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Akazawa, JP
Ayako Akazawa, Kyoto-Shi JP
| Patent application number | Description | Published |
|---|---|---|
| 20120126125 | DATA PROCESSING METHOD FOR NUCLEAR MEDICINE, AND A NUCLEAR MEDICINE DIAGNOSTIC APPARATUS - A PET apparatus and a processing method according in this invention carry out arithmetic processes in parallel, in steps S | 05-24-2012 |
Daisuke Akazawa, Kanagawa JP
| Patent application number | Description | Published |
|---|---|---|
| 20100291545 | ANTIBODY HAVING INHIBITORY ACTIVITY ON INFECTION WITH HEPATITIS C VIRUS (HCV) AND USE THEREOF - The objection of the invention is to provide an antibody that inhibits infection with hepatitis C virus (HCV). To this end, this invention provides an antibody that recognizes the hepatitis C virus (HCV) particle obtained from the hepatitis C virus (HCV) genome comprising the following (i) and (ii) ligated to each other as an antigen and has an inhibitory activity on infection with hepatitis C virus (HCV): (i) (a) the 5′-untranslated region, the core protein-encoding sequence, the E1 protein-encoding sequence, the E2 protein-encoding sequence, and the p7 protein-encoding sequence of the JFH-1 strain of the hepatitis C virus (HCV) or (b) the 5′-untranslated region, the core protein-encoding sequence, the E1 protein-encoding sequence, the E2 protein-encoding sequence, and the p7 protein-encoding sequence of the J6CF strain the hepatitis C virus (HCV); and (ii) the NS2 protein-encoding sequence, the NS3 protein-encoding sequence, the NS4A protein-encoding sequence, the NS4B protein-encoding sequence, the NS5A protein-encoding sequence, the NS5B protein-encoding sequence, and the 3′-untranslated region of the JFH-1 strain. | 11-18-2010 |
| 20110045020 | NUCLEIC ACID COMPRISING CHIMERIC GENE DERIVED FROM HEPATITIS C VIRUS - This invention provides infectious chimeric HCV particles that can be used for vaccines. This invention further provides a nucleic acid comprising a chimeric gene derived from the hepatitis C virus comprising regions each encoding Core protein, E1 protein, E2 protein and p7 protein derived from a hepatitis C virus strain other than JFH-1 strain; NS2 protein derived from JFH-1 strain or a hepatitis C virus strain other than JFH-1 strain, or a chimeric NS2 protein of NS2 protein derived from JFH-1 strain and NS2 protein derived from a hepatitis C virus strain other than JFH-1 strain; and NS3 protein, NS4A protein, NS4B protein, NS5A protein, and NS5B protein derived from JFH-1 strain in that order in 5′ to 3′ direction, wherein the 328th proline residue from the amino acid residue at N-terminus of the Core protein is substituted with an amino acid residue other than proline. This invention further provides chimeric HCV particles comprising such nucleic acid, and use of such HCV particles for vaccines. | 02-24-2011 |
Eiji Akazawa, Shizuoka-Ken JP
| Patent application number | Description | Published |
|---|---|---|
| 20090158919 | TONE SYNTHESIS APPARATUS AND METHOD - Either a tone generation priority mode or a quality priority mode can be set. If the currently-set mode is the tone generation priority mode when a connecting tone is to be generated for connecting between two successive notes, the joint-portion waveform data is selected for synthesis of the tone, stored head-portion waveform data and tail-portion waveform data are selected, and at least one of a pitch and amplitude of at least one of the head-portion waveform data and tail-portion waveform data is processed so as to provide a smoothly-varying connecting tone. In accordance with the processing, a tone of a fall portion of a temporally preceding one of two successive notes and a temporally succeeding one of the two successive notes are separately synthesized on the basis of the tail-portion waveform data and head-portion waveform data, respectively, so that a connecting tone is realized by a combination of the synthesized tone of the fall portion of the preceding note and the synthesized tone of the rise portion of the succeeding note. | 06-25-2009 |
Fumiaki Akazawa, Fukuoka JP
| Patent application number | Description | Published |
|---|---|---|
| 20100241907 | NETWORK MONITOR AND CONTROL APPARATUS - A network monitor and control apparatus for controlling the monitoring of a network are provided. The network monitor includes an error monitor including an error information gatherer for gathering error information of a monitor target apparatus; and a monitor result notifier for notifying of monitor results, wherein if there are N types of monitor target functions, the error monitor includes N error information gatherers for the respective N types of monitor target functions (N=1, 2, 3, . . . ) and wherein each of the N error information gatherers gathers the error information from one of an existing monitor target apparatus and a newly added monitor target apparatus on a per monitor target function basis. | 09-23-2010 |
