Akiba
Atsuya Akiba, Kariya-Shi JP
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20150021680 | FIELD EFFECT TRANSISTOR INCORPORATING A SCHOTTKY DIODE - A FET incorporating a Schottky diode has a structure allowing the ratio of an area in which the Schottky diode is formed and an area in which the FET is formed to be freely adjusted. A trench extending for a long distance is utilized. Schottky electrodes are interposed at positions appearing intermittently in the longitudinal direction of the trench. By taking advantage of the growth rate of a thermal oxide film formed on SiC being slower, and the growth rate of a thermal oxide film formed on polysilicon being faster, a structure can be obtained in which insulating film is formed between gate electrodes and Schottky electrodes, between the gate electrodes and a source region, between the gate electrodes and a body region, and between the gate electrodes and a drain region, and in which insulating film is not formed between the Schottky electrodes and the drain region. | 01-22-2015 |
Genju Akiba, Chiba-Ken JP
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20150047604 | ENGINE-POWERED WORK TOOL PROVIDED WITH WIND GOVERNOR - An engine-powered work tool includes an engine having a crank shaft, an output controller and a wind governor. The output controller includes an output control shaft angularly rotatable about its axis for controlling a rotation speed of the crank shaft. The wind governor can control the angular rotation of the output control shaft and includes: a governor plate for receiving cooling air generated at a cooling fan connected to the crank shaft; an arm fixed to the output control shaft; and a governor spring connected to the arm for biasing the output control shaft to increase the rotation speed of the crank shaft. The governor plate functions to bias the output control shaft to decrease the rotation speed of the crank shaft upon receipt of the cooling air. The governor spring has an end changeable in position relative to the output controller among a plurality of prescribed positions. | 02-19-2015 |
Hideki Akiba, Annaka-Shi JP
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20130197129 | LIQUID EPOXY RESIN COMPOSITION AND SEMICONDUCTOR DEVICE - Disclosed is a liquid epoxy resin composition containing: (A) a liquid epoxy resin comprising at least one liquid epoxy resin represented by the following general formula (1) or (2): | 08-01-2013 |
Hideki Akiba, Annaka JP
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20130200534 | SEALANT LAMINATED COMPOSITE, SEALED SEMICONDUCTOR DEVICES MOUNTING SUBSTRATE, SEALED SEMICONDUCTOR DEVICES FORMING WAFER, SEMICONDUCTOR APPARATUS, AND METHOD FOR MANUFACTURING SEMICONDUCTOR APPARATUS - Described herein is a sealant laminated composite for collectively sealing a semiconductor device's mounting surface of a substrate on which semiconductor devices are mounted or a semiconductor device's forming surface of a wafer on which semiconductor devices are formed. The composite can include a support wafer and an uncured resin layer constituted of an uncured thermosetting resin formed on one side of the support wafer. In certain aspects, the sealant laminated composite is very versatile, even when a large diameter or thin substrate or wafer is sealed. In certain aspects, this can prevent the substrate or wafer from warping and the semiconductor devices from peeling; can collectively seal a semiconductor device's mounting surface of a substrate on which semiconductor devices are mounted or a semiconductor device's forming surface of a wafer on which semiconductor devices are formed on a wafer level; and can provide a sealant laminated composite that is excellent in the heat resistance and humidity resistance after sealing. | 08-08-2013 |
20130241087 | SEMICONDUCTOR APPARATUS AND METHOD FOR PRODUCING THE SAME - A method for producing a semiconductor apparatus with a mold including an upper mold half and a lower mold half, includes: an arranging step of arranging on one of the upper mold half and the lower mold half of the mold a substrate on which a semiconductor device is mounted, the mold being kept at a room temperature or heated to a temperature up to 200° C., and arranging on the other of the upper mold half and the lower mold half a substrate on which no semiconductor device is mounted; an integrating step of integrating the substrate on which the semiconductor device is mounted and the substrate on which no semiconductor device is mounted by molding a thermosetting resin with the mold on which the substrates are arranged; and a step of dicing the integrated substrates taken out of the mold to obtain an individualized semiconductor apparatus. | 09-19-2013 |
