Patent application number | Description | Published |
20100276184 | MULTILAYER PRINTED BOARD AND METHOD FOR MANUFACTURING THE SAME - Provided is a multilayer printed board | 11-04-2010 |
20100323217 | MATERIAL FOR AN ELECTRICAL/ELECTRONIC PART AND ELECTRICAL/ELECTRONIC PART - A material for an electrical/electronic part, which has a resin coating directly formed on at least a part of a metal substrate or at least a part of a metal layer provided on the metal substrate, with the resin coating being formed with a resin composition containing at least one selected from the group consisting of a polyamideimide resin and a polyimide resin, each having a structure represented by formula (I) or (II) in the molecular structure: | 12-23-2010 |
20110059326 | COMPOSITE MATERIAL FOR ELECTRICAL/ELECTRONIC COMPONENT, ELECTRICAL/ELECTRONIC COMPONENT, AND METHOD FOR PRODUCING COMPOSITE MATERIAL FOR ELECTRICAL/ELECTRONIC COMPONENT - Disclosed is a composite material for electrical/electronic component, having a resin coating film formed on at least a part of a metal base, and the residual solvent quantity in the resin coating film being controlled to be 1-30% by mass. The resin coating film is preferably composed of a polyimide or a polyamide-imide. | 03-10-2011 |
20110091738 | COMPOSITE MATERIAL FOR ELECTRIC/ELECTRONIC PART, PRODUCTION METHOD THEREOF, AND ELECTRIC/ELECTRONIC PART - A composite material for an electric/electronic part, having a metal base, a resin film on at least a part of the metal base, and a layer of Sn or a Sn alloy on at least a part of the metal base at a site where the resin film is not provided, the layer of Sn or a Sn alloy including a solidified structure, and the resin film having a residual solvent quantity adjusted to 5% to 25% by mass. | 04-21-2011 |
20110091739 | COMPOSITE MATERIAL FOR ELECTRICAL/ELECTRONIC PART AND ELECTRICAL/ELECTRONIC PART USING THE SAME - A composite material for an electrical/electronic part, which is used as a material for use in an electrical/electronic part formed by punching process, containing a metal base material of, for example, a copper-type metal material and a substantially one layer of an insulating film provided on at least a part of the metal base material, in which a metal layer formed of Ni or a Ni—Zn alloy is interposed between said metal base material and said insulating film, such that the peel width of said insulating film at the end of the material obtained after said punching process, is less than 10 μm. | 04-21-2011 |
20110091740 | COMPOSITE MATERIAL FOR ELECTRICAL/ELECTRONIC PART AND ELECTRICAL/ELECTRONIC PART USING THE SAME - A composite material for an electrical/electronic part, which is used as a material for use in an electrical/electronic part, containing:
| 04-21-2011 |
20130099270 | LEAD FRAME FOR OPTICAL SEMICONDUCTOR DEVICE, METHOD OF PRODUCING THE SAME, AND OPTICAL SEMICONDUCTOR DEVICE - A lead frame for an optical semiconductor device, having a reflection layer at least on one side or each side of the outermost surface of a substrate, partially or entirely, in which the reflection layer has, on the outermost surface at least in a region where light emitted by an optical semiconductor element is reflected, a microstructure with at least the surface thereof having been mechanically deformed, which is converted from a plating microstructure formed of a metal or an alloy thereof; a method of producing the same, and an optical semiconductor device having the same. | 04-25-2013 |
20140273667 | Terminal, Method of Manufacturing Terminal, and Termination Connection Structure of Electric Wire - A terminal includes a tubular crimp portion that crimp connects with an electric wire. The tubular crimp portion is composed of a metal member. The tubular crimp portion includes a non-weld portion and a weld portion, the weld portion being formed by welding. A metal base material constituting the metal member of the non-weld portion includes a normal portion and an annealed portion. | 09-18-2014 |
20140374155 | METHOD OF MANUFACTURING ELECTRICAL WIRE CONNECTING STRUCTURE AND ELECTRICAL WIRE CONNECTING STRUCTURE - In an electrical wire connecting structure and a method of manufacturing the electrical wire connecting structure, a terminal having a tube-shaped portion of 2.0 mm in inner diameter is prepared for an electrical wire having a conductor cross-sectional area of 0.72 to 1.37 mm | 12-25-2014 |