Aji
Abulimiti Aji, Atlanta, GA US
Patent application number | Description | Published |
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20120323839 | ENTITY RECOGNITION USING PROBABILITIES FOR OUT-OF-COLLECTION DATA - A classifier that disambiguates among entities based on a dictionary, such as corpus of documents about those entities, is built by incorporating probabilities that an entity exists that is not in the dictionary. Given a document it is associated by the classifier with an entity. By incorporating out of collection probabilities into the classifier, a higher level of confidence in the match between an entity and a document is achieved. | 12-20-2012 |
Bimas Winahyu Aji, Singapore SG
Patent application number | Description | Published |
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20140254042 | DYNAMIC ALLOCATION OF LBA TO UN-SHINGLED MEDIA PARTITION - In a shingled magnetic recording system, LBA can be dynamically allocated to an un-shingled media partition (UMP) based on a usage metric. In one implementation, the usage metric depends upon the frequency of writes to storage region and/or upon how recently the storage location has been written to. Data corresponding to one or more LBA ranges within a shingled data region may be rewritten to a storage region within a UMP on the disk. | 09-11-2014 |
Parthasarathy M. Aji, Raleigh, NC US
Patent application number | Description | Published |
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20100058364 | APPLICATION PROGRAMMING INTERFACE ENHANCEMENT - Some embodiments of application programming interface (API) enhancement in a networked system have been presented. In one embodiment, a servlet is initialized on a centralized server in the networked system. The capabilities of an application programming interface (API) accessible by the client are expanded to allow the client to have data converted to a predetermined format when executing an automation script in order to perform an administrative task on multiple computing machines in the networked system without user intervention. | 03-04-2010 |
Prashant Aji, San Jose, CA US
Patent application number | Description | Published |
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20080264905 | METHODS AND SYSTEMS FOR MEASURING A CHARACTERISTIC OF A SUBSTRATE OR PREPARING A SUBSTRATE FOR ANALYSIS - Methods and systems for measuring a characteristic of a substrate or preparing a substrate for analysis are provided. One method for measuring a characteristic of a substrate includes removing a portion of a feature on the substrate using an electron beam to expose a cross-sectional profile of a remaining portion of the feature. The feature may be a photoresist feature. The method also includes measuring a characteristic of the cross-sectional profile. A method for preparing a substrate for analysis includes removing a portion of a material on the substrate proximate to a defect using chemical etching in combination with an electron beam. The defect may be a subsurface defect or a partially subsurface defect. Another method for preparing a substrate for analysis includes removing a portion of a material on a substrate proximate to a defect using chemical etching in combination with an electron beam and a light beam. | 10-30-2008 |
20120113416 | OPTICAL DEFECT AMPLIFICATION FOR IMPROVED SENSITIVITY ON PATTERNED LAYERS - A method for wafer defect inspection may include, but is not limited to: providing an inspection target; applying at least one defect inspection enhancement to the inspection target; illuminating the inspection target including the at least one inspection enhancement to generate one or more inspection signals associated with one or more features of the inspection target; detecting the inspection signals; and generating one or more inspection parameters from the inspection signals. An inspection target may include, but is not limited to: at least one inspection layer; and at least one inspection enhancement layer. | 05-10-2012 |
20140291516 | Methods and Systems for Measuring a Characteristic of a Substrate or Preparing a Substrate for Analysis - Methods and systems for measuring a characteristic of a substrate or preparing a substrate for analysis are provided. One method for measuring a characteristic of a substrate includes removing a portion of a feature on the substrate using an electron beam to expose a cross-sectional profile of a remaining portion of the feature. The feature may be a photoresist feature. The method also includes measuring a characteristic of the cross-sectional profile. A method for preparing a substrate for analysis includes removing a portion of a material on the substrate proximate to a defect using chemical etching in combination with an electron beam. The defect may be a subsurface defect or a partially subsurface defect. Another method for preparing a substrate for analysis includes removing a portion of a material on a substrate proximate to a defect using chemical etching in combination with an electron beam and a light beam. | 10-02-2014 |
Prashant A. Aji, San Jose, CA US
Patent application number | Description | Published |
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20120316855 | Using Three-Dimensional Representations for Defect-Related Applications - Various embodiments for using three-dimensional representations for defect-related applications are provided. | 12-13-2012 |
20150370175 | IN-LINE WAFER EDGE INSPECTION, WAFER PRE-ALIGNMENT, AND WAFER CLEANING - Disclosed are methods and apparatus for inspecting and processing semiconductor wafers. The system includes an edge detection system for receiving each wafer that is to undergo a photolithography process. The edge detection system comprises an illumination channel for directing one or more illumination beams towards a side, top, and bottom edge portion that are within a border region of the wafer. The edge detection system also includes a collection module for collecting and sensing output radiation that is scattered or reflected from the edge portion of the wafer and an analyzer module for locating defects in the edge portion and determining whether each wafer is within specification based on the sensed output radiation for such wafer. The photolithography system is configured for receiving from the edge detection system each wafer that has been found to be within specification. The edge detection system is coupled in-line with the photolithography system. | 12-24-2015 |
Srinivas Mandayam Aji, Bangalore IN
Patent application number | Description | Published |
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20090150988 | Authenticated service virtualization - Virtualizing a service is disclosed. A request to access a service from a first server is received from a client. A secret data associated with the first server is used to process the received request. The processed request is sent to a second server. The first and second servers are associated with a virtualization; and wherein the processed request can be used by the second server to authenticate the client. | 06-11-2009 |
Sudarshan Mandayam Aji, Alexandria, VA US
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20160141869 | DEMAND RESPONSE DEVICE - Aspects of the subject technology relate to a demand response device that is configured to receive comparison report information from a notification system, wherein the notification system is configured to execute steps including receiving at least one temperature report for each of a plurality of demand response devices, and identifying two or more demand response devices that share a common geographic location. In some aspects, a notification system of the subject technology can be further configured for generating a comparison report, wherein the comparison report is based on the ambient temperature information and the geolocation data for at least two of the plurality of demand response devices. | 05-19-2016 |