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Akaishi, Gunma

Minoru Akaishi, Gunma JP

Patent application numberDescriptionPublished
20080230899SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF - In a semiconductor device according to the present invention, a plurality of opening regions 09-25-2008
20080237853SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME - A conventional semiconductor device has a problem that reduction of a resistance value above a pad electrode is difficult because of an oxide film formed on a surface of the pad electrode. In a semiconductor device of this invention, an oxidation preventing metal layer is formed on a pad electrode, and the oxidation preventing metal layer is exposed at an opening region formed in a spin coat resin film at a portion above the pad electrode. In addition, a plating metal layer and a copper plated layer are formed on the oxidation preventing metal layer. With this structure, the resistance value above the pad electrode is reduced because the top surface of the pad electrode is difficult to oxidize, and the oxidation preventing metal layer having considerably smaller sheet resistivity than an oxidation film serves as part of a current path.10-02-2008
20080258301Semiconductor device and manufacturing method of the same - A conventional semiconductor device has a problem that reduction of a connection resistance value between wiring layers is difficult because of an oxide film formed between the wiring layers. In a semiconductor device of this invention, a first metal layer is embeded in opening regions which connect a first wiring layer and a second wiring layer and an opening is formed in a spin coated resin film formed on the first metal layer. In the opening, a Cr layer forming a plating metal layer and a Cu plated layer are connected to each other. With this structure, the spaces among crystal grains in portions in the Cr layer on the first metal layer are wide, which causes the portions to be coarse. In the coarse portions in the Cr layer, an alloy layer formed of the second metal layer and the Cu plated layer is formed, and thus, the connection resistance value is reduced.10-23-2008

Tetsuaki Akaishi, Gunma JP

Patent application numberDescriptionPublished
20090038545Liquid applicator - The present invention provides a liquid applicator which enables easy application of an application liquid even if it is high in viscosity and which can protect the application liquid held therein against the contamination by microbes etc. from the external air and the outside, and includes a liquid pressing means 02-12-2009
20090162130Viscous Cosmetic Item - A viscous cosmetic item is provided in which a viscous cosmetic material is contained in a push-out container capable of withdrawing a content is provided wherein the viscous cosmetic item is provided both a container shape capable of applying and manipulating the viscous cosmetic material effectively and a viscosity of the viscous cosmetic material which is suitable to that shape.06-25-2009
20090283033Liquid Applicator - A liquid applicator includes a liquid pressing mechanism (liquid pressing means) for pressurizing an application liquid inside a main body so as to supply application liquid to an applying member by the pressing of the liquid pressing mechanism. The applying member is made of an elastic material and is formed with a communication path of a passage hole for communication between the inside and outside of main body, and an applying portion of the applying member is formed projected further forward from an ejection opening of communication path. The liquid applicator that can simply apply an application liquid, even it is high in viscosity, over a wide area.11-19-2009
20090304431Cosmetic-Containing Applicator and Replacement Brush - A cosmetic-containing applicator. The applicator is mounted, at its tip end, with an applicator body in which a flange-shaped engagement part is formed at an outer periphery at a rear end of a fiber bundle, comprising an accommodating part accommodating liquid cosmetics, a tip casing mounted on a tip end side of the accommodating part and formed with an insertion hole in which the applicator body (12-10-2009
20100232866 LIQUID APPLICATOR - A liquid applicator 09-16-2010