Patent application number | Description | Published |
20090139662 | SEPARATING DEVICE - A separating device according to the present invention separates a support plate ( | 06-04-2009 |
20090218050 | Treatment liquid permeation unit and treating apparatus - A treatment liquid permeation unit ( | 09-03-2009 |
20090314430 | Separating apparatus and separating method - A separating apparatus according to the present invention includes a clamp for gripping an outer peripheral end of a supporting plate. The clamp grips the outer peripheral end of the supporting plate and separates the supporting plate from a wafer by gripping the supporting plate. This makes it possible to separate a supporting plate from a wafer without breaking the wafer. With this, a supporting plate can be separated from a wafer to which the supporting plate has been attached, without breaking the wafer. | 12-24-2009 |
20090314438 | Supporting plate peeling apparatus - A supporting plate peeling apparatus in accordance with the present invention has removal means for removing an adhesive agent remaining on a side of a wafer from which a supporting plate has been peeled off, which adhesive agent is removed after (i) a supporting plate which supports a wafer reduced in thickness has been peeled off from the wafer and (ii) the side from which the supporting plate has been peeled off is washed with a washing liquid. The supporting plate peeling apparatus in accordance with the present invention is a supporting plate peeling apparatus which can remove the adhesive agent that remains on the side of the wafer from which the supporting plate has been peeled off that could not be completely removed just by the washing liquid, and which allows satisfactory completion of a peeling step. Hence, a supporting plate peeling apparatus is provided, which peels off a supporting plate for supporting a wafer, while not causing the side of the wafer from which the support plate has been peeled off to deteriorate. | 12-24-2009 |
20100000680 | SEPARATING APPARATUS AND SEPARATING METHOD - A separating apparatus according to the present invention includes a sucking plate for sticking to a support plate by suction. The sucking plate has sucking holes | 01-07-2010 |
20100319209 | ALIGNMENT APPARATUS AND ALIGNMENT METHOD - Provided is an alignment apparatus including holding and rotating means for holding an alignment object and rotating the alignment object, the alignment apparatus including supporting means for supporting that part of the alignment object being rotated which is different from that part of the alignment object which is held by the holding and rotating means. This makes it possible to align the alignment object highly accurately by preventing the alignment object from being deformed, e.g. bent, due to its own weight. | 12-23-2010 |
20110259527 | STRIPPING DEVICE AND STRIPPING METHOD - A stripping method for stripping a support plate from a laminate including a substrate and the support plate adhered to the wafer via an adhesive layer, in which the adhesive layer is formed from an adhesive compound soluble in a non-polar solvent or a highly polar solvent; and the stripping method includes the step of supplying the non-polar solvent or the highly polar solvent, so that the non-polar solvent or the highly polar solvent is retained at least on an edge portion of that surface of the laminate which faces the support plate, and on a lateral surface of the laminate. | 10-27-2011 |
20130000852 | STRIPPING DEVICE AND STRIPPING METHOD - A stripping method for stripping a support plate from a laminate including a substrate and the support plate adhered to the wafer via an adhesive layer, in which the adhesive layer is formed from an adhesive compound soluble in a non-polar solvent or a highly polar solvent; and the stripping method includes supplying the non-polar solvent or the highly polar solvent, so that the non-polar solvent or the highly polar solvent is retained at least on an edge portion of that surface of the laminate which faces the support plate, and on a lateral surface of the laminate. | 01-03-2013 |
20140151328 | METHOD FOR FORMING LAMINATE - A release layer is adequately protected by a protective layer when a laminate is subjected to a desired treatment. A method for forming a laminate | 06-05-2014 |
20140169929 | TRANSPORT ARM, TRANSPORT APPARATUS AND TRANSPORT METHOD - A transport arm including a holding unit that holds a substrate by vacuum adsorption. The holding unit has an air discharge port and an adsorption member formed so as to surround the air discharge port. The adsorption member is a squeeze packing. | 06-19-2014 |
20140318714 | SUPPORTING MEMBER SEPARATION APPARATUS AND SUPPORTING MEMBER SEPARATION METHOD - A supporting member separation apparatus that separates a supporting member from a laminate having a substrate, an adhesive layer, a release layer which has a property that changes when it absorbs light, and the supporting member which are laminated in this order. The apparatus includes a holding unit that holds one surface of the laminate, a lifting and lowering unit that lifts and lowers the holding unit, and an adjustment unit that maintains a constant applied force to the holding unit. | 10-30-2014 |
20140332147 | STICKING APPARATUS AND STICKING METHOD - A sticking apparatus including a pair of plate members sandwiching a laminate between the pair of plate members, and supporting members supporting the plate members. The supporting members supporting at least one of the plate members are located in a form of multiple dots or lines adjacent to each other at regular intervals on the plate member. | 11-13-2014 |
20140332149 | METHOD FOR PROCESSING MOLD MATERIAL AND METHOD FOR MANUFACTURING STRUCTURAL BODY - A method for processing a mold material which includes a heating step of heating a mold material layer formed of the mold material to discharge gas from the mold material constituting the mold material layer. | 11-13-2014 |