| 20110231543 | Network management control program, network management control device, and network management control method - A network management control device includes a link information storing unit that stores information about connections between nodes belonging to respective networks that are controlled by different protocols. The network management control device receives an input of the configuration information about each of the networks. The network management control device then generates combined information between different protocols, based on the information stored in the link information storing unit about connections between nodes and the received network configuration information. After that, the network management control device performs provisioning in accordance with the generated combined information between the different protocols. | 09-22-2011 |
Hiroaki Akazawa, Kanagawa JP
| Patent application number | Description | Published |
|---|---|---|
| 20100294065 | TRANSMISSION OIL-PRESSURE CONTROL APPARATUS AND METHODS - A control apparatus of a vehicle transmission includes a hydraulic circuit configured to activate at least one friction element with a control pressure, a selector configured to select a range of the transmission, a valve configured to switch a transmission shifter, and a control unit configured to direct the valve to switch the transmission shifter in response to the selected transmission range and to reduce the control pressure prior to switching the transmission shifter. A method to control a vehicle transmission includes activating at least one friction element with a control pressure, selecting a desired range of the transmission, switching a transmission range in response to the selected desired transmission range, and reducing the control pressure prior to switching the transmission range. | 11-25-2010 |
| 20110010064 | SHIFT-BY-WIRE FAIL CONTROL DEVICE FOR VEHICLE WITH AUTOMATIC TRANSMISSION - A shifting apparatus includes an actuator to direct a travel range setting of a vehicle transmission, a selector to indicate a desired travel range setting, a transmission controller to move the actuator into the travel range setting in response to the desired travel range setting of the selector, and a restrictor to restrict an output of a drive motor if the vehicle transmission is in a travel range setting other than the desired travel range setting. A method to control a vehicle transmission includes detecting a travel range setting of the vehicle transmission, detecting a desired travel range setting of a selector, and entering a limp-home mode if the detected travel range setting is different from the desired travel range setting and a detected vehicle travel direction corresponding to the detected travel range setting is the same as a desired travel direction corresponding to the desired travel range setting. | 01-13-2011 |
Hiroyuki Akazawa, Tokyo JP
Ikuro Akazawa, Tokyo JP
| Patent application number | Description | Published |
|---|---|---|
| 20080224174 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME - A technology which allows an improvement in the moisture resistance of a semiconductor device is provided. In a GaAs substrate as a semi-insulating substrate, a HBT is formed in an element formation region, while an isolation region is formed in an insulating region. The isolation region formed in the insulating region is formed by introducing helium into the same semiconductor layers as the sub-collector semiconductor layer and collector semiconductor layer of the HBT. In an outer peripheral region, a conductive layer is formed to be exposed from protective films and coupled to a back surface electrode. Because a GND potential is supplied to the back surface electrode, the conductive layer is fixed to the GND potential. The conductive layer is formed of the same semiconductor layers as the sub-collector semiconductor layer and collector semiconductor layer of the HBT. | 09-18-2008 |
Kenzo Akazawa, Osaka JP
| Patent application number | Description | Published |
|---|---|---|
| 20110087128 | MUSCLE TONUS MEASURING APPARATUS - Forces applied to cause flexion and extension movements of a joint of a subject ( | 04-14-2011 |
Kiyoshi Akazawa, Shizuoka JP
| Patent application number | Description | Published |
|---|---|---|
| 20110175249 | Polyester monofilament, method for producing same, and method for producing screen gauze using same - There is provided a core-sheath bicomponent polyester monofilament, wherein a core component is composed of polyethylene terephthalate (PET) and a sheath component composed of PET having an intrinsic viscosity (IV) at least 0.2 lower than that of the core component, the polyester monofilament having a fineness of 3 to 8 dtex, a strength of 7.5 cN/dtex or more, a toughness (strength×elongation | 07-21-2011 |
Kohei Akazawa, Wako-Shi JP
| Patent application number | Description | Published |
|---|---|---|
| 20090127009 | HANDLE STRUCTURE OF WALK-BEHIND WORKING MACHINE - A handle structure of a walk-behind working machine includes: a handle having left and right raised portions extending upward from a handle frame and a cross portion interconnecting the left and right raised portions; and a main clutch lever shiftable from a clutch-OFF position to a clutch-ON position by being pivoted into pressed abutment against the cross portion. The main clutch lever is constructed in such a manner that, when the main clutch lever is in abutment against the cross portion, a space for allowing a human operator to grip the left and right raised portions is secured between the left and right raised portions and the main clutch lever. | 05-21-2009 |
