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Akio Yamamoto

Akio Yamamoto, Kobe-Shi JP

Patent application numberDescriptionPublished
20080293510Golf club11-27-2008
20080293516Golf club head and golf club - A golf club head 11-27-2008
20090156323Golf club - A hosel portion (06-18-2009
20090275423GOLF CLUB - A hosel portion (11-05-2009
20100120556GOLF CLUB HEAD05-13-2010
20100273574GOLF CLUB HEAD10-28-2010
20110098127GOLF CLUB - A golf club 04-28-2011
20110190071Golf club - A preferable golf club 08-04-2011

Patent applications by Akio Yamamoto, Kobe-Shi JP

Akio Yamamoto, Kashima-Shi JP

Patent application numberDescriptionPublished
20080283160Bent pipe and a method for its manufacture - A bent pipe corresponding to at least API X100 grade and having a base metal with high strength and toughness and a weld metal with high toughness is provided. A steel plate prepared by cooling after hot rolling at a cooling rate at the central portion in the plate thickness direction of at most 5° C. per second at 700-500° C. is formed into a bend mother pipe, which is then heated to 900-1100° C. and subjected to bending, then it is cooled to a temperature of at most 300° C. at a cooling rate in the central portion of the thickness direction of at least 5° C. per second at 700-500° C., after which it is tempered at 300-500° C.11-20-2008
20090199612Hot bend pipe and a process for its manufacture - A high-strength hot bend pipe which has a balance between an excellent strength of at least X70 grade and toughness and which has excellent tensile properties and a weld metal with excellent low temperature toughness is manufactured. A UOE steel pipe having a base metal with a composition of C: 0.03-0.12%, Si: 0.05-0.50%, Mn: 1.4-2.2%, S: at most 0.01%, Al: at most 0.06%, N: at most 0.008%, and a remainder of Fe and impurities, with the carbon equivalent (Ceq) being at most 0.36% and the weld cracking parameter (Pcm) being at most 0.22%, and having a weld metal with a weld cracking parameter (Pcm) of at most 0.28%, a B content of at most 5 ppm, and an O content of at most 280 ppm is heated to a temperature range of 900-1100° C. and subjected to bending, and then is immediately cooled to a temperature range of 300° C. or lower at a cooling rate of at least 3° C./sec, and then is tempered in a temperature range of 300-500° C.08-13-2009
20110070457High-Strength UOE Steel Pipe Excellent in Deformability and Low-Temperature Toughness of Heat Affected Zone - A high-strength UOE steel pipe which has excellent deformability and excellent low-temperature toughness in its heat affected zone and which is suitable for use in a pipeline installed on permafrost in extremely cold regions or in earthquake-prone regions, for example, is provided. The UOE steel pipe has a steel composition consisting essentially of C: 0.03-0.07%, Si: 0.05-0.50%, Mn: 1.6-2.2%, P: at most 0.020%, S: at most 0.003%, Cu: 0.20-0.60%, Cr: at most 0.10%, Ni: 0.20-0.80%, Nb: 0.005-0.030%, Ti: 0.005-0.030%, N: at most 0.0070%, Al: 0.005-0.060%, and a remainder of Fe and impurities, the hardenability index Pcm is at most 0.22%, Cu+Cr+Ni is 0.4-1.5%, Nb+Mo+V is at most 0.05%. The pipe has a yield strength in the longitudinal direction of at least 480 MPa with a yield-tensile ratio of at most 85% and a Charpy absorbed energy of the heat affected zone at −40° C. of at least 40 J.03-24-2011

