Inventors list |
Assignees list |
Classification tree browser |
Top 100 Inventors |
Top 100 Assignees |
Ahn, Incheon
Bo-Kyoung Ahn, Incheon KR
| Patent application number | Description | Published |
|---|---|---|
| 20080241990 | METHOD FOR MANUFACTURING ORGANIC THIN FILM TRANSISTOR SUBSTRATE - A method for manufacturing an organic thin film transistor substrate comprising forming a gate electrode on a substrate, forming a gate insulating layer on the gate electrode, defining a channel region on the gate insulating layer between a source electrode and a drain electrode, neutralizing the channel region, forming a bank insulating layer on the source electrode and the drain electrode, and forming an organic semiconductor layer in a region prepared by the bank insulating layer. | 10-02-2008 |
| 20090180044 | THIN FILM TRANSISTOR SUBSTRATE, LIQUID CRYSTAL DISPLAY HAVING THE SAME, AND METHOD OF MANUFACTURING THE SAME - A thin film transistor substrate includes a gate line arranged on a substrate, a data line arranged to cross the gate line, an organic thin film transistor including a gate electrode connected to the gate line, a source electrode connected to the data line, a drain electrode spaced apart from the source electrode, and an organic semiconductor layer forming a channel between the source electrode and the drain electrode, a pixel electrode connected to the drain electrode, and an organic passivation layer to protect the organic semiconductor layer and to receive a white light and transmit a colored light. | 07-16-2009 |
| 20100128190 | Liquid Crystal Display and Manufacturing Method of the Same - Disclosed is a liquid crystal display including a first substrate, a second substrate facing the first substrate, a thin film transistor formed on the first substrate and including a semiconductor layer, a convex pattern formed on the semiconductor layer and provided at a side surface thereof with a concave-convex section, and a liquid crystal layer interposed between the first and second substrates. | 05-27-2010 |
| 20100308326 | THIN-FILM TRANSISTOR ARRAY PANEL AND METHOD OF FABRICATING THE SAME - A thin-film transistor array panel includes: an insulating substrate; an oxide semiconductor layer that is formed on the insulating substrate and includes a metal inorganic salt and zinc acetate; a gate electrode overlapping with the oxide semiconductor layer; a gate insulating film that is interposed between the oxide semiconductor layer and the gate electrode; and a source electrode and a drain electrode that at least partially overlap the oxide semiconductor layer and are separated from each other. | 12-09-2010 |
| 20110100546 | METHOD OF FORMING A LIQUID CRYSTAL LAYER, METHOD OF MANUFACTURING A LIQUID CRYSTAL DISPLAY PANEL USING THE METHOD, AND LIQUID CRYSTAL MATERIAL USED IN THE METHOD - A liquid crystal layer is formed by coating a liquid crystal material having a reciprocal (Z | 05-05-2011 |
Byung Woo Ahn, Incheon KR
| Patent application number | Description | Published |
|---|---|---|
| 20100010142 | COMPOSITION OF POLYPROPYLENE RESIN HAVING LOW SHRINKAGE AND DIMENSIONAL STABILITY - The present invention relates to polypropylene-based composite resin composition for an automotive interior trim. The polypropylene-based composite resin composition herein has relatively high rigidity and surface impact and relatively low molding shrinkage and coefficient of linear expansion, thus having superior dimensional stability. | 01-14-2010 |
| 20110130487 | POLYPROPYLENE RESIN COMPOSITION FOR CREATING FABRIC TEXTURE - According to preferred aspects, the present invention provides a polypropylene resin composition for creating a fabric texture, the polypropylene resin composition comprising: a polypropylene resin containing at least two selected from the group consisting of a homopolypropylene, a propylene-ethylene copolymer, and a high crystalline polypropylene (HCPP); a polypropylene elastomer; an ethylene-α-olefin copolymer; an inorganic filler; a cellulose fiber; and a volcanic rock. A molded product prepared using the polypropylene resin composition of the present invention has matt properties, do not cause odor due to their excellent VOC adsorption capabilities, and have excellent properties such as low temperature impact resistance, scratch resistance, etc. | 06-02-2011 |
Ho Nam Ahn, Incheon KR
| Patent application number | Description | Published |
|---|---|---|
| 20080275647 | SYSTEM FOR GUIDING AN OBSTACLE AVOIDANCE DIRECTION INCLUDING SENSES FOR SUPERSONIC WAVES - An obstacle avoidance system having an ultrasonic sensor is provided. The system includes an ultrasonic sensor array having at least one ultrasonic sensor for measuring a distance to an obstacle using an ultrasonic wave, an orientation tracker for tracking a proceeding direction, an controller for receiving distance data and orientation data from the ultrasonic sensor array and the orientation tracker, respectively, and for determining an avoidance orientation based on the distance data and the orientation data, and an avoidance orientation guiding unit for informing the pedestrian of the avoidance orientation determined by the controller. The controller stores distance data for a certain number of previous frames and, if the controller determines that distance data of a first frame is noise, the distance data of the first frame is replaced with an average between the distance data of a frame prior to the first frame and the distance data of a frame after the first frame. Also, the controller calculates an amount of orientation change for a second frame using the orientation data of the orientation tracker and regards the distance data of the second frame as noise, if the calculated amount of orientation change is greater than a threshold. | 11-06-2008 |