Kohei Akazawa, Tokushima-Shi JP
| Patent application number | Description | Published |
|---|---|---|
| 20120065162 | N-N-SUBSTITUTED 3-AMINOPYRROLIDINE COMPOUNDS USEFUL AS MONOAMINES REUPTAKE INHIBITORS - The present invention provides a pyrrolidine compound of General Formula (1) | 03-15-2012 |
Kohei Akazawa, Tokushima JP
| Patent application number | Description | Published |
|---|---|---|
| 20090088406 | N,N-SUBSTITUTED 3-AMINOPYRROLIDINE COMPOUNDS USEFUL AS MONOAMINES REUPTAKE INHIBITORS - The present invention provides a pyrrolidine compound of General Formula (1) | 04-02-2009 |
Kohei Akazawa, Niigata-Shi JP
| Patent application number | Description | Published |
|---|---|---|
| 20080292208 | Image Processing Method, Image Processing Device and Recording Medium on Which Image Processing Program is Recorded - A method employing a statistic means to test whether or not luminance signals around a point of interest are distributed according to the same probability distribution with respect to luminance signals of respective pixels constituting the image; determining a range where the same probability distribution can be regarded as being satisfied, estimating the true luminance value of the point of interest by using the luminance data of the range. Especially when the image signals are faint to such an extent that the intensity of the luminance signal is based on the Poisson distribution, it is effective to perform a smoothing processing for each of the probability distributions of the signals and the noises by a test of a uniformity of the Poisson distribution, enabling a clear and denoised image to be obtained. | 11-27-2008 |
Koichi Akazawa, Hyogo JP
| Patent application number | Description | Published |
|---|---|---|
| 20100193090 | STEEL FOR MACHINE AND STRUCTURAL USE HAVING EXCELLENT MACHINABILITY AND PROCESS FOR PRODUCING THE SAME - The present invention provides a steel for machine and structural use which is capable of maintaining mechanical characteristics such as strength by reducing a S content as well as of exhibiting excellent machinability (particularly tool life) in intermittent cutting (such as hobbing) with the high speed tool, and a method useful for producing the steel for machine and structural use. The steel for machine and structural use according to the invention secures 0.002% or more of solute N in the steel and has a chemical composition which is appropriately adjusted and satisfies a relationship of the following expression (1): (0.1×[Cr]+[Al])/[O]≧150 . . . (1), in which [Cr], [Al], and [0] represent a Cr content (mass %), an Al content (mass %), and an O content (mass %), respectively. | 08-05-2010 |
| 20110229363 | STEEL FOR MACHINE AND STRUCTURAL USE HAVING EXCELLENT MACHINABILITY - The present invention provides a steel for machine and structural use which sustains mechanical properties such as strength by reducing S content, and exerts excellent machinability (in particular, tool life) in both of intermittent cutting with HSS tools and continuous cutting with carbide tools. The invention relates to a steel for machine and structural use which contains an oxide inclusion containing, wherein a total mass of an average composition of the oxide inclusions is 100%: CaO: 10 to 55 mass %; SiO | 09-22-2011 |
Koji Akazawa, Osaka JP
| Patent application number | Description | Published |
|---|---|---|
| 20100209670 | SHEET FOR PHOTOSEMICONDUCTOR ENCAPSULATION - The present invention relates to a sheet for photosemiconductor encapsulation having a release sheet and an encapsulating resin layer laminated thereon, in which the release sheet contains a concave-convex portion-forming layer having a concave shape and/or a convex shape, at an interface with the encapsulating resin layer, and the encapsulating resin layer has a convex shape fitted to the concave shape of the release sheet and/or a concave shape fitted to the convex shape of the release sheet at an interface with the release sheet. | 08-19-2010 |
| 20110079816 | OPTICAL-SEMICONDUCTOR ENCAPSULATING MATERIAL - The present invention relates to a sheet-shaped optical-semiconductor encapsulating material including: a first resin layer containing inorganic particles; and a second resin layer containing a phosphor and being superposed directly or indirectly on the first resin layer, and relates to a kit for optical-semiconductor encapsulation including: a sheet-shaped molded body including a first resin layer containing inorganic particles; and a sheet-shaped molded body including a second resin layer containing a phosphor. | 04-07-2011 |
| 20110079929 | KIT FOR OPTICAL SEMICONDUCTOR ENCAPSULATION - The present invention relates to a kit for optical semiconductor encapsulation including a liquid first encapsulating material containing inorganic particles and a liquid second encapsulating material containing a phosphor; a kit for optical semiconductor encapsulation including a sheet-shaped first encapsulating material containing inorganic particles and a liquid second encapsulating material containing a phosphor; and a kit for optical semiconductor encapsulation including a liquid first encapsulating material containing inorganic particles and a sheet-shaped second encapsulating material containing a phosphor. | 04-07-2011 |
