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Akihiro Koga

Akihiro Koga, Kyoto-Shi JP

Patent application numberDescriptionPublished
20090133904MODULE AND MANUFACTURING METHOD THEREOF - A method of manufacturing a module is provided that can alleviate a decrease in cutting yield. This method includes: a step of mounting, on a wiring board having a plurality of mounting regions enclosed by cutting lines on its upper surface, an electronic component in each of the mounting regions; a step of cutting the wiring board along the cutting lines; a step of forming a sealing resin layer so as to seal the electronic component to cover at least part of upper and side surfaces of the cut wiring board; and a step of cutting the sealing resin layer along cut portions (cutting lines) of the cut wiring board.05-28-2009

Akihiro Koga, Tokyo JP

Patent application numberDescriptionPublished
20080204661DEFORMABLE MIRROR DEVICE AND APPARATUS FOR OBSERVING RETINA OF EYE - It is made possible to improve the variations in the “generated force (load)—deflection characteristics”. A deformable mirror device includes: a substrate; a plurality of electrodes provided on the substrate; a spacer disposed on the substrate; a support member disposed above the spacer and having an opening passing through from a first face of the support member facing to the substrate to a second face of the support member facing opposite from the first face; a first insulation film provided around the opening on the first face of the support member; and a deformable electrode film disposed so as to be opposed to the electrodes at a spacing, formed so as to cover the opening, and supported by the support member with sandwiching the first insulation film. The electrode film includes a reflection portion on a face opposite to the electrodes.08-28-2008
20080236171MAGNETIC REFRIGERATING DEVICE AND MAGNETIC REFRIGERATING METHOD - A magnetic refrigerating device includes: at least one set of double-structured Halbach type magnet including a ring-shaped inner Halbach type magnet and a ring-shaped outer Halbach type magnet which are coaxially arranged one another so that a magnetic field generated by the inner Halbach type magnet is superimposed with a magnetic field generated by the outer Halbach type magnet; a magnetic refrigerant or a magnetic refrigeration working chamber including the magnetic refrigerant therein disposed in a bore space of the inner Halbach type magnet; and a rotating mechanism to rotate the outer Halbach type magnet while the inner Halbach type magnet is stationed.10-02-2008
20080239528DEFORMABLE MIRROR APPARATUS - It is made possible to provide a deformable mirror apparatus which is deformable to a complicated shape (high-order shape). A deformable mirror apparatus includes: a substrate; a plurality of electrodes provided on the substrate; a spacer fixed above the substrate, having a first opening passing through from a first face of the spacer facing to the substrate to a second face of the spacer facing opposite from the first face, surrounding the electrodes, and having a step on the second face; a drive part including a membrane part disposed so as to cover the step of the spacer and so as to be opposed to the electrodes, a casing part having an opening at a bottom face of which the membrane part is exposed and supporting the membrane part, and a reflection film provided on the membrane part; and a voltage generator configured to generate predetermined voltage patterns on the electrodes, respectively.10-02-2008
20080239931RECORDING AND REPRODUCING APPARATUS PROVIDED WITH PROBE MEMORY - A recording and reproducing apparatus supports a recording medium swingably in at least two axis directions by a support section formed in a shape having elasticity. When an access can be made to a memory, the recording medium is constantly and reciprocatingly moved in a direction along data row. Thus, a positional relationship with a probe head is always grasped. When an access is made, a moving time associated with position identification is reduced, and precise and fast movement is achieved.10-02-2008
20080253269POSITIONING SYSTEM MOUNTED ON PROBE MEMORY DEVICE AND POSITIONING METHOD THEREOF - A probe memory device carries out positioning with the use of a servo pattern provided in a servo area on a recording medium, and the recording medium and a probe head section are reciprocatingly moved (scan-moved) by vibration at a specific frequency in a one-axis direction. At this time, based on information from the servo area, relative position information between the recording medium and the probe head section is acquired, the relative position information is processed at a control section, and then, feedback control is carried out for carrying out position correction relative to an actuator.10-16-2008
20090040462DEFORMABLE MIRROR DEVICE AND APPARATUS FOR OBSERVING RETINA OF EYE USING THE SAME - A deformable mirror device includes a substrate; a plurality of electrodes provided on the substrate; a spacer disposed on the substrate; a support member disposed above the spacer and having an opening passing through from a first face of the support member facing to the substrate to a second face of the support member opposite from the first face; a deformable electrode film formed below the first face of the support member so as to be opposed to the electrodes with a distance and so as to cover the opening; an insulation film provided between the deformable electrode film and the support member; and a reflection film provided on a face of the deformable electrode film opposite from the electrodes so as to overlap the opening. The electrodes are electrically insulated each other by a plurality of grooves radially extending from a region which includes a position corresponding to a center of the opening.02-12-2009
20090051874DEFORMABLE MIRROR DEVICE AND APPARATUS FOR OBSERVING RETINA OF EYE USING THE SAME - A deformable mirror device includes a substrate; a plurality of electrodes provided on the substrate; a spacer disposed on the substrate; a support member disposed above the spacer and having an opening passing through from a first face of the support member facing to the substrate to a second face of the support member opposite from the first face; a deformable electrode film formed below the first face of the support member so as to be opposed to the electrodes with a distance and so as to cover the opening; an insulation film provided between the deformable electrode film and the support member; a reflection film provided on a face of the deformable electrode film opposite from the electrodes so as to overlap the opening; and a plurality of through holes passing through the reflection film and the deformable electrode film and disposed so as to overlap the opening.02-26-2009

Patent applications by Akihiro Koga, Tokyo JP

Akihiro Koga, Kawasaki-Shi JP

Patent application numberDescriptionPublished
20080218626CAMERA UNIT FOR DRIVING LENSES AND METHOD OF MANUFACTURING THE SAME - A camera unit includes a soft substrate on which electrode regions and an image pickup device region are disposed, a driving electrode group disposed on one of the electrode regions, an image pickup device disposed on the image pickup device region, stationary unit frame attaching portions disposed at positions surrounding the image pickup device region, a stationary unit frame attached to the stationary unit frame attaching portions, and movable units disposed in the stationary unit frame. The soft substrate is bent along bending positions between the electrode regions and the image pickup device region, the electrode regions are fixed on sides of the stationary unit frame inwardly thereof, and the image pickup device region is fixed on an end surface of the stationary unit frame toward the movable units.09-11-2008

Patent applications by Akihiro Koga, Kawasaki-Shi JP

Akihiro Koga, Kyoto JP

Patent application numberDescriptionPublished
20120018896SEMICONDUCTOR DEVICE - The semiconductor device according to the present invention includes a semiconductor chip, an island having an upper surface to which the semiconductor chip is bonded, a lead arranged around the island, a bonding wire extended between the surface of the semiconductor chip and the upper surface of the lead, and a resin package collectively sealing the semiconductor chip, the island, the lead and the bonding wire, while the lower surface of the island and the lower surface of the lead are exposed on the rear surface of the resin package, and the lead is provided with a recess concaved from the lower surface side and opened on a side surface thereof.01-26-2012