Patent applications by Akio Yamamoto, Kashima-Shi JP

Akio Yamamoto, Hiratsuka JP

Patent application numberDescriptionPublished
20080309413GAIN SWITCHING LOW-NOISE AMPLIFIER CIRCUIT - In a gain switching LNA including a first transistor, a first transistor group (for example, second to ninth transistors) and a second transistor group (for example, tenth to seventeenth transistors), a first resistor connected between an emitter of the tenth transistor and a collector of the first transistor and a second resistor connected to emitters of eleventh to seventeenth transistors and the collector of the first transistor and having a resistance one seventh as high as that of the first resistor are provided. In a high-gain mode, since isolation of the tenth to seventeenth transistors which are turned OFF and the first and second to ninth transistors is secured by the first resistor and the second resistor, there is no deterioration in the noise factor.12-18-2008
20100113089MULTIMODE WIRELESS COMMUNICATION APPARATUS AND HIGH FREQUENCY INTEGRATED CIRCUIT THEREFORE - A multimode wireless communication apparatus including a radio frequency unit having controllable communication mode and a control unit for periodically making the radio frequency unit operate in a mobile telephone mode and, after predetermined time, switching the mode to a wireless LAN mode, wherein if occurrence of an incoming call event is detected when the radio frequency unit is in standby reception in the mobile telephone mode, the control unit suppresses the switching to the wireless LAN mode and determines whether the communication in the mobile telephone mode should be continued or not.05-06-2010
20110064023WIRELESS COMMUNICATION SYSTEM - A wireless communication system comprises a host and a device. The host is provided with a communication unit capable of data communication using a first communication system and a second communication system which is higher in maximum transmission rate than the first communication system, and without regard to any communication system to be used by the device, the host uses the first communication system to start processing for establishment of a communication link with the device.03-17-2011
20110134810MODULE FOR USE IN MOBILE COMMUNICATION TERMINAL AND MOBILE COMMUNICATION TERMINAL APPLYING THE SAME THEREIN - For providing a module for use of a mobile communication terminal, being small in sizes and high in reliability, and enabling with plural numbers of bands, and also a mobile communication terminal with using the same therein, canceling is conducted on transmission signal and/or noises of reception band on reception side with using a feed forward technology, for maintaining a degree of suppression of the transmission signal and/or the noises of reception band on the reception side. In this case, for achieving the cancellation of wide band signals from the transmission signal to the reception band, a delay adjusting function is used, in addition to gain and phase adjusting functions. Also, for conducting stable canceling of jamming signals, controls are conducted on the gain, the phase and the delay of a loop with using a reception SN and/or a CQI signal, etc.06-09-2011

Patent applications by Akio Yamamoto, Hiratsuka JP

Akio Yamamoto, Yokohama JP

Patent application numberDescriptionPublished
20090023411RECEIVING CIRCUIT - The present invention is a receiving circuit used for a cellular phone that is reduced in size and can realize low power consumption. In a signal reception circuit that is used in a cellular phone that perform transmission and reception of a plurality of band wireless signals and includes a low-pass filter for removing blockers unnecessary for signal reception, the low-pass filter 01-22-2009
20100311381RECEIVING CIRCUIT - A receiving circuit is provided for performing reception of a plurality of band signals and suppression of blockers that remain in the plurality of band signals being received and converted in frequency. The receiving circuit includes a first low-pass filter that has a first pole position to suppress blockers remaining in a received signal by the first pole position, and a second low-pass filter that has a second pole position to suppress blockers remaining in a signal that has passed through said first low-pass filter by the second pole position. A switch that switches on/off an input-output path including the filters so that the received signal passes through said first filter without passing through the second filter when receiving a first band signal, while the received signal passes through both filters when receiving a second band signal different from the first band signal.12-09-2010

Patent applications by Akio Yamamoto, Yokohama JP

Akio Yamamoto, Toyama JP

Patent application numberDescriptionPublished
20090244349SOLID STATE IMAGE PICKUP DEVICE - A solid state image pickup device includes a plurality of light receiving sections formed in a regular pattern, transfer channels, a plurality of first transfer electrodes and a plurality of second transfer electrodes formed on the transfer channels, a plurality of first wires each applying a potential to the corresponding first transfer electrodes and a plurality of second wires each applying a potential to the corresponding second transfer electrodes. The first and second wires extend in the directions intersecting each other.10-01-2009

Akio Yamamoto, Suwa JP

Patent application numberDescriptionPublished
20080250612CLASP, BAND WITH A CLASP, PORTABLE DEVICE, TIMEPIECE, AND ACCESSORY - A clasp having a first member and a second member that are respectively disposed to two coupled members, the clasp being closed by the first member and the second member mutually engaging when the coupled members slide in relatively opposite directions. The first member has a first attachment member that has a side wall disposed on both sides of a direction intersecting the direction in which one of the coupled members slides, and a spine that connects the side walls, and a button unit that has a push button which is urged to the outside from the inside of the coupled members in the direction intersecting the sliding direction of the coupled members, and which is disposed with the one coupled member held between the first attachment member and the button unit. The second member has a second attachment member that has a side wall attached at a prescribed position to the other coupled member on both sides of a direction intersecting the direction in which the other coupled member slides. The first attachment member and the button unit are attached at a prescribed position to the one coupled member. The button unit has a protruding catch that moves in conjunction with the push button and engages the side walls of the second attachment member when the coupled members are slid together. The side walls of the second attachment member have a recessed strike to which the protruding catch is inserted from the inside of the side walls.10-16-2008

Akio Yamamoto, Hamamatsu-Shi JP

Patent application numberDescriptionPublished
20110247475STICK OF STRING INSTRUMENT BOW, STRING INSTRUMENT BOW AND METHODS OF MANUFACTURING STICK OF STRING INSTRUMENT BOW - A stick of a string instrument bow includes a base material having an arched-rod shaped carbon fiber resin layer made of carbon fiber resin and a glass fiber resin layer which covers the outer surface of the carbon fiber resin layer and is made of glass fiber resin, and the glass fiber resin layer has a non-adhesion portion formed of an air layer present within the glass fiber resin layer and an adhesion portion which does not include the air layer.10-13-2011