| 20110186893 | OPTICAL-SEMICONDUCTOR DEVICE - The present invention relates to an optical-semiconductor device, which is prepared by: arranging a sheet for optical-semiconductor element encapsulation including an encapsulating resin layer capable of embedding an optical-semiconductor element and a wavelength conversion layer containing light wavelength-converting particles and being laminated directly or indirectly on the encapsulating resin layer, on an optical-semiconductor element-mounting substrate so that the encapsulating resin layer faces the optical-semiconductor element-mounting substrate; followed by compression-molding, in which the wavelength conversion layer is present on an upper part of a molded body in which the optical-semiconductor element is embedded therein, but is not present on a side surface of the molded body. | 08-04-2011 |
Kouji Akazawa, Ibaraki-Shi JP
| Patent application number | Description | Published |
|---|---|---|
| 20090014750 | RESIN FOR OPTICAL SEMICONDUCTOR ELEMENT ENCAPSULATION CONTAINING POLYBOROSILOXANE - The present invention relates to a resin for optical semiconductor element encapsulation containing a polyborosiloxane obtained by reacting a silicon compound with a boron compound; and an optical semiconductor device containing the resin and an optical semiconductor element encapsulated with the resin. The resin for optical semiconductor element encapsulation according to the invention exhibits an excellent advantage that it is excellent in all of heat resistance, transparency, and light resistance. | 01-15-2009 |
| 20090061549 | PROCESS FOR PRODUCING OPTICAL SEMICONDUCTOR DEVICE - The present invention relates to a process for producing an optical semiconductor device, the process including: disposing a sheet for optical-semiconductor-element encapsulation including a resin sheet A and a plurality of resin layers B discontinuously embedded in the resin sheet A and a plurality of optical semiconductor elements mounted on a substrate in such a way that each of the plurality of optical semiconductor elements faces either one of the plurality of resin layers B; and followed by embedding each of the plurality of optical semiconductor elements in either one of the plurality of resin layers B. According to the process of the invention, optical semiconductor elements can be embedded at once. As a result, an optical semiconductor device which is excellent in LED element protection and durability can be easily obtained. Consequently, the optical semiconductor device obtained can have a prolonged life. | 03-05-2009 |
| 20090242928 | RESIN SHEET FOR ENCAPSULATING OPTICAL SEMICONDUCTOR ELEMENT AND OPTICAL SEMICONDUCTOR DEVICE - The present invention provides a resin sheet for encapsulating an optical semiconductor element, the resin sheet containing an encapsulation resin layer, an adhesive resin layer, a metal layer and a protective resin layer, in which the encapsulation resin layer and the metal layer adhered onto the adhesive resin layer are disposed adjacently to each other, the protective resin layer is laminated on the encapsulation resin layer and the metal layer so as to cover both the encapsulation resin layer and the metal layer, and the encapsulation resin layer has a taper shape expanding toward the protective resin layer; and an optical semiconductor device containing an optical semiconductor element encapsulated by using the resin sheet. The optical semiconductor element encapsulation resin sheet of the invention can be suitably used for back lights of liquid crystal screens, traffic signals, large-sized outdoor displays, billboards and the like. | 10-01-2009 |
| 20100053960 | MICROLENS ARRAY - The present invention provides a microlens array produced by molding a resin obtained by reacting a silicon compound with a boron compound or an aluminum compound, in which the silicon compound is represented by the following formula (I): | 03-04-2010 |
Minoru Akazawa, Kawasaki-Shi JP
| Patent application number | Description | Published |
|---|---|---|
| 20110122440 | OPERATION APPARATUS, CONTROLLING METHOD AND STORAGE MEDIUM THEREFOR - An operation apparatus is detachable with respect to a plurality of image processing apparatuses and includes a display unit which can display a selection screen for selecting an image processing apparatus as an operation target from among the plurality of image processing apparatuses The operation apparatus includes a control unit configured to display the selection screen on the display unit if the operation apparatus is started up when the operation apparatus is not mounted on any of the plurality of image forming apparatuses, and establish communication with an image processing apparatus selected via the selection screen. The control unit does not display the selection screen on the display unit if the operation apparatus is started up when the operation apparatus is mounted on any of the plurality of image forming apparatuses, and establishes communication with the image processing apparatus on which the operation apparatus is mounted. | 05-26-2011 |
