Patent application number | Description | Published |
20090073525 | DISPLAY DEVICE - A display device includes a laser light source, refraction means for refracting a laser beam emitted from the laser light source, and scan means for scanning the refracted laser beam by driving the refraction means. Further, in the display device, the scan means includes first scan means and second scan means that change a position of the refraction means with respect to the laser light source along two directions orthogonal to each other. Further, the refraction means includes first refraction means driven by the first scan means and second refraction means driven by the second scan means. | 03-19-2009 |
20090151995 | PACKAGE FOR SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - In a package for a semiconductor device, a core substrate has two metal plates, each of which includes a first through hole, a second through hole, a projection, and an insulating layer formed on its surface. The metal plates are stacked in a manner that the projections of the mutual metal plates enter the second through hole of the metal plate on a partner side, and the first through holes of the metal plates form a through hole penetrating the core substrate. A tip end of each of the projections of the metal plates is exposed to a surface of the metal plate on the partner side to form a first terminal portion, and a second terminal portion is exposed from the insulating layer and formed on a surface of the metal plate on a side where the first terminal portion of the metal plate on the partner side is exposed. | 06-18-2009 |
20090245724 | MODULE SUBSTRATE INCLUDING OPTICAL TRANMISSION MECHANISM AND METHOD OF PRODUCING THE SAME - A module substrate is provided. The module substrate includes: a core portion; a build-up layer formed on the core portion and including a wiring pattern and an insulating layer; an optical transmission mechanism including: an optical transmission component including an optical waveguide, and a mounting portion on which a semiconductor element is to be mounted. The mounting portion is electrically connected to the optical transmission mechanism via the wiring pattern. The mounting portion includes a first mounting portion and a second mounting portion, and the optical transmission mechanism is disposed between the first mounting portion and the second mounting portion. | 10-01-2009 |
20100147561 | WIRING BOARD WITH LEAD PINS AND METHOD OF PRODUCING THE SAME - A wiring board with lead pins includes: connection pads formed on a wiring board, and lead pins bonded through a conductive material to the connection pads, wherein each of the lead pins has a head portion that is formed in one end of a shaft portion to be larger in diameter than the shaft portion, the head portions are bonded to the connection pads by the conductive material, a face of the wiring board on which the connection pads are formed is resin-sealed by a first resin to be thicker than the head portions, except portions to which the head portions are bonded, and sides of faces of the head portions to which the shaft portions are connected are sealed to be in close contact with the first resin by a second resin. | 06-17-2010 |
20100155126 | FINE WIRING PACKAGE AND METHOD OF MANUFACTURING THE SAME - At least one electronic component having a plurality of terminals on one of surfaces is temporarily fixed to a surface of a first support with a first adhesive layer in such a manner that the terminal side of the electronic component faces the first support. A second support having a second adhesive layer is fixed to the electronic component in order to interpose the electronic component between the first support and the second support. The first support and the first adhesive layer are peeled. The electronic component on the second support is sealed with a sealing resin in such a manner that at least a part of the terminals of the electronic component is exposed. An insulating resin layer and a wiring layer to be electrically connected to the terminal of the electronic component are stacked on the electronic component and the sealing resin. | 06-24-2010 |
20100155925 | RESIN-SEALED PACKAGE AND METHOD OF PRODUCING THE SAME - A method of producing a resin-sealed package is provided with: providing an electronic component which has a plurality of terminals on one face, a first support member and a second support member; temporarily fixing said electronic component to a surface of said first support member by a first adhesive agent layer, to face said terminals with said first support member; fixing said second support member having a second adhesive agent layer to said electronic component while interposing said electronic component between said first support member and said second support member to face said second adhesive agent layer with a back face side of said electronic component; resin sealing said electronic component between said first support member and said second support member; peeling said first support member and said first adhesive agent layer from said electronic component and a sealing resin; and stacking an insulating resin layer and a wiring layer which is electrically connected to said terminals of said electronic component, on said electronic component and said sealing resin. | 06-24-2010 |
20100258944 | ELECTRONIC APPARATUS AND FABRICATION METHOD OF THE SAME - A first semiconductor component and a second semiconductor component are attached together via an adhesion layer so that the first semiconductor component and the second semiconductor component are electrically connected with each other via a through electrode. The through electrode is formed to fill a through hole formed in the second semiconductor component and a through hole formed in a portion the adhesion layer. The through hole formed in the portion the adhesion layer is positioned between the through hole formed in the second semiconductor component and a second connection surface of a first semiconductor component through electrode. | 10-14-2010 |
