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Akira Yamada

Akira Yamada, Osaka JP

Patent application numberDescriptionPublished
20080266421IMAGE CAPTURE DEVICE AND IMAGE PROCESSING DEVICE - An image capture device includes: an imager for imaging an object and generating image data; an image file generator for generating an image file by adding, to the image data generated by the imager, a header portion which stores at least one type of information concerning shooting circumstances; a timer for outputting information indicating a current time; and a manipulation section which is used to set period information specifying a period. The image file generator changes the type of information to be stored in the header portion depending on whether a time of imaging as indicated by the information which is output from the timer at the time of the imaging falls within the period specified by the period information.10-30-2008
20090011676Component Bonding Method and Component Bonding Device - Provided is a component bonding method with higher bonding precision in a process of bonding an electrode of a component to an electrode formed on a flat panel. A preliminary press bonding device includes: a control unit which includes a position displacement amount correction unit to which a position displacement amount after the press bonding process is fed back and which corrects the position displacement on the next component to be preliminarily bonded; and a component position determining unit which determines a position of the component using the fed back correction amount. On the other hand, a press bonding device includes a bonding recognition device for use in the recognition of positions of the electrodes on the flat panel and the component. The bonding recognition device includes a position displacement amount calculating unit which calculates the position displacement amount based on the recognized position information.01-08-2009
20090038698Coupling apparatus for passage blocks - A passage block coupling apparatus is provided with a bolt insertion hole 02-12-2009
20090244351IMAGE CAPTURE DEVICE - An image capture device includes a viewfinder for viewing a subject. The viewfinder either forms an integral part of the device or is an external member that is attachable to, and removable from, the device. The device includes: an optical system; a generating section for capturing an image of the subject through the optical system and generating image data; a detecting section for detecting the degree of focusing of the subject's image represented by the image data; a display section on which the subject's image is presentable based on the image data; and a controller for accepting a decision to use either the display section or the viewfinder for viewing the subject to shoot. If the controller accepts the decision to use the viewfinder, the display section displays no subject's image, and displays information about the degree of focusing of the subject's image for at least a certain period of time. The information has been obtained based on a result of detection done by the detecting section.10-01-2009
20100318941ELECTRONIC DEVICE - A user-friendly electronic device is provided by getting icons shown on a display section.12-16-2010
20110122293IMAGE PROCESSING UNIT - An image processor that can get a number of image files resized collectively is provided in order to realize a more user-friendly resizing function.05-26-2011
20120062598IMAGE DISPLAYING APPARATUS - The image displaying apparatus of the present invention provides a first display mode in which a first display region for one screen image is formed in a display screen, with the short side direction of the display screen aligned with the vertical direction; and a second display mode in which a first display region and a second display region for two screen images are formed in the display screen, with the long side direction of the display screen aligned with the vertical direction, and the first display region and the second display region formed such that they are arranged up and down. According to this configuration, when images are displayed in a double screen, each image can be displayed as large as possible.03-15-2012

Patent applications by Akira Yamada, Osaka JP

Akira Yamada, Fukuoka JP

Patent application numberDescriptionPublished
20100292138Peptide Derived from Hepatitis C Virus - Disclosed is a pharmaceutical composition for the treatment of an HCV-related disease in a patient having HLA-A24 or -A3 supertype, wherein the pharmaceutical composition comprises a peptide having an amino acid sequence represented by the formula: YLLPRRGPRL (SEQ ID NO:1) as an active ingredient. Also disclosed is a composition for use in the detection of the induction of an HLA-A24 or -A3 supertype-restricted cytotoxic T cell in a patient having HLA-A24 or -A3 supertype, wherein the composition comprises a peptide having an amino acid sequence depicted in SEQ ED NO:1 as an active ingredient.11-18-2010

Akira Yamada, Fukuoka-Ken JP

Patent application numberDescriptionPublished
20100278851CTL INDUCER COMPOSITION - The present invention provides a CTL inducer composition which comprises one or more peptides selected from the group consisting of the peptides of SEQ ID NOS: 1 to 27 in the Sequence Listing, and can be used for the treatment or prevention of cancer or a hepatitis C virus-related disease in two or more patient groups selected from the group consisting of an HLA-A2 positive patient group, an HLA-A24 positive patient group, an HLA-A26 positive patient group, and an HLA-A3 supertype positive patient group.11-04-2010