20140091483 | METHOD OF MANUFACTURING SEMICONDUCTOR APPARATUS AND SEMICONDUCTOR APPARATUS - A method of manufacturing a semiconductor apparatus includes: a charging step of charging the thermosetting resin in excess of an amount necessary for forming the sealing layer to fill the inside of the first cavity with the thermosetting resin and discharging an excess of the thermosetting resin from the first cavity; an integrating step of integrating the substrate on which the semiconductor device is mounted, the substrate on which no semiconductor device is mounted and the sealing layer by molding the thermosetting resin while pressurizing the upper mold and the lower mold; and a dicing step of extracting the integrated substrates from the molding mold and dicing the integrated substrates to obtain an individual semiconductor apparatus. | 04-03-2014 |
20140138856 | FIBER-CONTAINING RESIN SUBSTRATE, DEVICE-MOUNTING SUBSTRATE AND DEVICE-FORMING WAFER, SEMICONDUCTOR APPARATUS, AND METHOD FOR PRODUCING SEMICONDUCTOR APPARATUS - A fiber-containing resin substrate for collectively encapsulating a semiconductor-device-mounting surface of a substrate on which semiconductor devices are mounted or a semiconductor-device-forming surface of a wafer on which a semiconductor device is formed, including a resin-impregnated fibrous base material which is obtained by impregnating a fibrous base material with a thermosetting resin and semi-curing or curing the thermosetting resin and has a linear expansion coefficient (ppm/° C.) in an X-Y direction of less than 3 ppm, and an uncured resin layer formed of an uncured thermosetting resin on one side of the resin-impregnated fibrous base material. | 05-22-2014 |
20140138857 | ENCAPSULANT EQUIPPED WITH SUPPORTING SUBSTRATE, ENCAPSULATED SUBSTRATE HAVING SEMICONDUCTOR DEVICES MOUNTING THEREON, ENCAPSULATED WAFER HAVING SEMICONDUCTOR DEVICES FORMING THEREON, SEMICONDUCTOR APPARATUS, AND METHOD FOR MANUFACTURING SEMICONDUCTOR APPARATUS - The invention provides an encapsulant equipped with the supporting substrate which is an encapsulant for collectively encapsulating a semiconductor devices mounting surface of a substrate having semiconductor devices mounting thereon or a semiconductor devices forming surface of a wafer having semiconductor devices forming thereon, and the encapsulant equipped with the supporting substrate comprises a supporting substrate having a difference of a linear expansion coefficient from that of the substrate or the wafer of 5 ppm or less and a thermosetting resin layer being laminated, wherein the thermosetting resin layer has a shape having a height difference to a thickness direction. | 05-22-2014 |
20140264956 | SEALANT LAMINATED COMPOSITE, SEALED SEMICONDUCTOR DEVICES MOUNTING SUBSTRATE, SEALED SEMICONDUCTOR DEVICES FORMING WAFER, SEMICONDUCTOR APPARATUS, AND METHOD FOR MANUFACTURING SEMICONDUCTOR APPARATUS - Disclosed is a sealant laminated composite for collectively sealing a semiconductor devices mounting surface of a substrate on which semiconductor devices may be mounted or a semiconductor devices forming surface of a wafer on which semiconductor devices may be formed, including a support wafer that may be composed of silicon and an uncured resin layer that may be constituted of an uncured thermosetting resin formed on one side of the support wafer. | 09-18-2014 |
20150028497 | ENCAPSULANT WITH BASE FOR USE IN SEMICONDUCTOR ENCAPSULATION, SEMICONDUCTOR APPARATUS, AND METHOD FOR MANUFACTURING SEMICONDUCTOR APPARATUS - The present invention provides an encapsulant with a base for use in semiconductor encapsulation, for collectively encapsulating a device mounting surface of a substrate on which semiconductor devices are mounted, or a device forming surface of a wafer on which semiconductor devices are formed, the encapsulant comprising the base, an encapsulating resin layer composed of an uncured or semi-cured thermosetting resin formed on one surface of the base, and a surface resin layer formed on the other surface of the base. The encapsulant enables a semiconductor apparatus having a good appearance and laser marking property to be manufactured. | 01-29-2015 |
20150197885 | SURFACE-MODIFIED GLASS FIBER FILM - The present invention provides a surface-modified glass fiber film having its surface modified by a silicon-containing compound, and a value of a common flexural rigidity of the surface-modified glass fiber film as measured by the method described in JIS R 3420 is in the range of 3 to 100 times as compared to a value of the common flexural rigidity of an unmodified glass fiber film. | 07-16-2015 |