| 20120080948 | CONNECTION DEVICE FOR CONNECTING BETWEEN ELECTRICAL DEVICES - A connection device for connecting between a multifunction peripheral and USB devices. A hub unit is disconnectably connected to the multifunction peripheral via a first interface for enabling power supply from the multifunction peripheral to the hub unit. The hub unit is also disconnectably connected to the USB devices via a second interface for enabling power supply from the hub unit to the USB devices. A dedicated power supply connector is connected to a power supply section of the multifunction peripheral via wiring for enabling power supply from the multifunction peripheral to the hub unit. A hub circuit relays data between the multifunction peripheral and one of the USB host connectors of the hub unit. Power from the first interface to the hub circuit is supplied through a first power path, and power from the multifunction peripheral to the USB devices is supplied through a second power path. | 04-05-2012 |
Mitsuji Akazawa, Higashikagawa-Shi JP
| Patent application number | Description | Published |
|---|---|---|
| 20110003893 | AQUEOUS LOXOPROFEN-CONTAINING PATCHES - An aqueous loxoprofen-containing patch is provided, which has good stability and excellent transdermal absorption of loxoprofen. The aqueous patch includes loxoprofen or a salt thereof and triacetin. Specifically, the aqueous patch includes, based on the weight of the adhesive gel base, 0.1 to 5% by weight of loxoprofen or a salt thereof, 0.5 to 5% by weight of triacetin, 1 to 30% by weight of a water-soluble polymer, 0.01 to 5% by weight of a cross-linking agent, 10 to 90% by weight of purified water, and 0 to 20% by weight of an inorganic powder. | 01-06-2011 |
Miyuki Akazawa, Shinjuku-Ku JP
Moriaki Akazawa, Tokyo JP
| Patent application number | Description | Published |
|---|---|---|
| 20080293332 | POLISHING PAD AND METHOD OF POLISHING - A circular polishing pad has grooves formed on the surface in a spiral pattern with its center point offset from the center of the pad. The spiral pattern is an Archimedean spiral pattern or a parabolic spiral pattern. A target object is polished by using such a polishing pad without oscillating the platen to which the polishing pad is pasted or the polishing head that holds the target object. | 11-27-2008 |
Takashi Akazawa, Tokyo JP
| Patent application number | Description | Published |
|---|---|---|
| 20110280637 | CLEANING DEVICE AND IMAGE-FORMING DEVICE - A cleaning device comprises: a rotational brush disposed to touch an image holder and a lubricant, the brush which scrapes the lubricant and applies the scraped lubricant to the image holder, the brush including: a rotational axis; and a plurality of looped bristles disposed around the rotational axis, wherein a contact length of the bristles to the lubricant is longer than a contact length of the bristles to the image holder. | 11-17-2011 |
Takashi Akazawa, Musahimurayama JP
| Patent application number | Description | Published |
|---|---|---|
| 20090189256 | MANUFACTURING PROCESS OF SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE - After forming a ring-shaped trench penetrating through a semiconductor substrate from a rear surface side thereof and forming an insulating film inside the trench and on the rear surface of the semiconductor substrate, a through hole is formed in the insulating film and semiconductor substrate on an inner side of the ring-shaped trench from the rear surface side, thereby exposing a surface protection insulating film formed on a front surface of the semiconductor substrate at a bottom of the through hole. After removing the surface protection insulating film at the bottom of the through hole to form an opening to expose an element surface electrode, a contact electrode connected to the element surface electrode is formed on inner walls of the through hole and opening, and a pad electrode made of the same layer as the contact electrode is formed on the rear surface of the semiconductor substrate. | 07-30-2009 |
| 20110133336 | Semiconductor Wafer and Method of Manufacturing the Same and Method of Manufacturing Semiconductor Device - A semiconductor wafer comprising: a tubular trench formed at a position to form a through-hole electrode of a wafer; an insulating member buried inside the trench and on an upper surface of the trench; a gate electrode film and a metal film formed on an upper surface of the insulating member; a multilevel columnar wiring via formed on an upper surface of the metal film; and an external connection electrode formed electrically connected to the metal film via the multilevel columnar wiring via. In this manner, it is unnecessary to have a new process of dry etching to form a through-hole electrode after thinning the wafer and equipment development. Moreover, introduction of a specific design enables formation of through-hole electrodes with significantly reduced difficulties of respective processes. | 06-09-2011 |
Takashi Akazawa, Kanagawa JP
| Patent application number | Description | Published |
|---|---|---|