Akira Yamada, Nukata-Gun JP

Patent application numberDescriptionPublished
20080293202 Method for manufacturing semiconductor device - A semiconductor device includes: a semiconductor substrate with a principal plane; a base region disposed on the principal plane; a source region disposed on the principal plane in the base region to be shallower than the base region; a drain region disposed on the principal plane, and spaced to the base region; a trench disposed on the principal plane; a trench gate electrode disposed in the trench through a trench gate insulation film; a planer gate electrode disposed on the principal plane of the semiconductor substrate through a planer gate insulation film; and an impurity diffusion region having high concentration of impurities and disposed in a portion of the base region to be a channel region facing the planer gate electrode.11-27-2008
20090121290Semiconductor device with high-breakdown-voltage transistor - A semiconductor device includes a high-breakdown-voltage transistor having a semiconductor layer. The semiconductor layer has an element portion and a wiring portion. The element portion has a first wiring on a front side of the semiconductor layer and a backside electrode on a back side of the semiconductor layer. The element portion is configured as a vertical transistor that causes an electric current to flow in a thickness direction of the semiconductor layer between the first wiring and the backside electrode. The backside electrode is elongated to the wiring portion. The wiring portion has a second wiring on the front side of the semiconductor layer. The wiring portion and the backside electrode provide a pulling wire that allows the electric current to flow to the second wiring.05-14-2009
20090127605Semiconductor device and method for manufacturing the same - A semiconductor device includes: n transistor elements; n resistive elements; and n capacitive elements, each kind of elements coupled in series between the first and second terminals. The gate of each transistor element has a gate pad, and each transistor element includes transistor pads disposed on both sides. Each resistive element includes resistive pads disposed on both sides. Each capacitive element includes capacitive pads disposed on both sides. The gate pad other than the first stage transistor element, a corresponding resistive pad, and a corresponding capacitive pad are electrically coupled. One transistor pad, one resistive pad, and one capacitive pad in the first stage are electrically coupled. One transistor pad, one resistive pad, and one capacitive pad in the n-th stage are electrically coupled.05-21-2009
20090152668Semiconductor apparatus - A semiconductor apparatus is disclosed. The semiconductor apparatus includes an SOI substrate including an active layer, a buried insulation film and a support substrate; a low potential reference circuit part located in the active layer and operable at a first reference potential; a high potential reference circuit part located in the active layer and operable at a second reference potential; a level-shifting element forming part located in the active layer and for providing a level-shift between the first and second reference potentials; and an insulation member insulating first and second portions of the support substrate from each other, wherein locations of the first and second portions respectively correspond to the low and high potential reference circuit parts.06-18-2009
20100099225Method for manufacturing semiconductor device having LDMOS transistor - A semiconductor device includes: a semiconductor substrate having a first semiconductor layer, an insulation layer and a second semiconductor layer, which are stacked in this order; a LDMOS transistor disposed on the first semiconductor layer; and a region having a dielectric constant, which is lower than that of the first or second semiconductor layer. The region contacts the insulation layer, and the region is disposed between a source and a drain of the LDMOS transistor. The device has high withstand voltage in a direction perpendicular to the substrate.04-22-2010
20100238632Load driving device - A load driving device includes: an output power device for driving a load; a driving IC for controlling the output power device, wherein the driving IC is electrically coupled with the output power device through a wire or a connection member; and a first electrode substrate. The output power device and the driving IC are mounted on the first electrode substrate. In this case, the output power device is controlled with high speed, and a mounting area of the output power device and the driving IC is reduced.09-23-2010
20110298446CURRENT SENSOR, INVERTER CIRCUIT, AND SEMICONDUCTOR DEVICE HAVING THE SAME - A semiconductor device having a lateral semiconductor element includes a semiconductor substrate, a first electrode on the substrate, a second electrode on the substrate, and an isolation structure located in the substrate to divide the substrate into a first island and a second island electrically insulated from the first island. The lateral semiconductor element includes a main cell located in the first island and a sense cell located in the second island. The main cell causes a first current to flow between the first electrode and the second electrode so that the first current flows in a lateral direction along the surface of the substrate. The first current is detected by detecting a second current flowing though the sense cell.12-08-2011

Patent applications by Akira Yamada, Nukata-Gun JP

Akira Yamada, Nara JP

Patent application numberDescriptionPublished
20100206458ADHESIVE TAPE APPLYING APPARATUS AND TAPE SPLICING METHOD - An adhesive tape applying apparatus includes a stage on which a terminal end portion of a first tape member and a leading end portion of a second tape member are placed so as to be superimposed on each other, an ultrasonic tool in which a plurality of protruding portions are provided on its contact surface that is to be put into contact with the leading end portion or terminal end portion of the superposed tape members, an ultrasonic vibration generator for applying ultrasonic vibrations in a tape's thicknesswise direction to the ultrasonic tool, and a pressing device for making a stage-directed pressing force act on the ultrasonic tool. As a result, the terminal end portion of the in-use first tape member and the leading end portion of the second tape member rolled out from a new reel can be spliced together with a simple, low-cost construction while the possibility of occurrence of trouble in tape feed is eliminated.08-19-2010

Akira Yamada, Toyonaka-Shi JP

Patent application numberDescriptionPublished
20100170586Coupling apparatus for passage blocks - A passage block coupling apparatus is provided with a bolt insertion hole 07-08-2010