20150235871 | VACUUM LAMINATING APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUCTOR APPARATUS - A vacuum laminating apparatus for use in manufacturing a semiconductor apparatus, including a frame mechanism to surround at least a side face of a support-base attached encapsulant including a thermosetting resin layer stacked as an encapsulant on a support base, the frame mechanism including a holding unit to hold a substrate on which semiconductor devices are mounted or a wafer on which semiconductor devices are formed with the substrate or the wafer facing and spaced apart from the thermosetting resin layer of the support-base attached encapsulant, the vacuum laminating apparatus capable of vacuum laminating the support-base attached encapsulant surrounded by the frame mechanism together with the substrate or wafer. The vacuum laminating apparatus inhibit the occurrence of voids in resin layer and warp of a substrate or wafer and manufacture a semiconductor apparatus having a precisely formed resin layer, even when the substrate or wafer used has a large area. | 08-20-2015 |
20160035638 | SUPPORT BASE-ATTACHED ENCAPSULANT, ENCAPSULATED SUBSTRATE HAVING SEMICONDUCTOR DEVICES MOUNTED THEREON, ENCAPSULATED WAFER HAVING SEMICONDUCTOR DEVICES FORMED THEREON, SEMICONDUCTOR APPARATUS, AND METHOD FOR MANUFACTURING SEMICONDUCTOR APPARATUS - Support base-attached encapsulant for collectively encapsulating a semiconductor device mounting surface of a substrate or semiconductor device forming surface of a wafer, containing a support base having one fibrous film or a plurality of the fibrous films being laminated, the fibrous film subjected to surface treatment with an organosilicon compound, and a resin layer of thermosetting resin formed on one surface of the support base. The support base-attached encapsulant inhibit the substrate or wafer from warping and semiconductor devices from peeling away from the substrate, and collectively encapsulate the semiconductor device mounting surface of the substrate or the semiconductor device forming surface of the wafer even when a large-diameter wafer or large-area substrate is encapsulated. The support base-attached encapsulant has uniformity and homogeneity without opening or tangle of fiber, and is excellent in reliability such as heat resistance, electrical insulation property, moisture resistance, excellent in versatility, economical efficiency, and mass-productivity. | 02-04-2016 |
20160043012 | FIBER-CONTAINING RESIN SUBSTRATE, DEVICE-MOUNTING SUBSTRATE AND DEVICE-FORMING WAFER, SEMICONDUCTOR APPARATUS, AND METHOD FOR PRODUCING SEMICONDUCTOR APPARATUS - A fiber-containing resin substrate for collectively encapsulating a semiconductor-device-mounting surface of a substrate on which semiconductor devices are mounted or a semiconductor-device-forming surface of a wafer on which a semiconductor device is formed, including a resin-impregnated fibrous base material which is obtained by impregnating a fibrous base material with a thermosetting resin and semi-curing or curing the thermosetting resin and has a linear expansion coefficient (ppm/° C.) in an X-Y direction of less than 3 ppm, and an uncured resin layer formed of an uncured thermosetting resin on one side of the resin-impregnated fibrous base material. | 02-11-2016 |
20160044839 | ELECTROMAGNETIC WAVE SHIELDING SHEET AND SEMICONDUCTOR APPARATUS - The present invention provides an electromagnetic wave shielding sheet including a surface-treated fibrous film and a conductive layer, the surface-treated fibrous film having a conventional bending rigidity 3 to 100 times larger than a conventional bending rigidity of a untreated fibrous film as measured according to a procedure described in Japanese Industrial Standards R 3420, the conductive layer being composed of a metallic mesh. The electromagnetic wave shielding sheet has sufficient electromagnetic wave shielding property, high strength, flexibility, excellent dimensional stability, and high heat resistance and configured to inhibit warp and swell during high temperature heating. | 02-11-2016 |
20160133579 | ELECTROMAGNETIC WAVE SHIELDING SUPPORT BASE-ATTACHED ENCAPSULANT, ENCAPSULATED SUBSTRATE HAVING SEMICONDUTOR DEVICES MOUNTED THEREON, ENCAPSULATED WAFER HAVING SEMICONDUCTOR DEVICES FORMED THEREON, AND SEMICONDUCTOR APPARATUS - The present invention provides an electromagnetic wave shielding support base-attached encapsulant for collectively encapsulating a semiconductor device mounting surface of a substrate having semiconductor devices mounted thereon or a semiconductor device forming surface of a wafer having semiconductor devices formed thereon, the support base-attached encapsulant including a support base having an electromagnetic wave shielding property of 20 dB or more within a range of 100 MHz to 1,000 MHz, and an encapsulant composed of a thermosetting resin layer laminated on the support base. There can be provided a support base-attached encapsulant that can collectively encapsulate a semiconductor device mounting surface of a substrate having the semiconductor devices mounted thereon or a semiconductor device forming surface of a wafer having semiconductor devices formed thereon without occurrence of warping of the substrate or the wafer, peeling of the semiconductor devices from the substrate, and breakage of the wafer even in the case that a large-diameter wafer or a large-area substrate such as inorganic, organic, or metal substrate, especially thin one, is encapsulated, and that has excellent electromagnetic wave shielding property, reliability such as heat resistance and moisture resistance after encapsulating, and extremely high versatility, mass-productivity, workability, and economical efficiency. | 05-12-2016 |