| 20120108055 | MANUFACTURING PROCESS OF SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE - After forming a ring-shaped trench penetrating through a semiconductor substrate from a rear surface side thereof and forming an insulating film inside the trench and on the rear surface of the semiconductor substrate, a through hole is formed in the insulating film and semiconductor substrate on an inner side of the ring-shaped trench from the rear surface side, thereby exposing a surface protection insulating film formed on a front surface of the semiconductor substrate at a bottom of the through hole. After removing the surface protection insulating film at the bottom of the through hole to form an opening to expose an element surface electrode, a contact electrode connected to the element surface electrode is formed on inner walls of the through hole and opening, and a pad electrode made of the same layer as the contact electrode is formed on the rear surface of the semiconductor substrate. | 05-03-2012 |
Takashi Akazawa, Musashimurayama JP
| Patent application number | Description | Published |
|---|---|---|
| 20090014843 | MANUFACTURING PROCESS AND STRUCTURE OF THROUGH SILICON VIA - A through silicon via reaching a pad from a second surface of a semiconductor substrate is formed. A penetration space in the through silicon via is formed of a first hole and a second hole with a diameter smaller than that of the first hole. The first hole is formed from the second surface of the semiconductor substrate to the middle of the interlayer insulating film. Further, the second hole reaching the pad from the bottom of the first hole is formed. Then, the interlayer insulating film formed on the first surface of the semiconductor substrate has a step shape reflecting a step difference between the bottom surface of the first hole and the first surface of the semiconductor substrate. More specifically, the thickness of the interlayer insulating film between the bottom surface of the first hole and the pad is smaller than that in other portions. | 01-15-2009 |
| 20090309218 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - When a through-hole electrode and a rear-surface wire are formed on a rear surface of a chip, a convex portion is formed on the rear surface of the chip due to a rear-surface wiring pad which is a part of the through-hole electrode and the rear-surface wire. This causes the air leakage when the chip is sucked, and therefore, the reduction of the sucking force of the chip occurs. A concave portion is formed in advance in a region where a rear-surface wiring pad and a rear-surface wire are formed. The rear-surface wiring pad and the rear-surface wire are provided inside the concave portion. Thus, a flatness of the rear surface of the chip is ensured by a convex portion caused by thicknesses of the rear-surface wiring pad and the rear-surface wire, so that the reduction of the sucking force does not occur when the chip is handled. | 12-17-2009 |
| 20100155940 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - In a semiconductor device in which a plurality of semiconductor chips are stacked, performance is enhanced without deteriorating productivity. The semiconductor device has a plurality of elements, an interlayer insulating film, a pad, and a bump electrode electrically connected with the pad sequentially formed on a main surface of a silicon substrate and has a back-surface electrode formed on a back surface of the silicon substrate and electrically connected with the bump electrode. The bump electrode has a protruding portion penetrating through the pad and protruding toward the silicon substrate side. The back-surface electrode is formed so as to reach the protruding portion of the bump electrode from the back surface side of the silicon substrate toward the main surface side and to cover the inside of a back-surface-electrode hole portion which does not reach the pad, so that the back-surface electrode is electrically connected with the bump electrode. | 06-24-2010 |
| 20100258948 | Semiconductor Wafer and Method of Manufacturing the Same and Method of Manufacturing Semiconductor Device - A semiconductor wafer comprising: a tubular trench formed at a position to form a through-hole electrode of a wafer; an insulating member buried inside the trench and on an upper surface of the trench; a gate electrode film and a metal film formed on an upper surface of the insulating member; a multilevel columnar wiring via formed on an upper surface of the metal film; and an external connection electrode formed electrically connected to the metal film via the multilevel columnar wiring via. In this manner, it is unnecessary to have a new process of dry etching to form a through-hole electrode after thinning the wafer and equipment development. Moreover, introduction of a specific design enables formation of through-hole electrodes with significantly reduced difficulties of respective processes. | 10-14-2010 |
