Patent application number | Description | Published |
20090060432 | LIGHT TRANSMITTING BODY AND OPTICAL INTERCONNECTION SYSTEM - An optical transmission medium includes a GI optical fiber that is made of silica glass. The GI optical fiber includes a core having a graded-index refractive index profile and a cladding formed around the core. The GI optical fiber is bent by equal to or more than a quarter turn with a curvature radius equal to or larger than 4 mm and equal to or smaller than 10 mm. | 03-05-2009 |
20100036257 | ULTRASONIC PROBE AND ULTRASONIC DIAGNOSTIC APPARATUS USING THE SAME - Provided is an ultrasonic probe including: a cMUT chip having a plurality of vibration elements whose electromechanical coupling coefficient or sensitivity is changed according to a bias voltage and transmitting and receiving ultrasonic waves; an acoustic lens arranged above the cMUT chip: and a backing layer arranged below the cMUT chip. | 02-11-2010 |
20100154547 | ULTRASONIC PROBE AND ULTRASONIC DIAGNOSIS DEVICE - An ultrasonic probe and an ultrasonic diagnosis device which can improve electrical safety for an operator are provided. The ultrasonic probe | 06-24-2010 |
20100242612 | ULTRASONIC PROBE, AND ULTRASONIC DIAGNOSTIC APPARATUS USING THE SAME - An ultrasonic probe including a cMUT chip that has plural oscillation elements whose electromechanical coupling coefficient or sensitivity varies in accordance with a bias voltage and transmits/receives an ultrasonic wave, an acoustic lens provided at an ultrasonic wave transmission/reception side of the cMUT chip, a backing layer provided to the opposite surface of the cMUT chip to the acoustic lens, and a substrate provided between the backing layer and the cMUT chip. The ultrasonic probe further includes thermal stress suppressing means for suppressing thermal stress occurring due to the difference in linear expansion coefficient caused by temperature variation between the substrate and the backing layer. | 09-30-2010 |
20110071396 | ULTRASONIC PROBE, METHOD FOR MANUFACTURING THE SAME AND ULTRASONIC DIAGNOSTIC APPARATUS - An ultrasonic probe is provided with a CMUT chip having a plurality of transducer elements that change electromechanical coupling coefficients or sensitivities in accordance with a bias voltage to transmit and receive ultrasonic waves, an electric conducting layer formed on the ultrasonic irradiation side of the CMUT chip, an acoustic lens arranged on the ultrasonic irradiation side of the CMUT chip, an insulating layer formed in the direction opposite to the ultrasonic irradiation side of the acoustic lens, a housing unit that stores the CMUT chip in which the electric conducting layer and the insulating layer are fixed with an adhesive and the acoustic lens, wherein the insulating layer is formed by the material that includes at least either silicon oxide or paraxylene to prevent a solvent of the adhesive from soaking into the adhered portion. | 03-24-2011 |
20120320710 | ULTRASONIC PROBE AND ULTRASONIC IMAGING APPARATUS USING THE SAME - In order to provide an ultrasonic probe capable of suppressing the influence of multiple reflections occurring on the interface of a transducer with a CMUT chip and a backing layer, an ultrasonic probe of the present invention has a structure where an acoustic lens | 12-20-2012 |
20130031980 | Ultrasonic Probe, Production Method Therefor, and Ultrasonic Diagnostic Apparatus - Disclosed is an ultrasonic probe wherein the warpage of a CMUT due to thermal stress produced at the joint between a backing layer and the CMUT is minimized, thereby improving the durability of the bond between the CMUT and the backing layer. To accomplish this the ultrasonic probe is provided with: a CMUT ( | 02-07-2013 |
20130285174 | ULTRASOUND PROBE - Disclosed is an ultrasonic probe comprising: CMUT cells ( | 10-31-2013 |
20130331699 | ULTRASOUND IMAGING APPARATUS - Even when electroacoustic conversion elements with high nonlinearity are employed, a nonlinear imaging is carried out with extracting more nonlinear components. An ultrasonic wave beam is transmitted twice from the transmitter to an identical position on the imaging target, and the signal processor performs computation on the reception signals obtained in every transmission performed twice, thereby extracting a nonlinear component included in the reception signals. In one transmission out of the transmission performed twice, the transmitter delivers the transmission signal to all of multiple electroacoustic conversion elements for driving the electroacoustic conversion elements, and in the other transmission, the transmission signal is delivered selectively only to a part of the multiple electroacoustic conversion elements for driving the electroacoustic conversion elements. | 12-12-2013 |