20160141268 | METHOD FOR MANUFACTURING SEMICONDUCTOR APPARATUS AND SEMICONDUCTOR APPARATUS - A method for manufacturing a semiconductor-apparatus, including an encapsulating step of a device mounting surface of a substrate having semiconductor-devices mounted thereon with a base-attached encapsulant having a base and a thermosetting resin layer formed on one surface of the base, the semiconductor-devices being mounted by flip-chip bonding, the encapsulating step including a unifying stage of the substrate having the semiconductor-devices mounted thereon and the base-attached encapsulant under a reduced pressure condition with a vacuum of 10 kPa or less and a pressing stage of the unified substrate with a pressure of 0.2 MPa or more. A method for manufacturing a semiconductor-apparatus that can inhibit warping even when a thin substrate with a large area is encapsulated, sufficiently perform underfilling of semiconductor-devices mounted by flip-chip bonding, and provide a semiconductor-apparatus excellent in encapsulating performance such as heat and moisture resistance reliabilities without void and non-filling portion of the encapsulating layer. | 05-19-2016 |
Hironori Akiba, Ota-Ku JP
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20140014643 | Heating Device - A heating device includes a base plate and a face plate that is provided above the base plate and on which a wafer is placed. The face plate includes an aluminum substrate, a film heater that is provided to the aluminum substrate and heats the wafer, and a gap ball that is disposed on the aluminum substrate and interposed between the aluminum substrate and the wafer. The aluminum substrate is provided with a second attachment hole into which the gap ball is press-fitted. The gap ball is held only by an inner wall of the second attachment hole by being press-fitted. | 01-16-2014 |
20140014644 | Heating Device - A heating device includes a substrate in a form of a face plate that is positioned above a base plate, on which a wafer is placed, and to which a film heater for heating wafer is provided, columns that are vertically provided between the base plate and the face plate and support the face plate, and tension members that pull the face plate toward the base plate. The columns and the tension members are positioned to support or pull at least a part of the face plate corresponding to a placement region of the wafer. Each of the tension members includes a shaft having an upper end locked by the face plate and a lower end penetrating the base plate and a coil spring that is positioned on the base plate and biases the lower end of the shaft downward. | 01-16-2014 |
Hiroshi Akiba, Santa Clara, CA US
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20140267338 | TECHNIQUES FOR IMPROVING RENDERING EFFICIENCY - Various embodiments are generally directed to techniques for causing the storage of a color data value of a clear color to be deferred or entirely avoided as color data values of primitives of an image are stored. An apparatus includes a processor element; and a logic to store color data values of a block of pixels of the image in a first portion of a cache line, store an indication of the first portion as written and of a second portion of the cache line as not in a per-portion table, evict contents of the first and second portions, and store the contents of the first portion in an image data and store a color data value of a clear color in place of the contents of the second portion in the image data in response to the indications stored in the per-portion table. Other embodiments are described and claimed. | 09-18-2014 |
Kazuki Akiba, Kennett Square, PA US
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20110294955 | THERMOPLASTIC POLYESTER ELASTOMER COMPOSITION INCLUDING IONOMER - Disclosed is a composition including a melt mixed blend including (a) 58 to 96.8 weight percent one or more copolyester thermoplastic elastomers; (b) 3 to 40 weight percent polyphenylene ether; (c) 0.1 to 6 weight % ionomer and (d) 0.1 to 8 weight percent of polymeric toughener selected from the group consisting ethylene copolymers of the formula E/X/Y wherein: | 12-01-2011 |
