| Patent application number | Description | Published |
|---|
| 20090139662 | SEPARATING DEVICE - A separating device according to the present invention separates a support plate ( | 06-04-2009 |
| 20090218050 | Treatment liquid permeation unit and treating apparatus - A treatment liquid permeation unit ( | 09-03-2009 |
| 20090314430 | Separating apparatus and separating method - A separating apparatus according to the present invention includes a clamp for gripping an outer peripheral end of a supporting plate. The clamp grips the outer peripheral end of the supporting plate and separates the supporting plate from a wafer by gripping the supporting plate. This makes it possible to separate a supporting plate from a wafer without breaking the wafer. With this, a supporting plate can be separated from a wafer to which the supporting plate has been attached, without breaking the wafer. | 12-24-2009 |
| 20090314438 | Supporting plate peeling apparatus - A supporting plate peeling apparatus in accordance with the present invention has removal means for removing an adhesive agent remaining on a side of a wafer from which a supporting plate has been peeled off, which adhesive agent is removed after (i) a supporting plate which supports a wafer reduced in thickness has been peeled off from the wafer and (ii) the side from which the supporting plate has been peeled off is washed with a washing liquid. The supporting plate peeling apparatus in accordance with the present invention is a supporting plate peeling apparatus which can remove the adhesive agent that remains on the side of the wafer from which the supporting plate has been peeled off that could not be completely removed just by the washing liquid, and which allows satisfactory completion of a peeling step. Hence, a supporting plate peeling apparatus is provided, which peels off a supporting plate for supporting a wafer, while not causing the side of the wafer from which the support plate has been peeled off to deteriorate. | 12-24-2009 |
| 20100000680 | SEPARATING APPARATUS AND SEPARATING METHOD - A separating apparatus according to the present invention includes a sucking plate for sticking to a support plate by suction. The sucking plate has sucking holes | 01-07-2010 |
| 20100319209 | ALIGNMENT APPARATUS AND ALIGNMENT METHOD - Provided is an alignment apparatus including holding and rotating means for holding an alignment object and rotating the alignment object, the alignment apparatus including supporting means for supporting that part of the alignment object being rotated which is different from that part of the alignment object which is held by the holding and rotating means. This makes it possible to align the alignment object highly accurately by preventing the alignment object from being deformed, e.g. bent, due to its own weight. | 12-23-2010 |
| 20110259527 | STRIPPING DEVICE AND STRIPPING METHOD - A stripping method for stripping a support plate from a laminate including a substrate and the support plate adhered to the wafer via an adhesive layer, in which the adhesive layer is formed from an adhesive compound soluble in a non-polar solvent or a highly polar solvent; and the stripping method includes the step of supplying the non-polar solvent or the highly polar solvent, so that the non-polar solvent or the highly polar solvent is retained at least on an edge portion of that surface of the laminate which faces the support plate, and on a lateral surface of the laminate. | 10-27-2011 |
| Patent application number | Description | Published |
|---|
| 20110168939 | COMPOSITE MAGNETIC MATERIAL AND MAGNETIC ELEMENT - The object of the present invention is to provide a composite magnetic material having well-balanced magnetic properties and chemical properties, and a magnetic element using thereof. Concretely, the present provides the composite magnetic material comprising a binder and a magnetic powder contains followings: Mn not less than 0.25 wt % and not larger than 3 wt %, Si not less than 1 wt % and not larger than 7 wt %, Cr not less than 2 wt % and not larger than 8 wt %, and the rest of Fe and inevitable impurities with respect to the total weight of a magnetic powder material, and a ratio of powder particles having the major/minor axis is not less than 2 is not larger than 5% of the total powder particles. | 07-14-2011 |
| 20120194309 | MAGNETIC POWDER MATERIAL, LOW-LOSS COMPOSITE MAGNETIC MATERIAL CONTAINING SAME, AND MAGNETIC ELEMENT USING SAME - The present invention provides a material which can be used for low pressure molding, and which has a low core loss while maintaining the characteristic of an amorphous powder that is the high coercive force. It provides a magnetic powder material containing, relative to the weight thereof, amorphous powders of 45 to 80 wt %, crystalline powders of 55 to 20 wt %, and a bonding agent. The magnetic powder material contains, relative to the mass thereof, Si of 4.605 to 6.60 mass %, Cr of 2.64 to 3.80 mass %, C of 0.225 to 0.806 mass %, Mn of 0.018 to 0.432 mass %, B of 0.99 to 2.24 mass %, P of equal to or less than 0.0248 mass %, S of equal to or less than 0.0165 mass %, Co of equal to or less than 0.0165 mass %, and a balance of Fe and inevitable impurities. | 08-02-2012 |