| 20110233773 | MANUFACTURING PROCESS AND STRUCTURE OF THROUGH SILICON VIA - A through silicon via reaching a pad from a second surface of a semiconductor substrate is formed. A penetration space in the through silicon via is formed of a first hole and a second hole with a diameter smaller than that of the first hole. The first hole is formed from the second surface of the semiconductor substrate to the middle of the interlayer insulating film. Further, the second hole reaching the pad from the bottom of the first hole is formed. Then, the interlayer insulating film formed on the first surface of the semiconductor substrate has a step shape reflecting a step difference between the bottom surface of the first hole and the first surface of the semiconductor substrate. More specifically, the thickness of the interlayer insulating film between the bottom surface of the first hole and the pad is smaller than that in other portions. | 09-29-2011 |
| 20120091583 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - In a semiconductor device in which a plurality of semiconductor chips are stacked, performance is enhanced without deteriorating productivity. The semiconductor device has a plurality of elements, an interlayer insulating film, a pad, and a bump electrode electrically connected with the pad sequentially formed on a main surface of a silicon substrate and has a back-surface electrode formed on a back surface of the silicon substrate and electrically connected with the bump electrode. The bump electrode has a protruding portion penetrating through the pad and protruding toward the silicon substrate side. The back-surface electrode is formed so as to reach the protruding portion of the bump electrode from the back surface side of the silicon substrate toward the main surface side and to cover the inside of a back-surface electrode hole portion which does not reach the pad, so that the back-surface electrode is electrically connected with the bump electrode. | 04-19-2012 |
Teppei Akazawa, Fukui-Ken JP
| Patent application number | Description | Published |
|---|---|---|
| 20110018673 | ELECTRONIC COMPONENT - An electronic component includes a coil whose inductance changes in accordance with the magnitude of a current and in which abrupt reduction in the inductance due to magnetic saturation is suppressed. A stack formed by a plurality of stacked first magnetic layers includes a coil formed by coil electrodes connected to one another in the stack. A first nonmagnetic layer is arranged in such a manner as to cut across the coil. When viewed in a stacking direction, a second nonmagnetic layer is formed in a region outside of a region in which the coil is formed. The structure of the second nonmagnetic layer on the upper side of the first nonmagnetic layer in the stacking direction is different from a structure of the second magnetic layer on the lower side of the first nonmagnetic layer in the stacking direction. | 01-27-2011 |
Teruyuki Akazawa, Shiga JP
| Patent application number | Description | Published |
|---|---|---|
| 20080282693 | Stirling Engine - A high efficient stirling engine with excellent thermal efficiency, which can increase the heating temperature of a high temperature section, is obtained by preventing the heat from being lost in a member connecting the high temperature section and a low temperature section. | 11-20-2008 |
Tomoaki Akazawa, Kakogawa-City JP
| Patent application number | Description | Published |
|---|---|---|
| 20090297882 | Brazing filler metal, brazing filler metal paste, and heat exchanger - A brazing filler metal includes quaternary alloy powder and copper powder. The quaternary allow powder consists of from 0.1 to 27.4 mass percent tin, from 0.8 to 5.1 mass percent nickel, from 2.2 to 10.9 mass percent phosphorous and a balance including copper and any unavoidable impurity. The brazing filler metal can be used in a form of paste by being mixed with an organic binder and an organic solvent. The brazing filler metal and the brazing filler metal can be used for joining members made of copper or copper alloy, such as members of a heat exchanger. | 12-03-2009 |
Tomoaki Akazawa, Kakogawa-Shi JP
| Patent application number | Description | Published |
|---|---|---|
| 20090165893 | PASTE COMPOSITION FOR ALUMINUM BRAZING - A paste composition for aluminum brazing of the invention contains 40 to 65% by weight of a metal powder for brazing (a), 5 to 35% by weight of a fluoride type flux (b), 1 to 10% by weight of a methacrylic acid ester type polymer (c), and 10 to 40% by weight of an organic solvent (d); and the component (d) is a hydrocarbon type organic solvent having no aromatic ring and no hydroxyl group and the composition is in a paste-like state having a viscosity of 6,000 to 200,000 mPa·s at 23° C. and accordingly, the storage stability and applicability (practically, discharge property and pressure stability by using a dispenser) and brazing property can be improved in good balance. | 07-02-2009 |
Toshiyuki Akazawa, Sapporo-Shi JP
| Patent application number | Description | Published |
|---|---|---|
| 20090176184 | METHOD AND PULVERIZING APPARATUS FOR PREPARING PULVERIZED PRODUCT OF EXTRACTED TOOTH, DEMINERALIZED POWDER ORIGINATED FROM EXTRACTED TOOTH, AND COMPOSITE OF DEMINERALIZED POWDER AND APATITE, SUITABLE FOR USE IN HIGHLY ADVANCED MEDICAL TREATMENTS - [Problems] To provide a means and method for providing a pulverized extracted tooth product without causing the extracted teeth to lose their original properties. To provide a new material, originated from the pulverized extracted tooth product and imbued with new properties suited to the regeneration and the like of the alveolar bone. | 07-09-2009 |