20110294961 | THERMOPLASTIC POLYESTER ELASTOMER COMPOSITIONS - Disclosed is a composition including a melt mixed blend including (a) 52 to 96.9 weight percent one or more copolyester thermoplastic elastomers; (b) 3 to 40 weight percent polyphenylene ether; and (c) 0.1 to 8 weight percent of polymeric toughener selected from the group consisting ethylene copolymers of the formula E/X/Y wherein: | 12-01-2011 |
20120128911 | SOLID STATE POLYMERIZATIONS OF POLYESTER - Disclosed is an improved process for solid state polymerization of copolyester thermoplastic elastomers that results in a reduction of solid state polymerization reaction time while producing a high molecular weight product. The addition of 10 wt % or less of polar polymers i) having melting points at least 40° C. below the melting temperature or melting point of a copolyester thermoplastic elastomer and ii) having a solubility parameter greater than 18.4 (J/cm | 05-24-2012 |
20120201986 | POLYESTER COMPOSITIONS WITH IMPROVED PROPERTIES - The recited invention relates to polyester elastomer compositions having improved mechanical properties when prepared using aqueous solutions of metal salts. An improvement in DMA storage modulus, a decrease in melt flow rate and an increase in light transmittance are observed in polyester elastomer compositions in which the metal salt is melt-mixed with aqueous solutions of metal salts compared to polyester compositions in which the metal salt is mixed into the polyester composition as a solid. | 08-09-2012 |
Kazuomi Akiba, Kariya-Shi JP
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20150163613 | ACOUSTIC CONTROL DEVICE - When a surround sound is set, operation buttons for setting the surround sound and operation buttons for setting a listening position which are such that setting contents mutually act on setting results are displayed on a setting section at the same time, and in operation determination control and display selection determination control, display based on the surround sound and the listening position is displayed on an illustration section of a touch panel display. | 06-11-2015 |
Kazuyoshi Akiba, Nagoya JP
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20140204267 | CONTROL OF EXPOSURE OF CAMERA - A device for controlling exposure of a camera is provided. An image of an area ahead of a vehicle is acquired by a camera provided in the vehicle. A traveling speed of the vehicle is acquired. An exposure area in the acquired image is set by a setting section, in which the exposure area is used for exposure control of the camera. By a calculating section, a control value for performing the exposure control is calculated based on pixel values of pixels included in the exposure area. The setting section changes a size of the exposure area based on the traveling speed, such that, when the traveling speed is a first speed, the size of the exposure area in the acquired image is smaller compared to that when the traveling speed is a second speed that is lower than the first speed. | 07-24-2014 |
20150244920 | CONTROL OF EXPOSURE OF CAMERA - A device for controlling exposure of a camera is provided. An image of an area ahead of a vehicle is acquired by a camera provided in the vehicle. A traveling speed of the vehicle is acquired. An exposure area in the acquired image is set by a setting section, in which the exposure area is used for exposure control of the camera. By a calculating section, a control value for performing the exposure control is calculated based on pixel values of pixels included in the exposure area. The setting section changes a size of the exposure area based on the traveling speed, such that, when the traveling speed is a first speed, the size of the exposure area in the acquired image is smaller compared to that when the traveling speed is a second speed that is lower than the first speed. | 08-27-2015 |
Kojiro Akiba, Tokai-Shi JP
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20150329946 | GALVANNEALED STEEL SHEET AND METHOD OF MANUFACTURING THE SAME - A galvannealed steel sheet includes: a steel sheet; a coating layer on a surface of the steel sheet; and a mixed layer formed between the steel sheet and the coating layer, in which the mixed layer includes a base iron portion having fine grains having a size of greater than 0 μm and equal to or smaller than 2 μm, a Zn—Fe alloy phase, and oxides containing one or more types of Mn, Si, Al, and Cr, and in the mixed layer, the oxides and the Zn—Fe alloy phase are present in grain boundaries that form the fine grains and the Zn—Fe alloy phase is tangled with the base iron portion. | 11-19-2015 |
Mai Akiba, Atsugi JP