Akira Yamada, Kanagawa JP

Patent application numberDescriptionPublished
20100055404METHOD FOR PRODUCING FILM AND OPTICAL FILM - A method for producing a film comprises the steps of melting a thermoplastic resin in an extruder having a hopper cooling zone, a feed zone, a compression zone, and a metering zone; discharging a melted resin from the extruder and supplying the same to a die; extruding the melted resin through the die in a sheet-like form; and cooling and solidifying the sheet-like melted resin to produce a film; wherein a relationship between a temperature, T03-04-2010
20120028019METHOD OF PRODUCING POLYESTER SHEET, POLYESTER FILM AND METHOD OF PRODUCING POLYESTER FILM - The present invention provides a method for producing a polyester sheet, including melt-extruding a polyester having a half-value width of a crystallization temperature on cooling of 25° C. to 50° C.; and cooling the melt-extruded polyester such that a surface temperature of the polyester is lowered at a rate of 350° C./min to 590° C./min, wherein the polyester sheet has a thickness of 3 mm to 5 mm.02-02-2012
20120070615POLYESTER FILM, METHOD FOR PRODUCING THE SAME, BACK SHEET FOR SOLAR CELLS, AND SOLAR CELL MODULE - Provided is a method for producing a polyester film, including: subjecting a polyester raw material resin, which contains a titanium compound and has an intrinsic viscosity of from 0.71 to 1.00, to melt extrusion using a twin-screw extruder which includes a cylinder; two screws disposed inside the cylinder; and a kneading disk unit disposed in at least a portion of a region extending from a 10%-position to a 65%-position of screw length with respect to an upstream end of the screws in a resin extrusion direction as a starting point, at a maximum shear rate generated inside the twin-screw extruder of from 10 sec03-22-2012

Patent applications by Akira Yamada, Kanagawa JP

Akira Yamada, Yokkaichi-Shi JP

Patent application numberDescriptionPublished
20090314511Shielded Wire-Grounding construction - The lead-out side end of a drain wire (12-24-2009
20110168423Shielded wire-grounding construction - The lead-out side end of a drain wire led out from a shield wire and either a conductor exposed to one end of a ground wire, to the other end of which a ground terminal is connected, or a conductor exposed to one end of a ground wire, to the other end of which a connector receiving terminal is connected, are collectively connected together by crimping by using a U-shape cross-sectioned intermediate crimp terminal formed by a pair of opposed barrels, or connected by twisting them together, or connected through a joint bus bar.07-14-2011

Akira Yamada, Fujisawa-Shi JP

Patent application numberDescriptionPublished
20080295770Liquid substance supply device for vaporizing system, vaporizer, vaporization performance appraisal method - In a liquid substance supply device, a three port two valve directional control valve is provided in a transfer line, and a substance container and the transfer line are connected together by a four port three valve directional control valve in such a way that the four port three valve directional control valve and the substance container can be removed from the transfer line as a unit. Furthermore, in a vaporizer, an orifice member is provided to surround the end portion of an internal conduit in which flows a mixture substance consisting of a gas and a liquid substance mixed therewith, and gas for atomization is spouted into a vaporization chamber through a gap defined between the internal conduit and the orifice member. Yet further, the temperature of a vaporization surface in the vaporization chamber can be controlled independently in correspondence with the nature of the liquid substance.12-04-2008
20090045531Liquid substance supply device for vaporizing system, vaporizer, vaporization performance appraisal method - In a liquid substance supply device, a three port two valve directional control valve is provided in a transfer line, and a substance container and the transfer line are connected together by a four port three valve directional control valve in such a way that the four port three valve directional control valve and the substance container can be removed from the transfer line as a unit. Furthermore, in a vaporizer, an orifice member is provided to surround the end portion of an internal conduit in which flows a mixture substance consisting of a gas and a liquid substance mixed therewith, and gas for atomization is spouted into a vaporization chamber through a gap defined between the internal conduit and the orifice member. Yet further, the temperature of a vaporization surface in the vaporization chamber can be controlled independently in correspondence with the nature of the liquid substance.02-19-2009

Patent applications by Akira Yamada, Fujisawa-Shi JP

Akira Yamada, Minami-Ashigara-Shi JP

Patent application numberDescriptionPublished
20080237903METHOD OF MANUFACTURING THERMOPLASTIC RESIN FILM - A method of manufacturing a thermoplastic resin film, comprising the steps of: 10-02-2008

Akira Yamada, Yamanashi JP

Patent application numberDescriptionPublished
20120110841COMPONENT MOUNTING APPARATUS AND METHOD THEREOF - A challenge to be met by the present invention is to feed a carrier tape with superior positional accuracy by means of a simple, inexpensive configuration, thereby enhancing punching accuracy of a component and implementing highly reliable component mounting. A carrier tape feeder that feeds a carrier tape (05-10-2012