Patent application number | Description | Published |
20080305771 | MOBILE TERMINAL, AND PROGRAM AND METHOD FOR PREVENTING UNAUTHORIZED USE OF MOBILE TERMINAL - In a mobile terminal having a security function, both convenience and security protection are realized so as to prevent a user from feeling bothersome. A mobile phone has an operation control unit which sets the operation of various functions of the mobile terminal to be unusable at any timing. When a used state determination unit determines that the mobile phone is not in an abnormal state and not left, the operation control unit controls operation of the various functions to maintain usable states. | 12-11-2008 |
20090011321 | FUEL CELL - A fuel cell comprising a cathode catalyst layer, an anode catalyst layer including a conductive perfluoro-binder having a micellar structure formed by outwardly orienting hydrophobic (lipophilic) groups and inwardly orienting hydrophilic groups, and a proton conductive membrane provided between the cathode catalyst layer and the anode catalyst layer. | 01-08-2009 |
20090191441 | FUEL CELL - The fuel cell includes a membrane electrode assembly including a cathode catalyst layer, an anode catalyst layer and a proton conducting film provided between the cathode catalyst layer and the anode catalyst layer, a cathode conductive layer electrically connected to the cathode catalyst layer, an anode conductive layer electrically connected to the anode catalyst layer, a liquid fuel storage chamber which contains a liquid fuel, a gas-liquid separation film which selectively transmit a gasified component of the liquid fuel from the liquid fuel storage chamber to the anode catalyst layer, and a gasified fuel storage chamber formed at a section between the gas-liquid separation film and the anode conductive layer, and the distance L | 07-30-2009 |
20090263688 | FUEL CELL - A fuel cell ( | 10-22-2009 |
20090269653 | FUEL CELL - A fuel cell comprising a cathode catalyst layer ( | 10-29-2009 |
20090317685 | FUEL CELL - A fuel cell ( | 12-24-2009 |
20100104907 | ELECTRONIC DEVICE - In an electronic device, state detection elements are arranged at various locations of a fuel cell system supplies an electric power to a phone unit, the state detection elements detect states of the fuel cell system at the locations. A cell state detection unit detects an operating state of the fuel cell from an output signal of each of the state detection elements. A determination unit determines an operating mode to prompt action to be taken for the operating state of the fuel cell detected by the cell state detection unit. A content of the operating mode is displayed with an image of a character or a fictitious creature based on a determination by the determination unit. | 04-29-2010 |
20100133688 | SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE - In semiconductor integrated circuit devices for vehicle use or the like, in general, an aluminum pad on a semiconductor chip and an external device are coupled to each other by wire bonding or the like using a gold wire and the like for the convenience of mounting. Such a semiconductor integrated circuit device, however, causes a connection failure due to the interaction between aluminum and gold in use for a long time at a relatively high temperature (about 150 degrees C.). The invention of the present application provides a semiconductor integrated circuit device (semiconductor device or electron circuit device) which includes a semiconductor chip as a part of the device, an electrolytic gold plated surface film (gold-based metal plated film) provided over an aluminum-based bonding pad on a semiconductor chip via a barrier metal film, and a gold bonding wire (gold-based bonding wire) for interconnection between the plated surface film and an external lead provided over a wiring board or the like (wiring substrate). | 06-03-2010 |
20100181650 | SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE AND A METHOD FOR MANUFACTURING A SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE - With a general wafer level package process, in order to prevent corrosion of an aluminum type pad electrode in a scribe region in a plating process, the pad electrode is covered with a pad protective resin film at the same layer as an organic type protective film in a product region. However, this makes it impossible to perform the probe test on the pad electrode in the scribe region after rewiring formation. The present invention provides a method for manufacturing a semiconductor integrated circuit device of a wafer level package system. The organic type protective films in the chip regions and the scribe region are mutually combined to form an integral film pattern. In a pelletization step, the surface layer portion including the organic type protective film at the central part of the scribe region is first removed by laser grooving, to form a large-width groove. Then, a dicing processing of the central part in this groove results in separation into the chip regions. | 07-22-2010 |