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20130341625 | Light Emitting Device, Driving Method of Light Emitting Device and Electronic Device - By controlling the luminance of light emitting element not by means of a voltage to be impressed to the TFT but by means of controlling a current that flows to the TFT in a signal line drive circuit, the current that flows to the light emitting element is held to a desired value without depending on the characteristics of the TFT. Further, a voltage of inverted bias is impressed to the light emitting element every predetermined period. Since a multiplier effect is given by the two configurations described above, it is possible to prevent the luminance from deteriorating due to a deterioration of the organic luminescent layer, and further, it is possible to maintain the current that flows to the light emitting element to a desired value without depending on the characteristics of the TFT. | 12-26-2013 |
20150041817 | LIGHT EMITTING DEVICE, DRIVING METHOD OF LIGHT EMITTING DEVICE AND ELECTRONIC DEVICE - By controlling the luminance of light emitting element not by means of a voltage to be impressed to the TFT but by means of controlling a current that flows to the TFT in a signal line drive circuit, the current that flows to the light emitting element is held to a desired value without depending on the characteristics of the TFT. Further, a voltage of inverted bias is impressed to the light emitting element every predetermined period. Since a multiplier effect is given by the two configurations described above, it is possible to prevent the luminance from deteriorating due to a deterioration of the organic luminescent layer, and further, it is possible to maintain the current that flows to the light emitting element to a desired value without depending on the characteristics of the TFT. | 02-12-2015 |
20160027815 | LIGHT EMITTING DEVICE, DRIVING METHOD OF LIGHT EMITTING DEVICE AND ELECTRONIC DEVICE - By controlling the luminance of light emitting element not by means of a voltage to be impressed to the TFT but by means of controlling a current that flows to the TFT in a signal line drive circuit, the current that flows to the light emitting element is held to a desired value without depending on the characteristics of the TFT. Further, a voltage of inverted bias is impressed to the light emitting element every predetermined period. Since a multiplier effect is given by the two configurations described above, it is possible to prevent the luminance from deteriorating due to a deterioration of the organic luminescent layer, and further, it is possible to maintain the current that flows to the light emitting element to a desired value without depending on the characteristics of the TFT. | 01-28-2016 |
Masaharu Akiba, Odawara-Shi JP
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20140029403 | OPTICAL INFORMATION RECORDING MEDIUM AND METHOD FOR RECORDING INFORMATION IN OPTICAL INFORMATION RECORDING MEDIUM - An optical information recording medium | 01-30-2014 |
Masahiro Akiba, Fort Lee, NJ US
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20090153873 | Optical Image Measuring Apparatus - Provided is an optical image measuring apparatus capable of obtaining a high-accuracy image without being influenced by a movement of an object to be measured. Flash light is emitted from a xenon lamp ( | 06-18-2009 |
20090153876 | OPTICAL IMAGE MEASUREMENT DEVICE - An optical image measurement device comprises: a light source configured to output a light having low temporal coherence and low spatial coherence; an optical system configured to split the light into a signal light and a reference light and superimpose the signal light having passed through a measured object and the reference light, thereby generating an interference light; a light receiver configured to receive the interference light and output an electric signal; and a forming part configured to form an image of the measured object based on the electric signal, wherein: the light receiver has a light receiving face on which a plurality of light receiving elements are arranged 2-dimensionally; and the optical system projects the interference light onto the light receiving face so that a size of the spatial coherent region of the interference light becomes equal to or larger than a size of the light receiving element. | 06-18-2009 |
Masahiro Akiba, Toda-Shi JP