20100258946 | SEMICONDUCTOR DEVICE, MANUFACTURING METHOD THEREOF, AND ELECTRONIC DEVICE - A disclosed semiconductor device includes a reinforcing board having first and second faces, an electronic part accommodating portion penetrating the reinforcing board, a through hole, an electronic part having a front face on which an electrode pad is formed and a back face, a through electrode installed inside the through hole, a first sealing resin filling a gap between the through electrode and an inner wall of the through hole, a second sealing resin filled into the electronic part accommodating portion while causing the bonding face of the electrode pad of the electronic part accommodating portion to be exposed to an outside, and a multi-layered wiring structure configured to include insulating layers laminated on the first face of the reinforcing board and an interconnection pattern, wherein the interconnection pattern is directly connected to the electrode pad of the electronic part and the through electrode. | 10-14-2010 |
20110045642 | METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE - A method of manufacturing a semiconductor package comprises: preparing a photosensitive insulating material having a first surface and a second surface opposite to the first surface; bonding a semiconductor chip to the first surface of the photosensitive insulating material with a connecting terminal of the semiconductor chip facing the first surface of the photosensitive insulating material; exposing the second surface of the photosensitive insulating material after the bonding the semi-conductor to the first surface of the photosensitive material; encapsulating the first surface of the photosensitive insulating material, and the semiconductor chip bonded to the first surface, with a resin to form a resin encapsulated portion after exposing the second surface of the photosensitive insulating material; and developing the photosensitive insulating material, thereby forming a through-hole communicating with the connecting terminal of the semiconductor chip in the photosensitive insulating material after the exposing the second surface of the photosensitive insulating material. | 02-24-2011 |
20110049726 | SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD OF THE SEMICONDUCTOR PACKAGE - A semiconductor package includes a semiconductor chip; a resin part configured to cover a side surface of the semiconductor chip; and a wiring structure formed on a circuit forming surface of the semiconductor chip and a surface of the resin part being situated at the same side as the circuit forming surface, the wiring structure being electrically connected to the semiconductor chip, wherein the resin part is formed so as to cover a part of a surface of the semiconductor chip situated at an opposite side to the circuit forming surface of the semiconductor chip. | 03-03-2011 |
20120153509 | SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREFOR - According to one embodiment, there is provided a semiconductor package including: a semiconductor chip; a resin portion formed to cover the semiconductor chip; a wiring structure formed on the resin portion and electrically connected to the semiconductor chip; and a warpage preventing member provided above the resin portion to have a thermal expansion coefficient closer to that of the semiconductor chip than to that of the wiring structure. | 06-21-2012 |
20130249075 | SEMICONDUCTOR PACKAGE, SEMICONDUCTOR APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE - A semiconductor package includes: a metal plate including a first surface, a second surface and a side surface; a semiconductor chip on the first surface of the metal plate, the semiconductor chip comprising a first surface, a second surface and a side surface; a first insulating layer that covers the second surface of the metal plate; a second insulating layer that covers the first surface of the metal plate, and the first surface and the side surface of the semiconductor chip; and a wiring structure on the second insulating layer and including: a wiring layer electrically connected to the semiconductor chip; and an interlayer insulating layer on the wiring layer. A thickness of the metal plate is thinner than that of the semiconductor chip, and the side surface of the metal plate is covered by the first insulating layer or the second insulating layer. | 09-26-2013 |
20130264101 | WIRING SUBSTRATE AND METHOD OF MANUFACTURING WIRING SUBSTRATE - There is provided a wiring substrate including: a core substrate including: a first core substrate including: a plate-shaped first glass substrate; and a first through electrode formed through the first glass substrate; a second core substrate including: a plate-shaped second glass substrate; and a second through electrode formed through the second glass substrate, wherein a diameter of the second through electrode is different from that of the first through electrode; and an insulating member encapsulating the first and second core substrates, and a wiring layer formed on at least one surface of the core substrate. The first and second core substrates are arranged to be separated from each other when viewed from a top. | 10-10-2013 |
20130328211 | SEMICONDUCTOR PACKAGE, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE - A semiconductor device includes a semiconductor chip, a core substrate, first and second insulating layers, and first and second wiring layers. Adhesiveness of the insulating layer to a metal is higher than adhesiveness of the core substrate to the metal. A through hole extends through the insulating layer in the thickness direction. A through via covers the hole wall surface of the through hole, extends in the thickness direction traversing the insulating layer, and electrically connects the first and second wiring layers. | 12-12-2013 |
20140070396 | SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD - A metal plate covers an opening on the upper surface of a core substrate and exposes an outer edge of the upper surface of the core substrate. A conductive layer covers the lower surface of the core substrate. A semiconductor chip bonded to a first surface of the metal plate is exposed through the opening. A first insulating layer covers the upper and side surface of the metal plate and the outer edge of the upper surface of the core substrate. A second insulating layer fills the openings of the metal plate and the conductive layer and covers the outer edge of the lower surface of the core substrate, the conductive layer, and the semiconductor chip. The metal plate is thinner than the semiconductor chip. Total thickness of the conductive layer and the core substrate is equal to or larger than the thickness of the semiconductor chip. | 03-13-2014 |