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Akinori Shibuya, Shizuoka JP

Akinori Shibuya, Shizuoka JP

Patent application numberDescriptionPublished
20080206669POSITIVE WORKING RESIST COMPOSITION AND PATTERN FORMING METHOD - A positive working resist composition comprises a specific resin. The specific resin comprises: a repeating unit having a first specific group; and a repeating unit having a second specific group, the first specific group being different from the second specific group; and a specific structure in an end terminal of the resin. The specific resin decomposes by action of an acid to increase its solubility in an alkaline developer.08-28-2008
20090246695ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, PATTERN FORMING METHOD USING THE SAME, POLYMERIZABLE COMPOUND AND POLYMER COMPOUND OBTAINED BY POLYMERIZING THE POLYMERIZABLE COMPOUND - An actinic ray-sensitive or radiation-sensitive resin composition and a pattern forming method using the composition are provided, the composition including (A) a resin containing a repeating unit having a group represented by formula (1) as defined in the specification, the resin being capable of increasing a solubility of the resin in an alkali developer by an action of an acid, and (B) a compound capable of generating an acid upon irradiation with an actinic ray or radiation; and a polymerizable compound represented by formula (M-1) as defined in the specification and a polymer compound obtained by polymerizing the polymerizable compound are provided.10-01-2009
20100104974POSITIVE RESIST COMPOSITION AND PATTERN FORMING METHOD - A positive resist composition comprises: (A) a compound that generates an acid upon irradiation with an actinic ray or radiation; and (B) a resin that has an acid-decomposable repeating unit represented by formula (I′), has a dispersity of 1.5 or less and increases its solubility in an alkali developer by action of an acid,04-29-2010
20100203451POSITIVE RESIST COMPOSITION AND PATTERN FORMING METHOD USING THE SAME - Provided is a positive resist composition using a resin having, in the polymer main chain, a specific acid decomposable structure and further having, in the side chain thereof, several specific acid decomposable groups, satisfactory in an exposure latitude, a focus latitude, and pattern collapse prevention at a high level, and having reduced development defects; and a pattern forming method.08-12-2010
20110014571POSITIVE RESIST COMPOSITION AND PATTERN FORMING METHOD USING THE SAME - A positive resist composition and a pattern forming method using the resist composition are provided, the resist composition including: (A) a resin containing a repeating structural unit represented by formula (I) as defined in the specification and being capable of decomposing by an action of an acid to increase the solubility in an alkali developer; (B) an acid generator; and (C) a mixed solvent containing at least one solvent selected from the group consisting of the following Group (a) and at least one solvent selected from the group consisting of the following Groups (b) to (d): 01-20-2011
20110136062POSITIVE PHOTOSENSITIVE COMPOSITION AND PATTERN FORMING METHOD USING THE SAME - A positive photosensitive composition, includes: (A) a resin having a repeating unit represented by formula (1) as defined in the specification and a repeating unit represented by formula (2) as defined in the specification and being capable of increasing a solubility of the resin (A) in an alkali developer by an action of an acid; (B) a compound capable of generating an acid upon irradiation with actinic rays or radiation; and a solvent, and a pattern forming method uses the positive photosensitive composition.06-09-2011
20110223536ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, AND RESIST FILM AND PATTERN FORMING METHOD USING THE SAME - An actinic ray-sensitive or radiation-sensitive resin composition, and a resist film and a pattern forming method each using the composition are provided, the composition including: (A) a resin containing a repeating unit having a specific lactone structure and a repeating unit having a specific sulfonamide structure and being capable of increasing the solubility of the resin (A) in an alkali developer by the action of an acid; and (B) a compound capable of generating an acid upon irradiation with an actinic ray or radiation.09-15-2011
20110269072ACTINIC-RAY- OR RADIATION-SENSITIVE RESIN COMPOSITION AND METHOD OF FORMING PATTERN USING THE SAME - Provided is an actinic-ray- or radiation-sensitive resin composition excelling in the LWR, pattern collapse performance and DOF, and a method of forming a pattern using the same. The composition according to the present invention contains (A) a resin containing a repeating unit with any of partial structures of general formula (I) below, (B) a compound (PA) as defined in the specification, and (C) a compound being configured to generate an acid when exposed to actinic rays or radiation, wherein the resin is contained in an amount of 50 mass % or more based on total solids of the composition.11-03-2011

Patent applications by Akinori Shibuya, Shizuoka JP