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20150138502 | OPHTHALMOLOGIC IMAGING APPARATUS AND OPHTHALMOLOGIC IMAGE PROCESSING APPARATUS - An ophthalmologic imaging apparatus that can follow up imaging for acquiring a cross sectional image by referring to a front image of an eye acquired in the past and scanning the same position as before with light, includes: a photographing part configured to photograph the eye and acquire a front image thereof; a cross sectional image forming part configured to scan the eye with light and form a cross sectional image thereof; a storage configured to store a first front image of the eye and a second front image acquired in follow up imaging executed with referring to the first front image; an information obtaining part configured to analyze the first and second front images and obtain misregistration information between these front images; and a calculator configured to calculate an evaluation value of an error in a scanning position in the follow up imaging based on the misregistration information. | 05-21-2015 |
Masahiro Akiba, Toda-Shi, Saitama JP
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20150320308 | OPHTHALMOLOGIC IMAGING APPARATUS - An ophthalmologic imaging apparatus includes: a first optical system that applies an accommodation stimulus to a subject's eye; a tomographic image forming unit that includes a second optical system that splits light from a light source into signal light and reference light, and detects interference light between the signal light having travelled via the subject's eye and the reference light, and creates a tomographic image of the subject's eye based on a detection result of the interference light; and an analyzer that compares a first tomographic image with a second tomographic image to acquire change information indicating a change in a tissue of the subject's eye due to an accommodation stimulus change. The first and second tomographic images are respectively created by the tomographic image forming unit for the subject's eye, to which first and second accommodation stimuli are respectively applied by the first and second optical systems. | 11-12-2015 |
20160089020 | OPHTHALMOLOGIC IMAGING APPARATUS AND OPHTHALMOLOGIC IMAGE DISPLAY APPARATUS - An embodiment provides a new technique of ophthalmologic diagnostic imaging. An ophthalmologic imaging apparatus of an embodiment includes: an acquiring part configured to acquire three-dimensional image data of an eye by using optical coherence tomography; a designating part configured for designating partial image data that is a part of the three-dimensional image data corresponding to a specific site of the eye; a deforming part configured to deform the three-dimensional image data such that the partial image data is deformed into a predetermined shape to create new three-dimensional image data; a forming part configured to form cross-sectional image data based on the new three-dimensional image data; and a display controller configured to display an image based on the cross-sectional image data on a display means. | 03-31-2016 |
Rui Akiba, Hitachinaka-Shi JP
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20150043138 | ELECTRIC DEVICE - An electric device includes: a device body; and a frame guard. The device body has a plurality of surfaces for defining a three-dimensional configuration. The frame guard is configured to guard the device body. The frame guard is connected to the device body and disposed outside the device body. The plurality of surfaces is all disposed inside the frame guard. | 02-12-2015 |
Ryotaro Akiba, Yamagata JP
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20150325805 | TRANSISTOR ELEMENT - The present invention provides a transistor element having a laminated structure, the laminated structure comprising a sheet-like base electrode being arranged between an emitter electrode and a collector electrode; at least one p-type organic semiconductor layer being provided on each of the surface and the back sides of the base electrode; and a current transmission promotion layer being formed, on each of the surface and back sides of the base electrode, between the base electrode and the p-type organic semiconductor layer or layers provided on each of the surface and back sides of the base electrode. According to the present invention, it becomes possible to provide a transistor element (MBOT) that is, in particular, stably supplied through a simple production process, has a structure capable of being mass-produced, and has a large current modulation effect and an excellent ON/OFF ratio at a low voltage in the emitter electrode and the collector electrode. | 11-12-2015 |
Suminobu Akiba, Hokkaido JP
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20150123478 | POWER TRANSMISSION SYSTEM - A power transmission system, which has a plurality of DC power sources and a load that receives a supply of DC power, is characterized in that: a power priority retrieving device is attached to each DC power source; control is performed by a controller; and the amount of power to be delivered from a DC power source to which a power priority retrieving device is attached to the load is determined on the basis of the retrieved power priority. | 05-07-2015 |
