| Patent application number | Description | Published |
|---|
| 20090274975 | POSITIVE PHOTOSENSITIVE COMPOSITION AND METHOD OF FORMING PATTERN THEREWITH - A positive photosensitive composition includes (A) a resin having a repeating unit with a lactone structure of 5.0 or below an Onishi parameter and having any of repeating units of Formula (I) that when acted on by an acid, generates a carboxylic acid, and (B) a compound that when exposed to actinic rays or radiation, generates an acid, | 11-05-2009 |
| 20090325102 | PHOTOSENSITIVE COMPOSITION AND PATTERN FORMING METHOD USING SAME - A photosensitive composition comprises (A) a resin whose solubility in an alkali developer is increased by the action of an acid, and (B) a compound that generates an acid when exposed to actinic rays or radiation, wherein the resin (A) contains two or more repeating units respectively having acid-decomposable groups that are different from each other in the acid decomposition ratio at an image formation sensitivity. | 12-31-2009 |
| 20090325103 | ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION AND PATTERN FORMING METHOD USING SAME - An actinic ray-sensitive or radiation-sensitive resin composition includes (A) a resin having at least two of repeating units represented by general formula (1) below and exhibiting increased solubility in an alkali developer when acted on by an acid, and (B) a compound that generates an acid when exposed to actinic rays or radiation. | 12-31-2009 |
| 20110008731 | ACTINIC-RAY-OR RADIATION-SENSITIVE RESIN COMPOSITION, COMPOUND AND METHOD OF FORMING PATTERN USING THE COMPOSITION - According to one embodiment, an actinic-ray- or radiation-sensitive resin composition includes a compound (A) that when exposed to actinic rays or radiation, generates any of the acids of general formula (II) below and a resin (B) whose rate of dissolution into an alkali developer is increased by the action of an acid. | 01-13-2011 |
| 20110027716 | ACTINIC-RAY- OR RADIATION-SENSITIVE RESIN COMPOSITION, COMPOUND AND METHOD OF FORMING PATTERN USING THE COMPOSITION - According to one embodiment, an actinic-ray- or radiation-sensitive resin composition includes any of the compounds (A) of general formula (I) below that when exposed to actinic rays or radiation, generates an acid and a resin (B) whose rate of dissolution into an alkali developer is increased by the action of an acid. (The characters used in general formula (I) have the meanings mentioned in the description.) | 02-03-2011 |
| Patent application number | Description | Published |
|---|
| 20080206669 | POSITIVE WORKING RESIST COMPOSITION AND PATTERN FORMING METHOD - A positive working resist composition comprises a specific resin. The specific resin comprises: a repeating unit having a first specific group; and a repeating unit having a second specific group, the first specific group being different from the second specific group; and a specific structure in an end terminal of the resin. The specific resin decomposes by action of an acid to increase its solubility in an alkaline developer. | 08-28-2008 |
| 20090246695 | ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, PATTERN FORMING METHOD USING THE SAME, POLYMERIZABLE COMPOUND AND POLYMER COMPOUND OBTAINED BY POLYMERIZING THE POLYMERIZABLE COMPOUND - An actinic ray-sensitive or radiation-sensitive resin composition and a pattern forming method using the composition are provided, the composition including (A) a resin containing a repeating unit having a group represented by formula (1) as defined in the specification, the resin being capable of increasing a solubility of the resin in an alkali developer by an action of an acid, and (B) a compound capable of generating an acid upon irradiation with an actinic ray or radiation; and a polymerizable compound represented by formula (M-1) as defined in the specification and a polymer compound obtained by polymerizing the polymerizable compound are provided. | 10-01-2009 |
| 20100104974 | POSITIVE RESIST COMPOSITION AND PATTERN FORMING METHOD - A positive resist composition comprises: (A) a compound that generates an acid upon irradiation with an actinic ray or radiation; and (B) a resin that has an acid-decomposable repeating unit represented by formula (I′), has a dispersity of 1.5 or less and increases its solubility in an alkali developer by action of an acid, | 04-29-2010 |
| 20100203451 | POSITIVE RESIST COMPOSITION AND PATTERN FORMING METHOD USING THE SAME - Provided is a positive resist composition using a resin having, in the polymer main chain, a specific acid decomposable structure and further having, in the side chain thereof, several specific acid decomposable groups, satisfactory in an exposure latitude, a focus latitude, and pattern collapse prevention at a high level, and having reduced development defects; and a pattern forming method. | 08-12-2010 |
| 20110014571 | POSITIVE RESIST COMPOSITION AND PATTERN FORMING METHOD USING THE SAME - A positive resist composition and a pattern forming method using the resist composition are provided, the resist composition including: (A) a resin containing a repeating structural unit represented by formula (I) as defined in the specification and being capable of decomposing by an action of an acid to increase the solubility in an alkali developer; (B) an acid generator; and (C) a mixed solvent containing at least one solvent selected from the group consisting of the following Group (a) and at least one solvent selected from the group consisting of the following Groups (b) to (d):
| 01-20-2011 |
| 20110136062 | POSITIVE PHOTOSENSITIVE COMPOSITION AND PATTERN FORMING METHOD USING THE SAME - A positive photosensitive composition, includes: (A) a resin having a repeating unit represented by formula (1) as defined in the specification and a repeating unit represented by formula (2) as defined in the specification and being capable of increasing a solubility of the resin (A) in an alkali developer by an action of an acid; (B) a compound capable of generating an acid upon irradiation with actinic rays or radiation; and a solvent, and a pattern forming method uses the positive photosensitive composition. | 06-09-2011 |