20100233572 | FUEL CELL - The present invention relates to a fuel cell including: a membrane electrode assembly | 09-16-2010 |
20100255389 | FUEL CELL - A fuel cell includes a membrane electrode assembly includes a fuel electrode, an air electrode and an electrolyte membrane interposed between the fuel electrode and the air electrode, a fuel supply mechanism disposed on the air electrode side of the membrane electrode assembly to supply fuel to the fuel electrode, and a humidification layer disposed on the air electrode side of the membrane electrode assembly to be impregnated with water produced in the air electrode. The humidification layer include a first humidification section disposed opposite to a high-temperature area of an air electrode and a second humidification section disposed opposite to a low-temperature area of the air electrode when generating electricity. The second humidification section is so configured that water vapor is released into air therefrom more easily than from the first humidification section in the membrane electrode assembly. | 10-07-2010 |
20100261092 | FUEL CELL - A fuel cell includes a membrane electrode assembly includes an anode, a cathode and an electrolyte membrane interposed between the anode and the cathode, an anode conductive layer which is in contact with the anode, a cathode conductive layer which is in contact with the cathode, and a fuel supply mechanism which is disposed on the anode side of the membrane electrode assembly to supply fuel to the anode. The membrane electrode assembly includes a shape formed convexly toward the anode side in a separate condition. | 10-14-2010 |
20100285389 | FUEL CELL - The present invention relates to a fuel cell including a plurality of unit membrane electrode assemblies having an electrolyte membrane sandwiched by fuel electrodes and air electrodes. In recent years, attempts have been made to use fuel cells as power sources of portable electronic devices, and if the fuel cell can be made compact, it becomes a remarkably advantageous power supply system for portable electronic devices. Generally, in the fuel cell, the plural unit membrane electrode assemblies are electrically connected in series, but the serial connection of the unit membrane electrode assemblies different in output has a problem such as the deterioration due to polarity reversal occurring in the unit membrane electrode assembly with a low output. The present invention solves the above problem by the structure in which the fuel cell includes: the membrane electrode assembly group in which the plural unit membrane electrode assemblies are arranged two-dimensionally so as to be a predetermined interval apart from each other in a circumferential direction around a given center point, with the same electrodes being set on the same side; and a fuel supply mechanism disposed on the fuel electrode side of the membrane electrode assembly group and supplying a fuel to the fuel electrodes. | 11-11-2010 |
20110117465 | FUEL CELL - Disclosed is a fuel cell ( | 05-19-2011 |
20120032329 | SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE - In semiconductor integrated circuit devices for vehicle use, an aluminum pad on a semiconductor chip and an external device are coupled to each other by wire bonding using a gold wire for the convenience of mounting. Such a semiconductor integrated circuit device, however, causes a connection failure due to the interaction between aluminum and gold in use for a long time at a relatively high temperature (about 150 degrees C.). A semiconductor integrated circuit device can include a semiconductor chip as a part of the device, an electrolytic gold plated surface film (gold-based metal plated film) provided over an aluminum-based bonding pad on a semiconductor chip via a barrier metal film, and a gold bonding wire (gold-based bonding wire) for interconnection between the plated surface film and an external lead provided over a wiring board (wiring substrate). | 02-09-2012 |
20130313708 | SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE - In semiconductor integrated circuit devices for vehicle use, an aluminum pad on a semiconductor chip and an external device are coupled to each other by wire bonding using a gold wire for the convenience of mounting. Such a semiconductor integrated circuit device, however, causes a connection failure due to the interaction between aluminum and gold in use for a long time at a relatively high temperature (about 150 degrees C.). A semiconductor integrated circuit device can include a semiconductor chip as a part of the device, an electrolytic gold plated surface film (gold-based metal plated film) provided over an aluminum-based bonding pad on a semiconductor chip via a barrier metal film, and a gold bonding wire (gold-based bonding wire) for interconnection between the plated surface film and an external lead provided over a wiring board (wiring substrate). | 11-28-2013 |