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Akihiro Nomoto, Kanagawa JP

Akihiro Nomoto, Kanagawa JP

Patent application numberDescriptionPublished
20080251844METHOD FOR FORMING PATTERN, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE - A method for forming a pattern includes the step of forming an electrically conductive film by applying a liquid composition onto a first plate. The liquid composition includes an organic solvent and conductive particles surface-modified with a fatty acid or an aliphatic amine. Then, a second pattern, which is a reverse pattern of a first pattern, is formed on the first plate by pressing a second plate having a concave-convex pattern on a surface thereof on a surface of the first plate having the electrically conductive film on the surface thereof. Then, the first pattern of the electrically conductive film is transferred onto convex top faces of the second plate. Then, the second pattern is transferred onto a surface of a transfer substrate by pressing the surface of the first plate having the second pattern thereon on the surface of the transfer substrate.10-16-2008
20090283000INTAGLIO PRINTING PLATE, PRODUCTION METHOD FOR INTAGLIO PRINTING PLATE, PRODUCTION METHOD FOR ELECTRONIC SUBSTRATE, AND PRODUCTION METHOD FOR DISPLAY DEVICE - An intaglio printing plate includes a substrate and a photosensitive resin film provided on the substrate. The photosensitive resin film includes a plurality of concave patterns whose depths increase as aperture widths increase.11-19-2009
20100029040METHOD FOR FORMING ORGANIC SEMICONDUCTOR THIN FILM AND METHOD OF MANUFACTURING THIN-FILM SEMICONDUCTOR DEVICE - A method for forming an organic semiconductor thin film includes the steps of forming a mixed ink layer on a principal plane of a printing plate, the mixed ink layer including a mixture of an organic semiconductor material incapable of transcription and an organic material capable of transcription from the printing plate to a substrate in ink form dissolved in a solvent, and forming an organic semiconductor thin film by transcribing the mixed ink layer onto the substrate by transcribing the mixed ink layer on the printing plate to the substrate.02-04-2010
20100044905METHOD OF FORMING PATTERN AND METHOD OF PRODUCING ELECTRONIC ELEMENT - A method of forming a pattern and a method of producing an electronic element with which a fine and precise pattern is stably formed are provided. Each of the method of forming a pattern and the method of producing an electronic element includes a step of forming an electrically conductive film D by applying a liquid composition onto a first plate 02-25-2010
20100221413METHOD OF FORMING PATTERN AND METHOD OF PRODUCING ELECTRONIC ELEMENT - A method of forming a pattern and a method of producing an electronic element are characterized by including a first step of forming an electrically conductive film (D) by applying a liquid composition onto a first plate (09-02-2010
20110024179METHOD FOR PRODUCING CIRCUIT BOARD AND CIRCUIT BOARD - A method for producing a circuit board, the method includes the steps of: forming a lower wiring pattern on a substrate; forming an insulating film on the substrate to cover the lower wiring pattern; forming an opening in the insulating film to expose the lower wiring pattern; forming an upper wiring pattern on the insulating film; and forming an interconnect material pattern on a sidewall of the opening in the insulating film for connecting the lower wiring pattern and the upper wiring pattern.02-03-2011
20110081746METHOD FOR PRODUCING SEMICONDUCTOR DEVICE - A method for producing a semiconductor device includes the steps of forming an organic semiconductor layer on a substrate; forming a protective pattern on the organic semiconductor layer; and patterning the organic semiconductor layer by dissolving, in an organic solvent, or subliming the organic semiconductor layer using the protective pattern as a mask.04-07-2011
20110101358SEMICONDUCTOR DEVICE AND DISPLAY APPARATUS USING THE SEMICONDUCTOR DEVICE - Disclosed herein is a semiconductor device which employs a thin-film transistor. In addition, the semiconductor device has a gate electrode, a gate insulation film, an organic semiconductor layer, a structure, a source electrode, a drain electrode, and an electrode material layer.05-05-2011

Patent applications by Akihiro Nomoto, Kanagawa JP