Patent application number | Description | Published |
20130241040 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - According to one embodiment, a semiconductor device includes, a chip including a first chip electrode on a first surface on one side, and a second chip electrode on a second surface on the other side, an electrically conductive frame provided on a side periphery of the chip, a rewiring configured to electrically connect the second chip electrode and the electrically conductive frame on the other side of the chip, and an insulation side portion provided between the electrically conductive frame and the side periphery of the chip. | 09-19-2013 |
20140291110 | BANKNOTE PROCESSING DEVICE - The banknote processing device includes plural dispensing ports that dispense banknotes; a banknote classification section that classifies banknotes; and a controller that selects a conveyance destination of banknotes classified by the banknote classification section from the plural dispensing ports, and effects control to convey the banknotes to a selected dispensing port. | 10-02-2014 |
20140332340 | BANKNOTE PROCESSING DEVICE - A banknote processing device is provided that is capable of securing a reject route that does not overlap with a route for conveying banknotes from a banknote storage section to a banknote identification section. The banknote processing device includes: a dispensing port that dispenses banknotes; a banknote identification section that identifies whether or not banknotes are normal; and a storage-only storage section that stores banknotes that the banknote identification section has identified as abnormal. Out of a first route on the dispensing port side between the banknote identification section and the storage-only storage section and a second route on the opposite side to the first route, one, or two or more, banknote storage sections capable of storing and feeding out banknotes are provided only on the second route side. | 11-13-2014 |
Patent application number | Description | Published |
20140153238 | Light Emitting Device and Luminaire - According to one embodiment, there is provided a light-emitting device including a light-emitting section, a thermal radiation member, and a heat conduction layer. The light-emitting section includes a mounting substrate section and a light-emitting element section. The mounting substrate section includes a substrate, a first metal layer, and a second metal layer. The substrate includes a first principal plane including a mounting region and a second principal plane. The first metal layer includes mounting patterns provided in the mounting region. The light-emitting element section includes semiconductor light-emitting elements and a wavelength conversion layer. The semiconductor light-emitting elements are connected to the mounting patterns. The luminous exitance of the light-emitting element section is equal to or higher than 101 m/mm | 06-05-2014 |
20150060894 | Light Emitting Device - According to an embodiment, a light emitting device including a substrate, a plurality of semiconductor light emitting elements and a wavelength conversion layer is provided. The semiconductor light emitting elements are provided on the substrate. The wavelength conversion layer covers the semiconductor light emitting elements and converts a wavelength of light emitted from the semiconductor light emitting elements. A first distance between an upper surface of the wavelength conversion layer in a first region between two adjacent semiconductor light emitting elements in the semiconductor light emitting elements and the substrate is shorter than a second distance between the upper surface of the wavelength conversion layer and the substrate in a second region on the two adjacent semiconductor light emitting elements. | 03-05-2015 |
20150060930 | Light Emitting Device - According to an embodiment, a light emitting device includes a heat radiation plate, a semiconductor light emitting element, a mounting substrate section including a ceramic substrate, and first and second metal layers, and a bonding layer. The ceramic substrate is provided between the heat radiation plate and the semiconductor light emitting element. The mounting substrate section contacts the ceramic substrate between the heat radiation plate and the ceramic substrate, and includes a first surface on a side of the heat radiation plate and a side surface intersecting a plane perpendicular to a direction from the heat radiation plate to the semiconductor light emitting element. The bonding layer is provided between the heat radiation plate and the second metal layer, and bonds the heat radiation plate and the second metal layer so as to cover the first surface and to contact a part of the side surface. | 03-05-2015 |