Ho Sik Ahn, Incheon KR
| Patent application number | Description | Published |
|---|---|---|
| 20090197360 | LIGHT EMITTING DIODE PACKAGE AND FABRICATION METHOD THEREOF - An LED package and a fabrication method therefor. The LED package includes first and second lead frames made of heat and electric conductors, each of the lead frames comprising a planar base and extensions extending in opposed directions and upward directions from the base. The package also includes a package body made of a resin and configured to surround the extensions of the first and second lead frames to fix the first and second lead frames while exposing underside surfaces of the first and second lead frames. The LED package further includes a light emitting diode chip disposed on an upper surface of the base of the first lead frame and electrically connected to the bases of the first and second lead frames, and a transparent encapsulant for encapsulating the light emitting diode chip. | 08-06-2009 |
| 20110031526 | LIGHT EMITTING DIODE PACKAGE AND FABRICATION METHOD THEREOF - An LED package and a fabrication method therefor. The LED package includes first and second lead frames made of heat and electric conductors, each of the lead frames comprising a planar base and extensions extending in opposed directions and upward directions from the base. The package also includes a package body made of a resin and configured to surround the extensions of the first and second lead frames to fix the first and second lead frames while exposing underside surfaces of the first and second lead frames. The LED package further includes a light emitting diode chip disposed on an upper surface of the base of the first lead frame and electrically connected to the bases of the first and second lead frames, and a transparent encapsulant for encapsulating the light emitting diode chip. | 02-10-2011 |
| 20110122600 | SLIM TYPE BACKLIGHT UNIT WITH THROUGH-HOLE ADHESIVE HEAT DISSIPATING MEANS - A backlight unit of the invention is reduced in thickness, weight and manufacturing costs but improved in heat releasing efficiency. In the backlight unit, a flexible printed circuit board has at least one through hole perforated therein. An LED package is disposed on a top portion of the flexible printed circuit board corresponding to the through hole. The backlight unit of the invention employs the flexible printed circuit board in place of a metal printed circuit board as a means to conduct current to the LED package. This produces a slimmer and lighter backlight unit and also saves manufacturing costs. In addition, the LED package is directly bonded onto a bottom plate by a heat conducting adhesive, thereby ensuring heat generated from the LED package to be released more quickly. | 05-26-2011 |
Jae Gu Ahn, Incheon KR
| Patent application number | Description | Published |
|---|---|---|
| 20110020180 | Batch Chemical Analyzer - A batch chemical analyzer is disclosed, the analyzer including a reaction tank ( | 01-27-2011 |
Jong Duk Ahn, Incheon KR
| Patent application number | Description | Published |
|---|---|---|
| 20110287908 | EXERCISING DEVICE FOR LOWER-BODY - Provided is an exercise device for a lower body capable of simultaneously performing anaerobic exercise for leg muscle strengthening and stretching and aerobic exercise such as cycle pedal exercise. The exercise device for a lower body includes a pair of base bars | 11-24-2011 |
Min-Jung Ahn, Incheon KR
| Patent application number | Description | Published |
|---|---|---|
| 20090030181 | Peptides for Inhibiting MDM2 Function - Disclosed are peptides for inhibiting mdm2 (mouse double minute 2) and a pharmaceutical composition comprising the same. | 01-29-2009 |
Phil-Sang Ahn, Incheon KR
| Patent application number | Description | Published |
|---|---|---|
| 20100274003 | ACID ADDITION SALTS OF SYNTHETIC INTERMEDIATES FOR CARBAPENEM ANTIBIOTICS AND PROCESSES FOR PREPARING THE SAME - The present invention provides a process for preparing an acid addition salt of a synthetic intermediate for carbapenem antibiotics and a novel acid addition salt of a synthetic intermediate for carbapenem antibiotics obtained from the process. The present invention also provides a process for preparing a carbapenem antibiotic using the acid addition salt. According to the process of the present invention, an acid addition salt of a synthetic intermediate for carbapenem antibiotics can be prepared in a high yield and high purity, without conducting column chromatography. Thus, the process of the present invention can be applied to mass production with an industrial scale. Furthermore, since the acid addition salts have solid forms, they are easy to handle and keep in a manufacturing site. | 10-28-2010 |
Sang-Bin Ahn, Incheon KR
| Patent application number | Description | Published |
|---|---|---|
| 20110171800 | METHOD OF FORMING SEMICONDUCTOR DEVICES WITH BURIED GATE ELECTRODES AND DEVICES FORMED BY THE SAME - A polycrystalline semiconductor layer is formed on a cell active region and a peripheral active region of a substrate. A buried gate electrode is formed in the substrate in the cell active region at a level below the polycrystalline semiconductor layer after forming the polycrystalline semiconductor layer. A gate electrode is formed on the substrate in the peripheral active region from the polysilicon semiconductor layer after forming the buried gate electrode. | 07-14-2011 |