Patent application number | Description | Published |
20090009927 | CERAMIC ELECTRONIC COMPONENT - A ceramic electronic component includes a ceramic body and an internal electrode layers disposed within the ceramic body. The ceramic body is covered with a diffusion layer, wherein said diffusion layer is an oxide layer into which at least a part of elements contained in the ceramic body are diffused and is located closer to a surface of the ceramic body than an outermost internal electrode layer. | 01-08-2009 |
20090042048 | CERAMIC GREEN SHEET STRUCTURE AND METHOD FOR MANUFACTURING LAMINATED CERAMIC ELECTRONIC COMPONENT - A ceramic green sheet structure has a ceramic green sheet including at least a ceramic material and a resin and a conductive layer formed on the ceramic green sheet. An electrode non-formed area has a porosity equal to or greater than 17%, and preferably, equal to or less than 25%. Moreover, an electrode formed area where the conductive layer is formed may have a smaller porosity than the electrode non-formed area where no conductive layer is formed. | 02-12-2009 |
20090207554 | CERAMIC ELECTRONIC COMPONENT, MANUFACTURING METHOD OF CERAMIC ELECTRONIC COMPONENT, AND PACKAGING METHOD OF CERAMIC ELECTRONIC COMPONENTS - A ceramic electronic component has a chip element body having a conductor arranged inside, external electrodes, and a discrimination layer. The chip element body has first and second end faces facing each other, first and second side faces being perpendicular to the first and second end faces and facing each other, and third and fourth side faces being perpendicular to the first and second end faces and to the first and second side faces and facing each other. The external electrodes are formed on the first and second end faces, respectively, of the chip element body. The discrimination layer is provided on at least one side face out of the first side face and the second side face in the chip element body. The chip element body is comprised of a first ceramic. The discrimination layer is comprised of a second ceramic different from the first ceramic and has a color different from that of the third and fourth side faces. | 08-20-2009 |
20090211687 | Method for manufacturing multilayer electronic component - The present invention aims to provide a method for manufacturing a multilayer electronic component capable to remove a multilayer body very easily from the press mold without breaking the multilayer body when removing a green sheet multilayer body applied with a pressure from the press mold, furthermore has no waste of material, contributes to the environment conservation, and also easy to automate. Among the plurality of green sheets constituting a multilayer body | 08-27-2009 |
20110114378 | MULTILAYER CERAMIC CAPACITOR MOUNTING STRUCTURE AND MULTILAYER CERAMIC CAPACITOR - A multilayer ceramic capacitor has an element body formed by alternately laminating a plurality of dielectric layers and a plurality of inner electrodes. On a substrate having a mounting surface provided with at least two lands, the multilayer ceramic capacitor is mounted such that the inner electrodes are parallel to the mounting surface. A multilayer ceramic capacitor mounting structure satisfies T | 05-19-2011 |
20130222969 | DIELECTRIC CERAMIC COMPOSITION AND ELECTRONIC DEVICE - A dielectric ceramic composition comprising a compound shown by a general formula {A | 08-29-2013 |
20130222974 | DIELECTRIC CERAMIC COMPOSITION AND ELECTRONIC DEVICE - Dielectric ceramic composition comprising a compound shown by a general formula {A | 08-29-2013 |
20140055910 | CERAMIC ELECTRONIC COMPONENT - A ceramic electronic component comprising; including a chip component of approximately rectangular parallelepiped, a first metal terminal portion having a first flat plate portion facing a first end face, at least a pair of first fitting arm portions connected to the first flat plate portion, having a first engagement projection engaging with a first wraparound portion holding the first wraparound portion in between, and a first mounting portion connected to the first flat plate portion and extending approximately parallel to one side face, and a second metal terminal portion having a second flat plate portion facing the second end face, at least a pair of second fitting arm portions connected to the second flat plate portion, having a second engagement projection engaging with a second wraparound portion, holding the second wraparound portion in between, and a second mounting portion extending approximately parallel to one side face | 02-27-2014 |
20140118882 | CERAMIC ELECTRONIC COMPONENT WITH METAL TERMINALS - A ceramic electronic component with metal terminals comprising a chip component formed with terminal electrodes at both ends, and a pair of metal terminals comprising a flat plate portion having a flat plate portion facing face provided so that it faces an end face of said chip component and connected to said terminal electrodes via a joining portion , and a mounting portion connected to one end portion of said flat plate portion and extending approximately perpendicular to said flat plate portion, wherein said mounting portion has a mounting portion bottom face forming an angle of approximately 270 degrees with respect to said flat plate portion, and a mounting portion upper face forming an angle of approximately 90 degrees with respect to said flat plate portion, and a solder adhering prevention area having lower wettability than said mounting portion bottom face is formed. | 05-01-2014 |
20150036262 | MULTILAYER CERAMIC ELECTRONIC DEVICE - A multilayer ceramic electronic device comprising a lamination in which an internal electrode layer | 02-05-2015 |