive layer, wherein the second voltage is greater than the first voltage. In certain embodiments, applying a first voltage to the substrate further comprises forming a uniform passivation layer on the conductive layer. | 03-05-2009 |
| 20090088050 | CONDUCTIVE POLISHING ARTICLE FOR ELECTROCHEMICAL MECHANICAL POLISHING - A conductive polishing article is provided. The conductive polishing article at least has a polishing pad, cathodes and anodes. Cathodes and anodes are disposed below the polishing surface of the polishing pad, and an ion exchange membrane at least partially covers the anodes. | 04-02-2009 |
| 20100130013 | SLURRY COMPOSITION FOR GST PHASE CHANGE MEMORY MATERIALS POLISHING - A CMP method for polishing a phase change alloy on a substrate surface including positioning the substrate comprising a phase change alloy material on a platen containing a polishing pad and delivering a polishing slurry to the polishing pad. The polishing slurry includes colloidal particles with a particle size less than 60 nm, in an amount between 0.2% to about 10% by weight of slurry, a pH adjustor, a chelating agent, an oxidizing agent in an amount less than 1% by weight of slurry, and polyacrylic acid. The substrate on the platen is polished to remove a portion of the phase change alloy. A rinsing solution for rinsing the substrate on the platen includes deionized water and at least one component in the deionized water where the component selected from the group consisting of polyethylene imine, polyethylene glycol, polyacrylic amide, alcohol ethoxylates, polyacrylic acid, an azole containing compound, benzo-triazole, and combinations thereof. | 05-27-2010 |
| 20100267318 | POLISHING PAD WITH PROJECTING PORTION - A polishing pad include a polishing layer having a polishing surface and a backing layer on a side of the polishing layer opposite the polishing surface. An outer edge of the polishing layer overhangs an outer edge of the backing layer. | 10-21-2010 |
| 20100279585 | METHOD OF MAKING AND APPARATUS HAVING WINDOWLESS POLISHING PAD AND PROTECTED FIBER - A polishing system includes a polishing pad with an aperture that extends through all layers of the polishing pad and a light transmissive film positioned on top of a light-generating or light-guiding element of an optical monitoring system. | 11-04-2010 |
| 20110053465 | METHOD AND APPARATUS FOR LOCAL POLISHING CONTROL - A method and apparatus for local polishing and deposition control in a process cell is generally provided. In one embodiment, an apparatus for electrochemically processing a substrate is provided that selectively polishes discrete conductive portions of a substrate by controlling an electrical bias profile across a processing area, thereby controlling processing rates between two or more conductive portions of the substrate. | 03-03-2011 |