Yasushi Akazawa, Akashi-Shi JP
| Patent application number | Description | Published |
|---|---|---|
| 20110118630 | ANKLE-FOOT ORTHOSIS PRESCRIPTION ASSISTIVE DEVICE - A measurement device ( | 05-19-2011 |
Yoshiaki Akazawa, Nara-Shi JP
| Patent application number | Description | Published |
|---|---|---|
| 20090004590 | TONER AND METHOD OF MANUFACTURING THE SAME, TWO-COMPONENT DEVELOPER, DEVELOPING DEVICE, AND IMAGE FORMING APPARATUS - in a toner at least containing a binder resin and a colorant, a value obtained by dividing a particle size D | 01-01-2009 |
| 20090029280 | TONER, METHOD OF MANUFACTURING THE SAME, TWO-COMPONENT DEVELOPER, DEVELOPING DEVICE, AND IMAGE FORMING APPARATUS - A toner includes toner particles containing at least binder resin and colorant. The toner particles contain a large-sized toner particle group of particles and a small-sized toner particle group of particles having a volume average particle size smaller than that of the large-sized toner particle group. In the toner, a volume average particle size D | 01-29-2009 |
| 20090098475 | TONER, METHOD OF MANUFACTURING THE SAME, TWO-COMPONENT DEVELOPER, DEVELOPING DEVICE, AND IMAGE FORMING APPARATUS - There are provided a toner, a method of manufacturing the toner, a two-component developer, a developing device, and an image forming apparatus, which are excellent in a charge rising property, environmental stability, and life stability during printing and which cause less fogging. The toner contains a core particle containing binder resin and colorant, and a coating layer which contains resin and a charge control agent and is formed on a surface of the core particle. At least a part of the resin contained in the coating layer is melt-bonded to the core particle, and the charge control agent is dispersed and immobilized in the coating layer. The dispersed charge control agent has a dispersion diameter of less than 1 μm. | 04-16-2009 |
| 20090142687 | TONER AND METHOD FOR MANUFACTURING THE TONER, TWO-COMPONENT DEVELOPER, DEVELOPING DEVICE AND IMAGE FORMING APPARATUS - A toner which takes into account preservation of the global environment and which is excellent in fixability and storage stability and moreover, good in light transmittance and a method for manufacturing the toner, a two-compartment developer, a developing device and an image forming apparatus are provided. In toner including at least a binder resin and a colorant, the binder resin includes a resin which is a major component and a biomass-containing crystalline resin; and the crystalline resin is contained in an amount of 1 part by weight or more and 50 parts by weight or less based on 100 parts by weight of the binder resin, and a melting point of the crystalline resin is higher by a temperature of from 5° C. to 10° C. than a temperature at which a loss modulus G″ of the toner at a frequency of 1 Hz is 10 | 06-04-2009 |
Yoshihiko Akazawa, Kyoto-Shi, JP
| Patent application number | Description | Published |
|---|---|---|
| 20090289211 | ELECTROLYTE SOLUTION FOR ELECTROCHEMICAL DEVICE AND ELECTROCHEMICAL DEVICE USING SAME - The present invention has for its object to provide an electrolyte solution which can dramatically suppress the time degradation in performance of an electrochemical device, especially an electrochemical capacitor. | 11-26-2009 |
Yoshiyuki Akazawa, Yokohama JP
| Patent application number | Description | Published |
|---|---|---|
| 20110211804 | VIDEO DISPLAY DEVICE - The present invention provides a video display device provided with a storage mechanism that reliably holds a recording medium (HDD) with the reduced number of components. A tray integrally stores an installed HDD built in the device and a cassette HDD attachable to and detachable from the device, and is mounted on a main chassis. An HDD stopper of a hook-like shape integrated with the tray presses an end part of the installed HDD to secure its storage position. An HDD holder integrated with the tray presses a side surface at an end part of the cassette HDD to prevent it from falling off the tray. Further, a regulating plate formed by cutting and raising the main chassis suppresses deformation of the HDD stopper, and an anti-falling plate prevents the installed HDD from falling off the tray. | 09-01-2011 |
Yuko Akazawa, Kanagawa JP
| Patent application number | Description | Published |
|---|---|---|
| 20110201014 | ANTIBODY BINDING TO ENVELOPE PROTEIN 2 OF HEPATITIS C VIRUS AND METHOD FOR IDENTIFYING GENOTYPE OF HEPATITIS C VIRUS USING THE SAME - The present invention provides an antibody that specifically binds to envelope protein 2 of HCV of genotype 2a but does not immunologically react with envelope protein 2 of HCV of genotype 1a. | 08-18-2011 |
Yumiko Akazawa, Kanagawa JP
| Patent application number | Description | Published |
|---|---|---|
| 20090149550 | WRINKLE REDUCTION AGENT, LIPOLYSIS ACCELERATOR, COMPOSITION FOR EXTERNAL USE ON SKIN, AND FOOD OR BEVERAGE COMPOSITION - An antiwrinkle agent, lipolysis promoter, external composition for skin, and food and beverage composition having for an active ingredient thereof a compound represented by general formula (1): | 06-11-2009 |