20160111870 | SYSTEM FOR PREVENTING ARC DISCHARGE GENERATED DURING USE OF DC POWER SUPPLY - When using DC power supplies, turning off switches and unplugging from sockets can result in arc discharge, and when arc discharge occurs, heat is generated, which can cause damage to contacts, wiring of disconnection points to melt, and fires. In order to solve this problem, an object is to prevent inrush current when connecting a power supply, detect arc discharge generated when disconnecting direct current, and stop arc discharge over a short period of time. All of the loads that are connected to a DC power supply are equipped with a soft-start function that gradually and smoothly increases current so as to prevent current from flowing suddenly when connected to a power supply, and if a sudden drop in the power supply voltage is detected, an arc discharge is deemed to have occurred, and the flow of current from the power supply to the load is cut off immediately. | 04-21-2016 |
Takahisa Akiba, Tsuruoka-Shi JP
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20150014787 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME - A method for manufacturing a semiconductor device includes: forming a first insulation film on a portion of a first region of a semiconductor substrate and forming a second insulation film between a second region and a third region of the semiconductor substrate; etching an upper portion of the first insulation film such that the thickness of the first insulation film is less than the thickness of the second insulation film; forming a third insulation film in the second region and forming a fourth insulation film in the third region; and forming a first gate electrode on the first insulation film whose upper portion was etched, forming a second gate electrode on the third insulation film, and forming a third gate electrode on the fourth insulation film. | 01-15-2015 |
Takesada Akiba, Kodaira JP
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20140267206 | DRIVER IC - For each display line cycle, inputs to a pair of differential input terminals of a driving circuit are alternately switched in a cycle shorter than the display line cycle between a gradation voltage and a reference voltage. According to this, a chopping operation of switching polarities of offset appearing at the output of the driving circuit within one display line is performed for a plurality of times, and accordingly, a pixel of each display line maintains brightness information in which the chopping operation is already performed. As a result, although a frame cycle is lengthened, it is difficult to visually recognize a brightness difference caused by the offset. | 09-18-2014 |
Tomohiro Akiba, Toride-Shi JP
Patent application number | Description | Published |
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20160132260 | INFORMATION PROCESSING APPARATUS CAPABLE OF MOUNTING DATA STORAGE MEDIUM THAT STORES DATA - An information processing apparatus includes a setting storage unit configured to store a setting as to whether use of a data storage medium mounted to the information processing apparatus is permitted or prohibited, a control unit configured to control an access to the data storage medium based on the setting stored in the setting storage medium, an acceptance unit configured to accept an instruction for deleting data in the data storage medium, and a change unit configured to change, in response to the data in the data storage medium being deleted in accordance with the instruction accepted by the acceptance unit, the setting stored in the setting storage unit to indicate that the use of the data storage medium is prohibited. | 05-12-2016 |
Toshikatsu Akiba, Kisarazu JP
Patent application number | Description | Published |
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20150201808 | COOKING DEVICE - Provide a cooking device capable of processing food with a simple configuration while inhibiting oxidation of food and also inhibiting pressure inside a cooking container from rising excessively. | 07-23-2015 |
20150265428 | ASSIST CONTROL APPARATUS AND METHOD - According to one embodiment, an assist control apparatus includes a driving mechanism, an acquisition unit, an estimation unit and a drive unit. The driving mechanism is attached to a leg of a user. The acquisition unit is configured to acquire a status signal indicating a motion of an arm of the user. The estimation unit is configured to determine an assistance timing which is a timing for assisting an action of the user based on changes in the status signal. The drive unit is configured to drive the driving mechanism to generate an assistance power to assist the action of the user in accordance with the assistance timing. | 09-24-2015 |